XCV150-6BG256C

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA

Quantity 686 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-6BG256C – Virtex® FPGA, 3,888 logic elements, 49,152-bit RAM, 256-BBGA

The XCV150-6BG256C is a Virtex® SRAM-based Field Programmable Gate Array designed for high-density, reprogrammable logic implementations. The device combines a regular array of configurable logic elements with on-chip embedded memory and multi-standard I/O to address system-level integration and performance needs.

This commercial-grade FPGA suits designs that require a balance of logic capacity, embedded RAM, and flexible I/O, with on-board configuration options and a package optimized for surface-mount assembly.

Key Features

  • Logic Capacity  3,888 logic elements providing approximately 164,674 system gates for medium- to high-density logic implementations.
  • Embedded Memory  49,152 bits of on-chip RAM (approximately 0.049 Mbits) for local buffering, state storage, and small-data tables.
  • I/O  180 user I/O pins to support a variety of external interfaces and peripheral connections.
  • Clock and Timing Resources  Virtex family architecture includes dedicated clock-management circuitry with multiple delay-locked loops (DLLs) and hierarchical global/local clock distribution for advanced clock control (as described in the Virtex product specification).
  • Configurable Logic Architecture  Regular array of configurable logic blocks and programmable I/O blocks enabling flexible routing and a wide range of logic functions (family-level architecture described in the product specification).
  • Package & Mounting  256-BBGA package (supplier device package: 256-PBGA, 27×27 mm) optimized for surface-mount assembly.
  • Supply and Operating Range  Core supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C.
  • Standards & Configuration  SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (noted in the Virtex product specification).
  • Compliance  RoHS compliant.

Typical Applications

  • PCI and Compact PCI Systems  The Virtex family’s PCI compliance and hot-swap characteristics (as described in the product specification) make this device suitable for PCI/Compact PCI subsystem logic and bridge functions.
  • Custom Logic and Acceleration  Medium-density hardware acceleration and custom processing tasks that benefit from reprogrammable logic and on-chip RAM.
  • Embedded Controllers  Controller and glue-logic roles where a mix of I/O, local RAM, and reprogrammability reduce external component count.
  • Prototyping and System Integration  Use in platform prototypes and system designs requiring iterative firmware updates and rapid design turnarounds enabled by SRAM-based configuration.

Unique Advantages

  • Reprogrammable Flexibility:  SRAM-based configuration supports unlimited re-programmability and multiple programming modes, enabling iterative design and field updates.
  • Balanced Resource Mix:  Combination of 3,888 logic elements and 49,152 bits of embedded RAM supports diverse logic and small-data storage needs without excessive external memory.
  • System-Level I/O:  180 user I/Os provide broad connectivity for peripherals and subsystem interfaces, reducing the need for additional interface ICs.
  • Clock Management:  Dedicated clock-management circuitry and hierarchical clock nets (as detailed in the Virtex family specification) simplify the implementation of complex clocking schemes.
  • Commercial Temperature Range:  Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
  • RoHS Compliant:  Meets RoHS requirements for lead-free assembly and regulatory compliance in many markets.

Why Choose XCV150-6BG256C?

The XCV150-6BG256C offers a practical mix of logic density, embedded memory, and flexible I/O in a surface-mount 256-BBGA package, making it well suited for commercial embedded designs that require reprogrammability and system integration. Its SRAM-based architecture and documented Virtex family features provide predictable configuration options and a familiar design flow for teams using Virtex-based platforms.

This device is a strong choice for engineers and procurement teams building medium-density programmable solutions where iterative development, on-board memory, and a solid I/O count deliver long-term design flexibility and reduced BOM complexity.

Request a quote or submit a request for pricing and availability to evaluate the XCV150-6BG256C for your next design.

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