XCV200-4FG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 176 57344 5292 256-BGA |
|---|---|
| Quantity | 943 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-4FG256I – Virtex FPGA, 256‑BGA, 176 I/O
The XCV200-4FG256I is an industrial-grade Virtex® Field Programmable Gate Array (FPGA) provided in a 256-ball BGA package. It combines SRAM-based, high-capacity programmable logic with an extensive on-chip memory and multi-standard I/O to address demanding embedded and industrial applications.
Built on the Virtex family architecture, this device offers a balance of logic density, clock management and I/O flexibility for systems requiring reprogrammability, external memory interfacing and moderate system performance.
Key Features
- Logic Capacity — 5,292 logic elements (logic cells) and approximately 236,666 system gates for implementing mid-range programmable logic designs.
- Embedded Memory — Approximately 57.3 kbits of on-chip RAM (57,344 total RAM bits) for LUT-configurable RAM and block RAM use.
- I/O and Package — 176 user I/O pins in a 256‑BGA (256‑FBGA, 17×17) package; surface-mount mounting type for compact board integration.
- Clock and Timing — Family features include four dedicated delay-locked loops (DLLs) and multiple global/local clock nets for advanced clock distribution and low-skew timing control.
- Configuration and Re-programmability — SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability, enabling iterative development and field updates.
- On-chip System Resources — Dedicated carry logic and multiplier support, cascade chains, abundant registers/latches with clock enable and set/reset, internal 3-state bussing, IEEE 1149.1 boundary-scan and a die-temperature sensor diode.
- Interfaces — Multi-standard SelectIO™ interfaces and fast interfaces to external high-performance RAMs to support diverse signaling requirements.
- Power and Operating Range — Core supply voltage range of 2.375 V to 2.625 V and industrial operating temperature range of −40°C to 100°C.
- Manufacturing — 0.22 μm, 5-layer metal process; 100% factory tested and RoHS compliant.
Typical Applications
- Industrial Control and Automation — Use the industrial temperature rating and reprogrammability to implement control logic, protocol bridging and machine-interface functions.
- PCI and Compact PCI Systems — Family-level support for 66-MHz PCI compliance and hot-swappable Compact PCI environments suits board-level I/O and interface logic on modular systems.
- Memory Interface and Buffering — On-chip RAM and fast external RAM interfaces provide building blocks for buffering, data staging and custom memory controllers.
- Prototyping and In-System Upgrades — SRAM-based architecture with multiple programming modes enables iterative development, field updates and design validation.
Unique Advantages
- Flexible, reprogrammable platform: SRAM-based configuration with unlimited re-programmability enables frequent design iterations and field updates without hardware changes.
- Balanced logic and memory: 5,292 logic elements and ~57.3 kbits of embedded RAM support a wide range of mid-range logic and data-path implementations on a single device.
- Robust clocking resources: Multiple DLLs and hierarchical clock nets simplify implementation of low-skew, multi-clock designs for reliable timing control.
- Rich system connectivity: 176 I/O pins and multi-standard SelectIO capabilities facilitate direct interfacing to diverse peripheral and memory technologies.
- Industrial operation: Rated for −40°C to 100°C and supplied in a compact 256‑FBGA (17×17) surface-mount package for deployment in industrial environments.
- Proven manufacturing pedigree: 0.22 μm, 5-layer metal process and 100% factory testing help ensure consistent device quality and supply readiness.
Why Choose XCV200-4FG256I?
The XCV200-4FG256I delivers a practical combination of logic density, embedded memory and I/O flexibility in an industrial-temperature FPGA package. It is well suited to designers who need a reprogrammable, mid-range Virtex family device with on-chip resources for clocking, arithmetic and memory interfacing.
For projects requiring iterative development, field reconfiguration and a compact BGA footprint, the XCV200-4FG256I provides a balanced platform backed by the Virtex architecture and factory-tested manufacturing.
Request a quote or submit a product inquiry to receive availability and pricing information for the XCV200-4FG256I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








