XCV150-5BG256I

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA

Quantity 1,065 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-5BG256I – Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA

The XCV150-5BG256I is a Virtex-series SRAM-based FPGA offering a balance of programmable logic, embedded memory, and high-density I/O in a 256-ball BGA package. It provides approximately 3,888 logic elements, 49,152 bits of on-chip RAM and up to 180 user I/O, making it suitable for demanding embedded and communications designs.

Built on the Virtex architecture, this device targets applications that require reprogrammable, high-performance logic with integrated clock management and a rich set of routing and memory resources. It is offered in an industrial-grade temperature range and designed for system-level configurability and in-system reprogramming.

Key Features

  • Logic Capacity  Approximately 3,888 logic elements (24×36 CLB array) and a reported 164,674 system gates provide significant programmable logic for medium-complexity designs.
  • Embedded Memory  49,152 total RAM bits of on-chip memory for LUT-based RAM, dual-ported RAM, or shift-register configurations to support buffering and state storage.
  • I/O and Interfaces  Up to 180 available user I/Os and multi-standard SelectIO™ support (series feature) enable connectivity to a variety of external devices and memory types.
  • Clocking and Timing  Built-in clock-management circuitry including multiple delay-locked loops (DLLs) and global/local clock nets (series features) for advanced clock control and low-skew distribution.
  • Performance  Series-level performance indicators include system operation up to 200 MHz and 66-MHz PCI compliance for bus-oriented designs.
  • Package and Mounting  256-ball BGA (256-PBGA, 27×27 mm) surface-mount package for space-efficient board integration.
  • Power and Supply  Voltage supply range 2.375 V to 2.625 V, suitable for 2.5 V-class system rails.
  • Operating Range  Industrial-grade temperature rating from −40 °C to 100 °C and 100% factory tested for production reliability.
  • SRAM-Based Reprogrammability  SRAM configuration allows unlimited re-programmability and multiple programming modes (series-level feature).

Typical Applications

  • Communications and Networking  Use the device’s high I/O count and embedded memory for protocol handling, packet buffering and interface bridging in network equipment.
  • Embedded Processing and Control  Leverage the logic and on-chip RAM to implement custom control logic, state machines and data-path acceleration in industrial systems.
  • PCI-Based Systems  Series-level PCI compliance and configurable I/O make the part suitable for bus-interface functions and Compact PCI applications requiring hot-swap capability.
  • High-speed Data Interfaces  Selectable interface standards and dedicated clock-management resources support high-performance interfaces and timing-critical signal paths.

Unique Advantages

  • Reprogrammable Hardware:  SRAM-based architecture enables unlimited in-system reprogramming, reducing time-to-market and enabling iterative design updates.
  • Balanced Integration:  Combined logic, embedded RAM, and plentiful I/O reduce external component count and simplify board-level design.
  • Advanced Clock Control:  On-die DLLs and hierarchical clock routing provide precise timing and low-skew distribution for synchronous designs.
  • Industrial Temperature Support:  Rated from −40 °C to 100 °C for deployment in demanding environmental conditions.
  • Proven Platform Support:  Part of the Virtex family with documented development-system support and configuration modes for flexible deployment.
  • Robust Manufacturing:  100% factory tested to support production reliability and consistent device quality.

Why Choose XCV150-5BG256I?

The XCV150-5BG256I provides a practical combination of logic density, embedded memory and I/O flexibility in a compact 256-BBGA package, backed by Virtex-series architecture and development ecosystem support. Its industrial temperature rating and complete factory testing make it suitable for production-grade embedded and communications systems that require reprogrammable hardware and reliable operation.

This device is well suited to designers who need the ability to implement medium-complexity programmable logic with on-chip memory and advanced clocking features while retaining the flexibility of SRAM-based configuration and multiple programming modes.

Request a quote or submit an inquiry to begin evaluating the XCV150-5BG256I for your design requirements.

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