XCV150-4BG352C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 260 49152 3888 352-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 263 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 352-MBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-LBGA Exposed Pad, Metal | Number of I/O | 260 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 864 | Number of Logic Elements/Cells | 3888 | ||
| Number of Gates | 164674 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of XCV150-4BG352C – Virtex Field Programmable Gate Array (FPGA), 352-LBGA, 260 I/Os
The XCV150-4BG352C from AMD is a Virtex-series SRAM-based FPGA delivering a balance of logic capacity, embedded memory and high I/O density for commercial embedded designs. The device provides 3,888 logic elements, approximately 49 kbits of on-chip RAM, and 260 user I/Os in a 352-LBGA exposed-pad metal package.
Engineered for in-system reconfigurability and complex I/O interfacing, the XCV150-4BG352C supports multi-standard I/O, on-chip clock-management resources, and a hierarchical memory architecture that help accelerate prototyping and custom logic implementations. It is specified for a 2.375 V to 2.625 V supply and commercial operating temperatures from 0 °C to 85 °C, and it is RoHS compliant.
Key Features
- Logic Capacity 3,888 logic elements and approximately 164,674 system gates for medium-density programmable logic implementations.
- Embedded Memory Total on-chip RAM of 49,152 bits, with LUTs and block RAM configurable for various synchronous RAM and shift-register functions.
- I/O and SelectIO™ 260 user I/O pins with multi-standard SelectIO support for flexible interface compatibility and direct connection to compatible memory devices.
- Clock and Timing Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets for advanced clock control.
- Dedicated Arithmetic and Routing Dedicated carry logic, multiplier support and cascade chains to support high-speed arithmetic and wide-input functions.
- In-System Configuration SRAM-based architecture enabling unlimited re-programmability with four programming modes for in-system configuration and development flexibility.
- Package and Mounting 352-LBGA exposed pad metal package (352-MBGA, 35×35) designed for surface-mount assembly and thermal performance.
- Supply and Temperature Voltage supply range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C.
- Manufacturing and Quality Fabricated on a 0.22 μm, 5-layer metal process and 100% factory tested; RoHS compliant.
Typical Applications
- PCI and Compact PCI systems 66‑MHz PCI compliance and hot‑swap support make the device suitable for PCI-based board designs and Compact PCI implementations that require reconfigurable logic.
- In-system prototyping and development SRAM-based reprogrammability and multiple configuration modes allow iterative design cycles and rapid prototyping of custom logic.
- Custom embedded processing High logic element count, dedicated arithmetic resources and flexible on-chip memory support custom datapath and control functions in embedded products.
Unique Advantages
- Balanced Logic and Memory: 3,888 logic elements paired with approximately 49 kbits of embedded RAM provides a practical mix of compute and storage for medium-complexity designs.
- High I/O Density: 260 user I/Os reduce the need for external interface circuitry when connecting to peripherals and external memories.
- Advanced Clock Management: Multiple DLLs and hierarchical clock nets simplify timing control for designs with diverse clock domains.
- Flexible Configuration: SRAM-based in-system configuration enables repeated reprogramming and multiple programming modes to support development and field updates.
- Commercial Temperature and RoHS Compliance: Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing for mainstream commercial applications.
Why Choose XCV150-4BG352C?
The XCV150-4BG352C is positioned for designers who need a commercially graded, medium-density FPGA with a strong combination of logic resources, on-chip memory and high I/O count in a compact 352-LBGA package. Its clock-management features, dedicated arithmetic resources and in-system programmability support a broad set of custom embedded and PCI-based applications.
With AMD-backed Virtex architecture, a production-tested manufacturing process and RoHS compliance, the XCV150-4BG352C offers a reliable platform for iterate-and-deploy development cycles where reconfigurability and interface flexibility are important.
Request a quote or submit an inquiry to receive pricing and availability information for XCV150-4BG352C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








