XCV200-4BG352I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 36 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 352-MBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-LBGA Exposed Pad, Metal | Number of I/O | 260 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-4BG352I – Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal
The XCV200-4BG352I is an SRAM-based Virtex FPGA delivering a balance of density and system-level features for industrial designs. Its architecture provides programmable logic, embedded RAM, and extensive I/O suited for high-performance system logic, configurable interfaces, and in-system reprogrammable applications.
With thousands of logic elements, dedicated clock management, and multi-standard I/O capability, this device targets applications that require flexible, reprogrammable hardware implemented in a 352-LBGA exposed-pad metal package rated for industrial temperature ranges.
Key Features
- Logic Fabric — 1,176 configurable logic blocks (CLBs) and approximately 5,292 logic elements, implementing roughly 236,666 system gates for medium-density programmable designs.
- Embedded Memory — 57,344 bits of on-chip RAM with LUTs that can be configured as various RAM types and shift registers for flexible local storage.
- I/O and Interface Support — 260 user I/O pins with Multi-standard SelectIO interfaces; device supports direct connection to ZBTRAM devices and is 66-MHz PCI compliant with hot-swap support for CompactPCI.
- Clocking and Timing — Built-in clock-management including four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets and 24 secondary local clock nets; datasheet reports system performance up to 200 MHz.
- Arithmetic and Logic Support — Dedicated carry logic and multiplier support plus cascade chains and abundant registers/latches for high-speed arithmetic and wide-input functions.
- Configuration and Test — SRAM-based in-system configuration with unlimited re-programmability and four programming modes; IEEE 1149.1 boundary-scan and a die-temperature sensor diode are included.
- Process and Quality — Built on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested; RoHS compliant.
- Package, Power and Environmental — 352-LBGA exposed pad metal package (supplier package: 352-MBGA, 35×35), surface-mount; supply voltage range 2.375 V to 2.625 V; operating temperature −40°C to 100°C; industrial grade.
Typical Applications
- PCI and CompactPCI systems — 66-MHz PCI compliance and hot-swap capability make the device suitable for board-level interface roles.
- Multi-standard I/O bridging — SelectIO support and abundant I/O pins enable protocol translation and custom interface implementations.
- Embedded system logic and prototyping — Re-programmability and a mix of logic and RAM resources support iterative development and system-level prototyping.
- Memory interfacing — Direct connectivity to ZBTRAM devices and internal block RAM options simplify high-performance external memory integration.
Unique Advantages
- Highly configurable logic capacity: 5,292 logic elements and 1,176 CLBs provide a compact yet capable fabric for mid-range FPGA designs.
- Flexible embedded memory: 57,344 bits of on-chip RAM and configurable LUT-based RAM structures reduce dependence on external memory for many functions.
- Advanced clock control: Four DLLs and comprehensive clock distribution nets support sophisticated timing strategies for synchronous designs.
- Extensive and versatile I/O: 260 I/Os with SelectIO capability enable multi-standard interfacing and direct connections to compatible external RAM devices.
- Industrial readiness: Industrial temperature rating (−40°C to 100°C), RoHS compliance, and a metal exposed-pad BGA package support robust deployment environments.
- Re-programmable deployment: SRAM-based configuration with multiple programming modes allows in-system updates and design iteration without hardware replacement.
Why Choose XCV200-4BG352I?
The XCV200-4BG352I combines a proven Virtex FPGA architecture with practical system features—embedded RAM, extensive I/O, dedicated clock management, and SRAM-based in-system programmability—making it a strong choice for industrial designs that require flexible hardware implementation and iterative development. Its supply voltage range, industrial temperature rating, and metal BGA package support robust board-level integration.
Engineers developing mid-density, performance-focused systems will find this device delivers a balanced mix of logic, memory, and interface capability along with the development ecosystem and configuration modes described in the product specification.
Request a quote or submit an inquiry to evaluate the XCV200-4BG352I for your next programmable logic design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








