XCV150-6BG256C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA |
|---|---|
| Quantity | 686 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 864 | Number of Logic Elements/Cells | 3888 | ||
| Number of Gates | 164674 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of XCV150-6BG256C – Virtex® FPGA, 3,888 logic elements, 49,152-bit RAM, 256-BBGA
The XCV150-6BG256C is a Virtex® SRAM-based Field Programmable Gate Array designed for high-density, reprogrammable logic implementations. The device combines a regular array of configurable logic elements with on-chip embedded memory and multi-standard I/O to address system-level integration and performance needs.
This commercial-grade FPGA suits designs that require a balance of logic capacity, embedded RAM, and flexible I/O, with on-board configuration options and a package optimized for surface-mount assembly.
Key Features
- Logic Capacity 3,888 logic elements providing approximately 164,674 system gates for medium- to high-density logic implementations.
- Embedded Memory 49,152 bits of on-chip RAM (approximately 0.049 Mbits) for local buffering, state storage, and small-data tables.
- I/O 180 user I/O pins to support a variety of external interfaces and peripheral connections.
- Clock and Timing Resources Virtex family architecture includes dedicated clock-management circuitry with multiple delay-locked loops (DLLs) and hierarchical global/local clock distribution for advanced clock control (as described in the Virtex product specification).
- Configurable Logic Architecture Regular array of configurable logic blocks and programmable I/O blocks enabling flexible routing and a wide range of logic functions (family-level architecture described in the product specification).
- Package & Mounting 256-BBGA package (supplier device package: 256-PBGA, 27×27 mm) optimized for surface-mount assembly.
- Supply and Operating Range Core supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C.
- Standards & Configuration SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (noted in the Virtex product specification).
- Compliance RoHS compliant.
Typical Applications
- PCI and Compact PCI Systems The Virtex family’s PCI compliance and hot-swap characteristics (as described in the product specification) make this device suitable for PCI/Compact PCI subsystem logic and bridge functions.
- Custom Logic and Acceleration Medium-density hardware acceleration and custom processing tasks that benefit from reprogrammable logic and on-chip RAM.
- Embedded Controllers Controller and glue-logic roles where a mix of I/O, local RAM, and reprogrammability reduce external component count.
- Prototyping and System Integration Use in platform prototypes and system designs requiring iterative firmware updates and rapid design turnarounds enabled by SRAM-based configuration.
Unique Advantages
- Reprogrammable Flexibility: SRAM-based configuration supports unlimited re-programmability and multiple programming modes, enabling iterative design and field updates.
- Balanced Resource Mix: Combination of 3,888 logic elements and 49,152 bits of embedded RAM supports diverse logic and small-data storage needs without excessive external memory.
- System-Level I/O: 180 user I/Os provide broad connectivity for peripherals and subsystem interfaces, reducing the need for additional interface ICs.
- Clock Management: Dedicated clock-management circuitry and hierarchical clock nets (as detailed in the Virtex family specification) simplify the implementation of complex clocking schemes.
- Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
- RoHS Compliant: Meets RoHS requirements for lead-free assembly and regulatory compliance in many markets.
Why Choose XCV150-6BG256C?
The XCV150-6BG256C offers a practical mix of logic density, embedded memory, and flexible I/O in a surface-mount 256-BBGA package, making it well suited for commercial embedded designs that require reprogrammability and system integration. Its SRAM-based architecture and documented Virtex family features provide predictable configuration options and a familiar design flow for teams using Virtex-based platforms.
This device is a strong choice for engineers and procurement teams building medium-density programmable solutions where iterative development, on-board memory, and a solid I/O count deliver long-term design flexibility and reduced BOM complexity.
Request a quote or submit a request for pricing and availability to evaluate the XCV150-6BG256C for your next design.

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