XCV150-4BG352C

IC FPGA 260 I/O 352MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 49152 3888 352-LBGA Exposed Pad, Metal

Quantity 263 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-4BG352C – Virtex Field Programmable Gate Array (FPGA), 352-LBGA, 260 I/Os

The XCV150-4BG352C from AMD is a Virtex-series SRAM-based FPGA delivering a balance of logic capacity, embedded memory and high I/O density for commercial embedded designs. The device provides 3,888 logic elements, approximately 49 kbits of on-chip RAM, and 260 user I/Os in a 352-LBGA exposed-pad metal package.

Engineered for in-system reconfigurability and complex I/O interfacing, the XCV150-4BG352C supports multi-standard I/O, on-chip clock-management resources, and a hierarchical memory architecture that help accelerate prototyping and custom logic implementations. It is specified for a 2.375 V to 2.625 V supply and commercial operating temperatures from 0 °C to 85 °C, and it is RoHS compliant.

Key Features

  • Logic Capacity  3,888 logic elements and approximately 164,674 system gates for medium-density programmable logic implementations.
  • Embedded Memory  Total on-chip RAM of 49,152 bits, with LUTs and block RAM configurable for various synchronous RAM and shift-register functions.
  • I/O and SelectIO™  260 user I/O pins with multi-standard SelectIO support for flexible interface compatibility and direct connection to compatible memory devices.
  • Clock and Timing  Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets for advanced clock control.
  • Dedicated Arithmetic and Routing  Dedicated carry logic, multiplier support and cascade chains to support high-speed arithmetic and wide-input functions.
  • In-System Configuration  SRAM-based architecture enabling unlimited re-programmability with four programming modes for in-system configuration and development flexibility.
  • Package and Mounting  352-LBGA exposed pad metal package (352-MBGA, 35×35) designed for surface-mount assembly and thermal performance.
  • Supply and Temperature  Voltage supply range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C.
  • Manufacturing and Quality  Fabricated on a 0.22 μm, 5-layer metal process and 100% factory tested; RoHS compliant.

Typical Applications

  • PCI and Compact PCI systems  66‑MHz PCI compliance and hot‑swap support make the device suitable for PCI-based board designs and Compact PCI implementations that require reconfigurable logic.
  • In-system prototyping and development  SRAM-based reprogrammability and multiple configuration modes allow iterative design cycles and rapid prototyping of custom logic.
  • Custom embedded processing  High logic element count, dedicated arithmetic resources and flexible on-chip memory support custom datapath and control functions in embedded products.

Unique Advantages

  • Balanced Logic and Memory:  3,888 logic elements paired with approximately 49 kbits of embedded RAM provides a practical mix of compute and storage for medium-complexity designs.
  • High I/O Density:  260 user I/Os reduce the need for external interface circuitry when connecting to peripherals and external memories.
  • Advanced Clock Management:  Multiple DLLs and hierarchical clock nets simplify timing control for designs with diverse clock domains.
  • Flexible Configuration:  SRAM-based in-system configuration enables repeated reprogramming and multiple programming modes to support development and field updates.
  • Commercial Temperature and RoHS Compliance:  Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing for mainstream commercial applications.

Why Choose XCV150-4BG352C?

The XCV150-4BG352C is positioned for designers who need a commercially graded, medium-density FPGA with a strong combination of logic resources, on-chip memory and high I/O count in a compact 352-LBGA package. Its clock-management features, dedicated arithmetic resources and in-system programmability support a broad set of custom embedded and PCI-based applications.

With AMD-backed Virtex architecture, a production-tested manufacturing process and RoHS compliance, the XCV150-4BG352C offers a reliable platform for iterate-and-deploy development cycles where reconfigurability and interface flexibility are important.

Request a quote or submit an inquiry to receive pricing and availability information for XCV150-4BG352C.

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