XCV200-4PQ240C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 166 57344 5292 240-BFQFP |
|---|---|
| Quantity | 1,623 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 166 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-4PQ240C – Virtex® Field Programmable Gate Array (FPGA), 240-BFQFP
The XCV200-4PQ240C is an SRAM-based Virtex® Field Programmable Gate Array supplied in a 240-BFQFP surface-mount package. It combines a dense logic fabric, embedded memory, and flexible I/O to support reconfigurable digital designs for commercial embedded systems and interface-centric applications.
Designed for system-level integration, this device provides 5,292 logic elements, approximately 57,344 bits of on-chip RAM, and 166 user I/O pins, operating from a 2.375 V to 2.625 V core supply and rated for commercial temperature ranges (0 °C to 85 °C). RoHS-compliant and supported by vendor development tools, it targets applications that require programmable logic, memory hierarchy flexibility, and configurable I/O standards.
Key Features
- Core Logic — 5,292 logic elements (cells) delivering approximately 236,666 system gates of programmable logic density for custom digital functions.
- Embedded Memory — Approximately 57,344 bits of block RAM with a hierarchical memory architecture; LUTs are configurable for RAM or shift-register modes to support varied storage requirements.
- I/O Capacity — 166 user I/O pins in a multi-standard SelectIO-style architecture for interfacing to external memories and peripherals.
- Clock Management — Built-in clock-management circuitry including multiple dedicated delay-locked loops (DLLs) and global/secondary clock distribution nets for low-skew clocking strategies.
- Arithmetic & DSP Support — Dedicated carry logic and multiplier support to accelerate arithmetic and signal-processing functions within the fabric.
- Configuration & Reprogrammability — SRAM-based device with in-system configuration capability and multiple programming modes for updates and iterative development.
- Package & Mounting — 240-BFQFP package (supplier device package: 240-PQFP, 32×32) with surface-mount mounting type suitable for standard PCB assembly.
- Power & Temperature — Core supply voltage range 2.375 V to 2.625 V; commercial operating range 0 °C to 85 °C.
- Compliance — RoHS-compliant, and 100% factory tested per manufacturer specification.
Typical Applications
- PCI and CompactPCI systems — Suitable for designs requiring PCI connectivity and CompactPCI hot-swap compatibility where reconfigurable logic and interface control are needed.
- Memory interface controllers — Provides fast, configurable interfaces to external high-performance RAMs and ZBTRAM-style devices using abundant I/O and embedded memory.
- Custom digital processing — Dedicated arithmetic resources and embedded RAM make the device useful for custom signal- and data-processing pipelines in commercial equipment.
- Prototyping and in-system upgrade — SRAM-based configuration supports in-field reprogramming and iterative hardware development workflows.
Unique Advantages
- Reprogrammable flexibility: SRAM-based architecture enables unlimited re-programmability and multiple configuration modes for design iteration and field updates.
- Integrated clock control: Multiple DLLs and hierarchical clock networks reduce the complexity of custom clocking schemes and help maintain low-skew distribution.
- Balanced logic and memory: A combination of 5,292 logic elements and approximately 57,344 bits of block RAM supports mixed compute-and-storage designs without immediate external memory dependence.
- Interface versatility: Large I/O count and multi-standard SelectIO-style capability simplify integration with external devices and memory interfaces.
- Commercial-grade reliability: Operates across a 0 °C to 85 °C range with RoHS compliance and 100% factory testing for predictable procurement and deployment.
- Supplier development support: Device family features are supported by vendor development systems and libraries to accelerate design implementation.
Why Choose XCV200-4PQ240C?
The XCV200-4PQ240C offers a compact, reconfigurable platform that balances logic density, embedded RAM, and I/O capacity for commercial embedded and system-interface applications. Its SRAM-based architecture and on-chip clock-management features make it well suited to designs that require in-field updates, custom interfacing, and moderate signal-processing capabilities.
Engineers and procurement teams will find this device appropriate for projects that need a programmable logic solution in a 240-BFQFP surface-mount package, with clear electrical and thermal limits for commercial deployments and vendor-backed development resources to support integration and scaling.
Request a quote or contact our sales team to submit a purchase inquiry or obtain pricing and availability for the XCV200-4PQ240C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








