XCV150-5FG256I

The XCV150-5FG256I is a Virtex® SRAM-based FPGA offered by AMD, delivering a reprogrammable platform for system-level digital logic. Its architecture provides an array of configurable logic resources, embedded memory, and flexible I/O to support complex, high-performance programmable logic designs.

Designed for applications that require on-device reconfiguration and compact packaging, this device combines 3,888 logic elements and approximately 0.049 Mbits of embedded RAM with 176 user I/O pins in a 256-BGA package, and is specified for industrial temperature operation.

Key Features

• Logic Capacity  3,888 logic elements provide the programmable fabric required for medium-complexity designs and custom logic functions.
• Embedded Memory  Total on-chip RAM of 49,152 bits (approximately 0.049 Mbits) for local data storage and buffering within the FPGA fabric.
• I/O Density  176 programmable I/O pins support a range of external interfaces and board-level interconnect requirements.
• Clock and Timing Resources  Includes dedicated clock-management circuitry from the Virtex family (four DLLs and multiple global/local clock nets) to support advanced clock control and low-skew distribution.
• Arithmetic and DSP Support  Architecture includes dedicated carry logic and multiplier support for implementing high-speed arithmetic operations.
• Configuration and Re‑programmability  SRAM-based in-system configuration enables unlimited re-programmability with multiple programming modes (SelectMAP, serial, JTAG).
• Performance and System Interfaces  Documented Virtex family features include system performance up to 200 MHz and compatibility with 66‑MHz PCI and hot‑swappable Compact PCI implementations (per family specification).
• Package and Mounting  256‑BGA supplier device package (256‑FBGA, 17×17) designed for surface-mount assembly.
• Electrical and Environmental  Supply voltage range: 2.375 V to 2.625 V. Operating temperature range: −40°C to 100°C. RoHS compliant.

Typical Applications

• System Prototyping and ASIC Replacement  Reprogrammable logic and configurable memory make the device suitable for prototyping and replacing mask-programmed gate arrays.
• High‑performance Interface Logic  Support for 66‑MHz PCI and Compact PCI hot-swap capability (family-level) enables use in board-level interface and bridging functions.
• Embedded Arithmetic and DSP Blocks  Dedicated carry chains and multiplier support enable implementation of custom arithmetic and signal-processing functions on the FPGA fabric.

Unique Advantages

• Reprogrammable Flexibility:  SRAM-based configuration allows unlimited in-system reprogramming to iterate designs or update functionality after deployment.
• Integrated Timing Resources:  On-chip DLLs and multiple global/local clock nets simplify clock management and help maintain low-skew timing across the design.
• Compact, Industrial-Grade Packaging:  256‑BGA surface-mount package with an industrial temperature rating supports compact board layouts and extended ambient conditions.
• Balanced Logic and Memory:  Combination of 3,888 logic elements and embedded RAM supports mixed control, buffering, and compute tasks without extensive external memory for many functions.
• Established Virtex Architecture:  Family-level architectural features—hierarchical routing, configurable LUT-based RAM, and boundary-scan—help accelerate design implementation and board integration.

Why Choose XCV150-5FG256I?

The XCV150-5FG256I offers a practical balance of logic capacity, embedded memory, and I/O density in a compact 256‑BGA form factor with industrial temperature range and RoHS compliance. It is well suited for projects that require field-updatable logic, hardware acceleration of arithmetic tasks, and robust clock control.

Engineers and procurement teams seeking a reprogrammable, medium-density FPGA with support for common system interfaces and a proven Virtex family feature set will find this device appropriate for prototyping, interface logic, and embedded processing acceleration where reconfiguration and compact packaging are priorities.

Request a quote or submit an RFQ to check availability and pricing for the XCV150-5FG256I and to discuss volume requirements or lead-time details.