XCV200-4BG352I

IC FPGA 260 I/O 352MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal

Quantity 36 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-4BG352I – Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal

The XCV200-4BG352I is an SRAM-based Virtex FPGA delivering a balance of density and system-level features for industrial designs. Its architecture provides programmable logic, embedded RAM, and extensive I/O suited for high-performance system logic, configurable interfaces, and in-system reprogrammable applications.

With thousands of logic elements, dedicated clock management, and multi-standard I/O capability, this device targets applications that require flexible, reprogrammable hardware implemented in a 352-LBGA exposed-pad metal package rated for industrial temperature ranges.

Key Features

  • Logic Fabric — 1,176 configurable logic blocks (CLBs) and approximately 5,292 logic elements, implementing roughly 236,666 system gates for medium-density programmable designs.
  • Embedded Memory — 57,344 bits of on-chip RAM with LUTs that can be configured as various RAM types and shift registers for flexible local storage.
  • I/O and Interface Support — 260 user I/O pins with Multi-standard SelectIO interfaces; device supports direct connection to ZBTRAM devices and is 66-MHz PCI compliant with hot-swap support for CompactPCI.
  • Clocking and Timing — Built-in clock-management including four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets and 24 secondary local clock nets; datasheet reports system performance up to 200 MHz.
  • Arithmetic and Logic Support — Dedicated carry logic and multiplier support plus cascade chains and abundant registers/latches for high-speed arithmetic and wide-input functions.
  • Configuration and Test — SRAM-based in-system configuration with unlimited re-programmability and four programming modes; IEEE 1149.1 boundary-scan and a die-temperature sensor diode are included.
  • Process and Quality — Built on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested; RoHS compliant.
  • Package, Power and Environmental — 352-LBGA exposed pad metal package (supplier package: 352-MBGA, 35×35), surface-mount; supply voltage range 2.375 V to 2.625 V; operating temperature −40°C to 100°C; industrial grade.

Typical Applications

  • PCI and CompactPCI systems — 66-MHz PCI compliance and hot-swap capability make the device suitable for board-level interface roles.
  • Multi-standard I/O bridging — SelectIO support and abundant I/O pins enable protocol translation and custom interface implementations.
  • Embedded system logic and prototyping — Re-programmability and a mix of logic and RAM resources support iterative development and system-level prototyping.
  • Memory interfacing — Direct connectivity to ZBTRAM devices and internal block RAM options simplify high-performance external memory integration.

Unique Advantages

  • Highly configurable logic capacity: 5,292 logic elements and 1,176 CLBs provide a compact yet capable fabric for mid-range FPGA designs.
  • Flexible embedded memory: 57,344 bits of on-chip RAM and configurable LUT-based RAM structures reduce dependence on external memory for many functions.
  • Advanced clock control: Four DLLs and comprehensive clock distribution nets support sophisticated timing strategies for synchronous designs.
  • Extensive and versatile I/O: 260 I/Os with SelectIO capability enable multi-standard interfacing and direct connections to compatible external RAM devices.
  • Industrial readiness: Industrial temperature rating (−40°C to 100°C), RoHS compliance, and a metal exposed-pad BGA package support robust deployment environments.
  • Re-programmable deployment: SRAM-based configuration with multiple programming modes allows in-system updates and design iteration without hardware replacement.

Why Choose XCV200-4BG352I?

The XCV200-4BG352I combines a proven Virtex FPGA architecture with practical system features—embedded RAM, extensive I/O, dedicated clock management, and SRAM-based in-system programmability—making it a strong choice for industrial designs that require flexible hardware implementation and iterative development. Its supply voltage range, industrial temperature rating, and metal BGA package support robust board-level integration.

Engineers developing mid-density, performance-focused systems will find this device delivers a balanced mix of logic, memory, and interface capability along with the development ecosystem and configuration modes described in the product specification.

Request a quote or submit an inquiry to evaluate the XCV200-4BG352I for your next programmable logic design.

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