XCV150-5FG456I

IC FPGA 260 I/O 456FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 49152 3888 456-BBGA

Quantity 692 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-5FG456I – Virtex® FPGA IC, 260 I/O, ~0.05 Mbits RAM, 3,888 logic elements

The XCV150-5FG456I is an SRAM-based Virtex® Field Programmable Gate Array supplied in a 456-ball BGA package for surface-mount assembly. It implements a flexible, regular FPGA architecture with 3,888 logic elements, approximately 49,152 bits of embedded RAM (~0.05 Mbits), and 260 user I/O pins aimed at high-performance and high-density programmable logic applications.

Designed with on-chip clock management, multi-standard I/O and in-system reprogrammability, this device targets system-level implementations where configurable logic, extensive I/O and industrial temperature range operation are required.

Key Features

  • Logic Capacity — 3,888 logic elements and 164,674 system gates provide a medium-density programmable fabric for custom logic implementation.
  • Embedded Memory — 49,152 bits of on-chip RAM (approximately 0.05 Mbits) with LUTs configurable as various RAM types and dual-ported options for flexible memory usage.
  • I/O and Interface Flexibility — 260 user I/O pins supporting multi-standard SelectIO™ interfaces and direct connection to external memory devices as described in the series specification.
  • Clock Management — On-chip clock resources include four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock distribution and control.
  • In-System Configuration — SRAM-based architecture supports unlimited re-programmability and multiple programming modes for field updates and iterative development.
  • Package and Mounting — 456-ball BGA package (supplier device package 456-FBGA, 23×23) configured for surface-mount assembly.
  • Industrial Temperature and Power — Rated for operation from −40°C to 100°C with a specified core supply range of 2.375 V to 2.625 V; RoHS compliant.
  • Manufacturing and Process — Implemented in a 0.22 μm, 5-layer metal CMOS process and 100% factory tested as reported for the Virtex family.

Typical Applications

  • PCI and CompactPCI interface logic — Supports 66-MHz PCI-compliant implementations and hot-swappable CompactPCI designs as described for the Virtex family.
  • High-performance system control — Suited for programmable control and processing blocks that require medium-density logic, extensive I/O and on-chip RAM.
  • Custom I/O protocol bridging — Multi-standard SelectIO™ capability enables implementation of protocol translators and interface adapters.
  • Embedded memory buffering and FIFOs — Configurable LUT and block RAM structures support on-chip buffering and temporary data storage in communication and data-acquisition paths.

Unique Advantages

  • Well-balanced density and performance: 3,888 logic elements and 164,674 gates offer a balance between capacity and routing efficiency for mid-range FPGA designs.
  • Extensive I/O count: 260 user I/Os give designers flexibility to connect numerous external devices without intermediate multiplexing.
  • Deterministic clocking: Four DLLs and hierarchical clock nets enable low-skew distribution and precise clock control for synchronous designs.
  • Field reprogrammability: SRAM-based configuration allows in-system updates and iterative design changes without replacing hardware.
  • Industrial-ready operation: Specified operation from −40°C to 100°C suits deployments that require extended temperature range reliability.
  • Proven process and test coverage: Implemented in a 0.22 μm, 5-layer-metal process and described as 100% factory tested in the product family documentation.

Why Choose XCV150-5FG456I?

The XCV150-5FG456I combines a Virtex family architecture with medium-density logic, a significant I/O complement and configurable on-chip memory to address designs that need flexible, reprogrammable hardware building blocks. Its integrated clock-management resources and multi-standard I/O support make it suitable for system logic, interface bridging and data-path implementations that demand deterministic timing and numerous external connections.

With an industrial operating temperature range, RoHS compliance and a robust manufacturing process, this part is positioned for projects where long-term reconfigurability, integration and reliable operation across extended temperatures are important considerations.

Request a quote or submit a purchasing inquiry for the XCV150-5FG456I to get pricing, availability and procurement assistance.

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