XCV1600E-7FG860C

The XCV1600E-7FG860C is a Virtex®-E FPGA in an 860-ball FBGA exposed pad package, offering a high-density, reprogrammable logic fabric for commercial applications. This device combines 34,992 logic elements, a high I/O count, and an on-chip memory complement to address complex logic, interface bridging and high-bandwidth processing tasks.

Designed for 1.8 V core operation with a supply range of 1.71 V to 1.89 V and commercial-grade temperature rating (0 °C to 85 °C), this surface-mount FPGA targets systems that require reprogrammable logic, extensive I/O and advanced clocking and memory features provided by the Virtex‑E family.

Key Features

• Core Logic: 34,992 logic elements (cells) offering significant gate resources for complex logic implementation; approximately 2,188,742 gates reported for device-level capacity.
• On-Chip Memory: Approximately 0.59 Mbits of embedded memory (589,824 total RAM bits) suitable for buffering, FIFOs and small on-chip data stores.
• I/O Capacity: 660 I/O pins provide broad external connectivity for parallel buses, high-pin-count interfaces and dense system interconnects.
• Clock and Timing: Family-level clock management includes multiple fully digital DLLs for clock multiply/divide and DDR duty-cycle synthesis to support high-speed interface timing.
• Differential Signaling Support: Virtex‑E family features include support for LVDS, BLVDS and LVPECL differential signaling standards for high-speed serial and differential interfaces.
• Configuration: SRAM-based in-system reprogrammability enables iterative development and field updates without hardware replacement.
• Package & Mounting: 860-FBGA exposed pad package (42.5 × 42.5 mm) in a surface-mount form factor, suitable for high-density PCB designs.
• Power & Thermal: Low-voltage 1.71 V–1.89 V core supply range designed for lower power operation relative to older higher-voltage families; commercial operating range 0 °C to 85 °C.
• Standards & Interconnect: Series-level support for PCI-compliant operation (3.3 V, 32/64-bit, 33/66-MHz) and memory interfaces such as DDR SDRAM and high-speed ZBT SRAMs (as described for the Virtex‑E family).
• Compliance: RoHS compliant.

Typical Applications

• PCI and expansion cards: Implements custom logic and bus bridging for 3.3 V, 32/64-bit PCI 33/66-MHz systems.
• High-bandwidth memory interfaces: Acts as a controller or interface logic for external DDR SDRAM and high-speed SRAM in systems requiring large throughput.
• High-speed serial and differential interfaces: Leverages differential signaling support for LVDS/LVPECL links used in data acquisition and communication front-ends.
• Reconfigurable system logic: Suitable for prototyping, iterative product development and field-updatable logic in commercial electronic systems.

Unique Advantages

• High logic density: 34,992 logic elements provide the capacity to integrate extensive combinational and sequential logic on a single device, reducing board-level component count.
• Substantial I/O footprint: 660 I/Os accommodate wide parallel buses and numerous peripheral interfaces without external multiplexing.
• Embedded memory for local buffering: Approximately 0.59 Mbits of on-chip RAM enable efficient data staging and reduce off-chip memory bandwidth requirements.
• Advanced clocking: Family-level digital DLLs support flexible clock synthesis and DDR-friendly timing, simplifying high-speed interface design.
• Reprogrammability: SRAM-based in-system configuration allows iterative design refinement and field updates to extend product life and enable feature upgrades.
• Commercial-grade reliability: Surface-mount 860-FBGA package with exposed pad and a defined 0 °C to 85 °C operating range supports typical commercial system environments.

Why Choose XCV1600E-7FG860C?

The XCV1600E-7FG860C combines a high logic element count, a large I/O complement and on-chip memory in an 860-ball FBGA exposed pad package, delivering a balanced platform for complex, reprogrammable logic tasks in commercial products. Its 1.8 V core supply and Virtex‑E family features support efficient, high-performance interface and memory-centric designs.

This device is well suited to engineers and system architects building PCI-based boards, memory interface logic, high-speed differential links or field-updatable systems that benefit from substantial on-chip resources and flexible clocking. The reprogrammability and series-level tool support enable iterative development and long-term design scalability.

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