XCV150-5BG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA |
|---|---|
| Quantity | 1,065 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 864 | Number of Logic Elements/Cells | 3888 | ||
| Number of Gates | 164674 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of XCV150-5BG256I – Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA
The XCV150-5BG256I is a Virtex-series SRAM-based FPGA offering a balance of programmable logic, embedded memory, and high-density I/O in a 256-ball BGA package. It provides approximately 3,888 logic elements, 49,152 bits of on-chip RAM and up to 180 user I/O, making it suitable for demanding embedded and communications designs.
Built on the Virtex architecture, this device targets applications that require reprogrammable, high-performance logic with integrated clock management and a rich set of routing and memory resources. It is offered in an industrial-grade temperature range and designed for system-level configurability and in-system reprogramming.
Key Features
- Logic Capacity Approximately 3,888 logic elements (24×36 CLB array) and a reported 164,674 system gates provide significant programmable logic for medium-complexity designs.
- Embedded Memory 49,152 total RAM bits of on-chip memory for LUT-based RAM, dual-ported RAM, or shift-register configurations to support buffering and state storage.
- I/O and Interfaces Up to 180 available user I/Os and multi-standard SelectIO™ support (series feature) enable connectivity to a variety of external devices and memory types.
- Clocking and Timing Built-in clock-management circuitry including multiple delay-locked loops (DLLs) and global/local clock nets (series features) for advanced clock control and low-skew distribution.
- Performance Series-level performance indicators include system operation up to 200 MHz and 66-MHz PCI compliance for bus-oriented designs.
- Package and Mounting 256-ball BGA (256-PBGA, 27×27 mm) surface-mount package for space-efficient board integration.
- Power and Supply Voltage supply range 2.375 V to 2.625 V, suitable for 2.5 V-class system rails.
- Operating Range Industrial-grade temperature rating from −40 °C to 100 °C and 100% factory tested for production reliability.
- SRAM-Based Reprogrammability SRAM configuration allows unlimited re-programmability and multiple programming modes (series-level feature).
Typical Applications
- Communications and Networking Use the device’s high I/O count and embedded memory for protocol handling, packet buffering and interface bridging in network equipment.
- Embedded Processing and Control Leverage the logic and on-chip RAM to implement custom control logic, state machines and data-path acceleration in industrial systems.
- PCI-Based Systems Series-level PCI compliance and configurable I/O make the part suitable for bus-interface functions and Compact PCI applications requiring hot-swap capability.
- High-speed Data Interfaces Selectable interface standards and dedicated clock-management resources support high-performance interfaces and timing-critical signal paths.
Unique Advantages
- Reprogrammable Hardware: SRAM-based architecture enables unlimited in-system reprogramming, reducing time-to-market and enabling iterative design updates.
- Balanced Integration: Combined logic, embedded RAM, and plentiful I/O reduce external component count and simplify board-level design.
- Advanced Clock Control: On-die DLLs and hierarchical clock routing provide precise timing and low-skew distribution for synchronous designs.
- Industrial Temperature Support: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
- Proven Platform Support: Part of the Virtex family with documented development-system support and configuration modes for flexible deployment.
- Robust Manufacturing: 100% factory tested to support production reliability and consistent device quality.
Why Choose XCV150-5BG256I?
The XCV150-5BG256I provides a practical combination of logic density, embedded memory and I/O flexibility in a compact 256-BBGA package, backed by Virtex-series architecture and development ecosystem support. Its industrial temperature rating and complete factory testing make it suitable for production-grade embedded and communications systems that require reprogrammable hardware and reliable operation.
This device is well suited to designers who need the ability to implement medium-complexity programmable logic with on-chip memory and advanced clocking features while retaining the flexibility of SRAM-based configuration and multiple programming modes.
Request a quote or submit an inquiry to begin evaluating the XCV150-5BG256I for your design requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








