XCV1600E-6FG900C

The XCV1600E-6FG900C is a Virtex®-E family Field Programmable Gate Array (FPGA) in a 900-ball BGA package, optimized for high-density, reconfigurable logic applications. It combines tens of thousands of logic elements with substantial on-chip RAM and a very high I/O count to support complex system designs requiring flexible, in-system programmability and high-bandwidth interfacing.

This commercial-grade, surface-mount device targets applications that demand programmable logic density, large I/O resources and integrated memory while operating from a 1.71 V to 1.89 V core supply and within a 0 °C to 85 °C ambient range.

Key Features

• Logic Capacity  34,992 logic elements (cells) and approximately 2,188,742 user gates for implementing complex custom logic and datapaths.
• On-chip Memory  Total embedded memory of 589,824 bits (approximately 0.59 Mbits) for block and distributed RAM usage.
• High I/O Density  Up to 700 general-purpose I/Os to support wide parallel interfaces, high-pin-count peripherals, and board-level connectivity.
• Advanced I/O & Signaling (series capabilities)  Series features include SelectI/O+ support for multiple interface standards and differential signaling options such as LVDS, BLVDS and LVPECL to enable high-speed data paths and clock inputs.
• Clocking and Timing  Built-in clock management features in the Virtex‑E family include multiple DLLs and support for digitally synthesized duty cycles and clock multiplication/division (series capability).
• Performance & Density (series capability)  Designed for high-density implementations with internal performance characteristics cited for the Virtex‑E family.
• Package & Mounting  900-BBGA (supplier package listed as 900-FBGA, 31 × 31 mm footprint), surface-mount construction suitable for compact, high-density PCB layouts.
• Power & Operating Range  Core supply range 1.71 V to 1.89 V; commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-speed interface bridging  Implement PCI, LVDS, DDR and other high-bandwidth gateway or protocol-translation functions using the device’s large I/O count and series I/O capabilities.
• Memory interface and buffering  Use the on-chip RAM and high-density logic to create controllers and buffering for external ZBT or DDR memory subsystems (series guidance supports high-performance external memory interfaces).
• Data acquisition and processing  Configure wide parallel I/O and embedded logic to perform front-end aggregation, preprocessing, and packet handling in data acquisition or telecom equipment.
• In-system reconfigurable prototypes  Leverage SRAM-based, reprogrammable architecture for iterative hardware development, prototypes, and field updates.

Unique Advantages

• High logic density: 34,992 logic elements provide substantial capacity for complex state machines, DSP pipelines and custom accelerators.
• Large I/O resource: 700 I/Os enable extensive external connectivity without resorting to external multiplexing or expanders, simplifying board design.
• Integrated on-chip RAM: Approximately 0.59 Mbits of embedded memory reduces dependence on external memory for many buffering and scratchpad needs.
• Commercial-grade robustness: Designed for 0 °C to 85 °C operation and surface-mount assembly in a 900-BBGA package for reliable commercial deployment.
• Package density: 900-ball BGA (900-FBGA, 31×31) supports compact, high-pin-count system designs where board area is at a premium.
• RoHS compliance: Meets environmental compliance requirements for lead-free production processes.

Why Choose XCV1600E-6FG900C?

The XCV1600E-6FG900C positions itself where substantial programmable logic, plentiful I/O and on-chip memory are required in a single commercial-grade FPGA. Its combination of nearly 35k logic elements, hundreds of I/Os and several hundred kilobits of embedded RAM makes it suitable for designs that require in-system reconfigurability, high-bandwidth interfacing and compact board integration.

Choose this device when your project needs a reprogrammable, high-density FPGA platform with a broad set of series-level I/O and clock-management capabilities, a compact 900-ball BGA footprint, and RoHS compliance for mainstream production use.

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