XCV200-4FG256I

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 57344 5292 256-BGA

Quantity 943 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-4FG256I – Virtex FPGA, 256‑BGA, 176 I/O

The XCV200-4FG256I is an industrial-grade Virtex® Field Programmable Gate Array (FPGA) provided in a 256-ball BGA package. It combines SRAM-based, high-capacity programmable logic with an extensive on-chip memory and multi-standard I/O to address demanding embedded and industrial applications.

Built on the Virtex family architecture, this device offers a balance of logic density, clock management and I/O flexibility for systems requiring reprogrammability, external memory interfacing and moderate system performance.

Key Features

  • Logic Capacity — 5,292 logic elements (logic cells) and approximately 236,666 system gates for implementing mid-range programmable logic designs.
  • Embedded Memory — Approximately 57.3 kbits of on-chip RAM (57,344 total RAM bits) for LUT-configurable RAM and block RAM use.
  • I/O and Package — 176 user I/O pins in a 256‑BGA (256‑FBGA, 17×17) package; surface-mount mounting type for compact board integration.
  • Clock and Timing — Family features include four dedicated delay-locked loops (DLLs) and multiple global/local clock nets for advanced clock distribution and low-skew timing control.
  • Configuration and Re-programmability — SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability, enabling iterative development and field updates.
  • On-chip System Resources — Dedicated carry logic and multiplier support, cascade chains, abundant registers/latches with clock enable and set/reset, internal 3-state bussing, IEEE 1149.1 boundary-scan and a die-temperature sensor diode.
  • Interfaces — Multi-standard SelectIO™ interfaces and fast interfaces to external high-performance RAMs to support diverse signaling requirements.
  • Power and Operating Range — Core supply voltage range of 2.375 V to 2.625 V and industrial operating temperature range of −40°C to 100°C.
  • Manufacturing — 0.22 μm, 5-layer metal process; 100% factory tested and RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Use the industrial temperature rating and reprogrammability to implement control logic, protocol bridging and machine-interface functions.
  • PCI and Compact PCI Systems — Family-level support for 66-MHz PCI compliance and hot-swappable Compact PCI environments suits board-level I/O and interface logic on modular systems.
  • Memory Interface and Buffering — On-chip RAM and fast external RAM interfaces provide building blocks for buffering, data staging and custom memory controllers.
  • Prototyping and In-System Upgrades — SRAM-based architecture with multiple programming modes enables iterative development, field updates and design validation.

Unique Advantages

  • Flexible, reprogrammable platform: SRAM-based configuration with unlimited re-programmability enables frequent design iterations and field updates without hardware changes.
  • Balanced logic and memory: 5,292 logic elements and ~57.3 kbits of embedded RAM support a wide range of mid-range logic and data-path implementations on a single device.
  • Robust clocking resources: Multiple DLLs and hierarchical clock nets simplify implementation of low-skew, multi-clock designs for reliable timing control.
  • Rich system connectivity: 176 I/O pins and multi-standard SelectIO capabilities facilitate direct interfacing to diverse peripheral and memory technologies.
  • Industrial operation: Rated for −40°C to 100°C and supplied in a compact 256‑FBGA (17×17) surface-mount package for deployment in industrial environments.
  • Proven manufacturing pedigree: 0.22 μm, 5-layer metal process and 100% factory testing help ensure consistent device quality and supply readiness.

Why Choose XCV200-4FG256I?

The XCV200-4FG256I delivers a practical combination of logic density, embedded memory and I/O flexibility in an industrial-temperature FPGA package. It is well suited to designers who need a reprogrammable, mid-range Virtex family device with on-chip resources for clocking, arithmetic and memory interfacing.

For projects requiring iterative development, field reconfiguration and a compact BGA footprint, the XCV200-4FG256I provides a balanced platform backed by the Virtex architecture and factory-tested manufacturing.

Request a quote or submit a product inquiry to receive availability and pricing information for the XCV200-4FG256I.

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