XCV150-6PQ240C

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 49152 3888 240-BFQFP

Quantity 971 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-6PQ240C – Virtex® FPGA 240-BFQFP, 3,888 logic elements

The XCV150-6PQ240C is a Virtex® SRAM-based Field Programmable Gate Array in a 240-BFQFP package from AMD. It integrates a flexible logic fabric, on-chip block RAM, and multi-standard I/O capabilities to support reprogrammable digital designs that require dense logic, embedded memory, and advanced clock management.

Designed for commercial-grade embedded and communications applications, the device targets use cases that benefit from in-system reconfiguration, deterministic clock control, and a broad set of I/O options within a 240-pin surface-mount package.

Key Features

  • Logic Capacity — 864 CLBs delivering 3,888 logic elements and approximately 164,674 system gates for mid-range programmable logic integration.
  • Embedded Memory — Approximately 49 kbits (49,152 bits) of on-chip RAM to implement FIFOs, small buffers, and distributed data storage.
  • I/O Resources — 166 user I/O pins to support a wide variety of external interfaces and peripherals.
  • Clock Management — Built-in clock-management circuitry with multiple DLLs and dedicated global clock nets to help achieve low-skew, high-performance clock distribution.
  • Configurable Logic and Arithmetic — Dedicated carry logic and multiplier support plus LUTs configurable as RAM or shift registers for flexible arithmetic and memory functions.
  • Packaging and Mounting — 240-BFQFP (supplier package: 240-PQFP 32×32) with surface-mount mounting for compact PCB integration.
  • Power and Temperature — Supply voltage range 2.375 V to 2.625 V and commercial operating range 0 °C to 85 °C.
  • Standards & Test — IEEE 1149.1 boundary-scan support and 100% factory tested. RoHS compliant.
  • SRAM-based Reprogrammability — In-system configuration capability with multiple programming modes for iterative development and field updates.

Typical Applications

  • PCI and Compact PCI Systems — Implements logic and interface glue for 66-MHz PCI-compliant designs and hot-swappable Compact PCI modules.
  • Embedded Network and Communications — Mid-density programmable fabric and abundant I/O for protocol bridging, packet processing, and custom interface logic.
  • Prototyping and In-System Debug — SRAM-based reprogrammability and boundary-scan support enable rapid design iterations and board-level diagnostics.
  • Custom Interface and Control — Combine configurable LUT RAM, dedicated arithmetic resources, and flexible I/O to implement motor control, sensor interfaces, or protocol converters.

Unique Advantages

  • Reprogrammable SRAM Architecture: Unlimited in-system re-programmability lets designers iterate hardware behavior without hardware changes.
  • Balanced Logic and Memory: 3,888 logic elements together with approximately 49 kbits of block RAM support both control logic and embedded data buffering in the same device.
  • Advanced Clock Control: Multiple DLLs and global/secondary clock nets provide predictable timing and low-skew distribution for synchronous designs.
  • Rich I/O Count in a Compact Package: 166 I/O pins in a 240-BFQFP package enable complex board-level interfacing while minimizing PCB footprint.
  • Production-Ready Testing and Compliance: 100% factory tested and RoHS compliant for streamlined integration into commercial products.
  • Boundary-Scan for Board-Level Validation: IEEE 1149.1 support simplifies manufacturing test and board bring-up.

Why Choose XCV150-6PQ240C?

The XCV150-6PQ240C delivers a practical balance of logic capacity, embedded memory, and I/O in a commercial-grade, surface-mount 240-BFQFP package. Its SRAM-based, reprogrammable architecture, combined with dedicated clock management and arithmetic support, makes it well suited for mid-density embedded designs that require flexible in-field updates and reliable timing control.

Choose this device when you need a reconfigurable logic solution that supports multiple programming modes, boundary-scan testing, and a compact package footprint—providing scalability and development agility for a range of commercial embedded and communications designs.

Request a quote or submit an RFQ today to evaluate how the XCV150-6PQ240C fits your next design—sales and quoting options are available upon request.

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