XCV200-4PQ240I

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 57344 5292 240-BFQFP

Quantity 753 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-4PQ240I – Virtex® Field Programmable Gate Array IC, 240-BFQFP

The XCV200-4PQ240I is an industrial-grade Virtex® SRAM-based FPGA in a 240-BFQFP surface-mount package. It provides 5,292 logic elements, approximately 57,344 bits of on-chip RAM, and 166 user I/O pins for mid-range reconfigurable logic implementations.

Built on the Virtex architecture, this device is suited for industrial and embedded systems that require in-system reprogrammability, robust clock management, and a flexible memory hierarchy. The device operates from a 2.375 V to 2.625 V supply and is specified for –40 °C to 100 °C operation.

Key Features

  • Logic Capacity — 5,292 logic elements (corresponding to 236,666 system gates) to implement mid-range digital logic functions and datapaths.
  • On‑Chip Memory — Approximately 57,344 bits of embedded RAM. The Virtex family architecture supports LUTs configurable as small RAMs and dedicated block RAM structures for flexible storage options.
  • I/O and Interface Options — 166 I/O pins. Series-level features include multi-standard SelectIO interfaces and support for 66‑MHz PCI operation and hot‑swapping for Compact PCI environments.
  • Clock Management — Built-in clock-management with four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets for advanced timing control.
  • Configuration and Reprogramming — SRAM-based in-system configuration with unlimited re-programmability and four programming modes (including master serial, SelectMAP, slave serial, and JTAG).
  • Package and Mounting — 240-BFQFP (supplier package: 240‑PQFP, 32×32) surface-mount package for compact PCB integration.
  • Environmental and Supply — Industrial grade device, RoHS compliant, specified supply range of 2.375 V to 2.625 V and operating temperature from –40 °C to 100 °C.
  • Process and Testing — Manufactured on a 0.22 µm, 5-layer metal CMOS process and 100% factory tested (series-level specification).

Typical Applications

  • Industrial Control — Implement custom control logic, sensor interfacing, and protocol handling in systems that require industrial temperature range and robust reconfigurability.
  • PCI and Compact PCI Systems — On-board logic for PCI expansion cards and Compact PCI modules where 66‑MHz PCI compliance and hot‑swap capability are required.
  • Embedded Prototyping and Development — SRAM-based in-system reprogramming enables iterative design, firmware updates, and field upgrades during development and deployment.
  • Interface Bridging and High‑Speed I/O — Use multi-standard SelectIO interfaces to bridge or adapt signals between different subsystems and memory devices.

Unique Advantages

  • Balanced integration density: 5,292 logic elements and 236,666 system gates give designers room to implement complex mid-range designs without excessive board-level partitioning.
  • Flexible on-chip memory: Approximately 57,344 bits of embedded RAM combined with configurable LUT-based RAM options supports a variety of buffering and state-storage needs.
  • Advanced clocking resources: Four DLLs and multiple global/local clock nets simplify clock-domain management and timing closure for synchronous designs.
  • In-system reprogrammability: SRAM-based configuration and multiple programming modes accelerate development cycles and enable field updates.
  • Industrial-ready packaging and thermal range: 240-PQFP surface-mount package and –40 °C to 100 °C operating range support deployment in industrial environments.
  • Proven series ecosystem: Integration within the Virtex family provides access to established toolchains and design flows (series-level support noted in product documentation).

Why Choose XCV200-4PQ240I?

The XCV200-4PQ240I offers a balanced combination of logic resources, embedded memory, robust clock-management, and flexible I/O in an industrial-grade surface-mount package. It is well suited to engineers who need a reprogrammable, mid-density FPGA for industrial control, PCI-based systems, or embedded prototyping where temperature range and in-system configurability matter.

Choosing this Virtex device provides a scalable, reconfigurable platform supported by the Virtex family architecture and associated development systems, helping shorten development cycles and enabling upgrades in the field.

Request a quote or submit an RFQ for the XCV200-4PQ240I to obtain pricing and availability for your next design.

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