XCV150-4FG456C

The XCV150-4FG456C is an SRAM-based Virtex FPGA providing a balance of logic capacity, on-chip memory and high-density I/O in a 456-ball BGA package. The device integrates 3,888 logic elements (864 CLBs), approximately 49 kbits of embedded RAM (49,152 total RAM bits) and 260 user I/Os, making it suitable for designs that require reprogrammable, high-performance programmable logic and flexible interfacing.

Built on a 0.22 µm, 5-layer-metal CMOS process and offered as a commercial-grade, RoHS-compliant component, this device supports in-system configuration and multiple programming modes for field updates and rapid prototyping.

Key Features

• Logic Capacity — 3,888 logic elements across 864 CLBs and approximately 164,674 system gates, providing a moderate-density fabric for custom logic and control functions.
• On-chip Memory — 49,152 total RAM bits of embedded memory with configurable LUT-based RAM and block RAM options for data buffering and small on-chip storage.
• I/O and Interface Support — 260 user I/O pins and multi-standard SelectIO™ support with 16 high-performance interface standards, enabling direct connections to a variety of external devices including ZBTRAM.
• Clocking and Timing — Four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets to support advanced clock control and low-skew routing for synchronous designs.
• Arithmetic and Logic Resources — Dedicated carry logic and multiplier support with cascade chains for implementing high-speed arithmetic and wide-input functions.
• Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and four supported programming modes for design iteration and field updates.
• System and Test — IEEE 1149.1 boundary-scan support and a die-temperature sensor diode; devices are 100% factory tested.
• Package and Power — Surface-mount 456-BBGA package (456-FBGA, 23×23) with a supply voltage range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 85 °C.
• Process Technology — Implemented in a 0.22 µm, 5-layer-metal CMOS process for consistent manufacturing and density characteristics.

Typical Applications

• PCI and Compact PCI systems — Supports 66-MHz PCI compliance and hot-swappability for Compact PCI, enabling use in PCI-based boards and expansion modules.
• Memory interface and bridging — Multi-standard SelectIO and fast external RAM interfacing make the device suitable for memory controllers, RAM bridges, and buffering logic.
• In-system reconfigurable systems and prototyping — SRAM-based configuration with unlimited re-programmability and multiple programming modes supports iterative development, field upgrades and prototype validation.
• Custom logic and arithmetic acceleration — Dedicated carry chains and multiplier support enable implementation of arithmetic blocks, DSP functions and custom control logic.

Unique Advantages

• Reprogrammable flexibility: SRAM-based in-system configuration with unlimited re-programmability and four programming modes simplifies iterative design and field updates.
• Balanced logic and memory: 3,888 logic elements combined with approximately 49 kbits of embedded RAM provides a useful mix of resources for control logic, buffering and small data stores.
• Extensive I/O capability: 260 I/Os and multi-standard SelectIO support enable broad interfacing options and direct connections to specialized memories like ZBTRAM.
• Robust clocking resources: Four dedicated DLLs and multiple global/local clock nets support complex timing domains and low-skew synchronous designs.
• Proven silicon and test coverage: 0.22 µm, 5-layer-metal process and 100% factory testing provide predictable manufacturing behavior and device-level quality assurance.
• Compact, surface-mount packaging: 456-BBGA (23×23) package allows high-density board integration while maintaining a wide I/O count.

Why Choose XCV150-4FG456C?

The XCV150-4FG456C delivers a pragmatic combination of logic density, embedded RAM and expansive I/O in a reprogrammable Virtex FPGA. Its architecture—featuring dedicated arithmetic resources, flexible memory configurations and robust clocking—fits designs that require mid-range gate counts, significant interface capacity and the ability to update logic in-system.

As a commercial-grade, RoHS-compliant device supplied in a compact 456-BBGA package and built on a mature 0.22 µm process, this FPGA is well suited to customers developing PCI/Compact PCI subsystems, memory interface logic, prototyping platforms and custom arithmetic accelerators where field reconfigurability and tested silicon are required.

Request a quote or submit an RFQ to obtain pricing and availability for the XCV150-4FG456C and to discuss lead times and ordering quantities.