XCV200-4PQ240C

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 57344 5292 240-BFQFP

Quantity 1,623 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-4PQ240C – Virtex® Field Programmable Gate Array (FPGA), 240-BFQFP

The XCV200-4PQ240C is an SRAM-based Virtex® Field Programmable Gate Array supplied in a 240-BFQFP surface-mount package. It combines a dense logic fabric, embedded memory, and flexible I/O to support reconfigurable digital designs for commercial embedded systems and interface-centric applications.

Designed for system-level integration, this device provides 5,292 logic elements, approximately 57,344 bits of on-chip RAM, and 166 user I/O pins, operating from a 2.375 V to 2.625 V core supply and rated for commercial temperature ranges (0 °C to 85 °C). RoHS-compliant and supported by vendor development tools, it targets applications that require programmable logic, memory hierarchy flexibility, and configurable I/O standards.

Key Features

  • Core Logic — 5,292 logic elements (cells) delivering approximately 236,666 system gates of programmable logic density for custom digital functions.
  • Embedded Memory — Approximately 57,344 bits of block RAM with a hierarchical memory architecture; LUTs are configurable for RAM or shift-register modes to support varied storage requirements.
  • I/O Capacity — 166 user I/O pins in a multi-standard SelectIO-style architecture for interfacing to external memories and peripherals.
  • Clock Management — Built-in clock-management circuitry including multiple dedicated delay-locked loops (DLLs) and global/secondary clock distribution nets for low-skew clocking strategies.
  • Arithmetic & DSP Support — Dedicated carry logic and multiplier support to accelerate arithmetic and signal-processing functions within the fabric.
  • Configuration & Reprogrammability — SRAM-based device with in-system configuration capability and multiple programming modes for updates and iterative development.
  • Package & Mounting — 240-BFQFP package (supplier device package: 240-PQFP, 32×32) with surface-mount mounting type suitable for standard PCB assembly.
  • Power & Temperature — Core supply voltage range 2.375 V to 2.625 V; commercial operating range 0 °C to 85 °C.
  • Compliance — RoHS-compliant, and 100% factory tested per manufacturer specification.

Typical Applications

  • PCI and CompactPCI systems — Suitable for designs requiring PCI connectivity and CompactPCI hot-swap compatibility where reconfigurable logic and interface control are needed.
  • Memory interface controllers — Provides fast, configurable interfaces to external high-performance RAMs and ZBTRAM-style devices using abundant I/O and embedded memory.
  • Custom digital processing — Dedicated arithmetic resources and embedded RAM make the device useful for custom signal- and data-processing pipelines in commercial equipment.
  • Prototyping and in-system upgrade — SRAM-based configuration supports in-field reprogramming and iterative hardware development workflows.

Unique Advantages

  • Reprogrammable flexibility: SRAM-based architecture enables unlimited re-programmability and multiple configuration modes for design iteration and field updates.
  • Integrated clock control: Multiple DLLs and hierarchical clock networks reduce the complexity of custom clocking schemes and help maintain low-skew distribution.
  • Balanced logic and memory: A combination of 5,292 logic elements and approximately 57,344 bits of block RAM supports mixed compute-and-storage designs without immediate external memory dependence.
  • Interface versatility: Large I/O count and multi-standard SelectIO-style capability simplify integration with external devices and memory interfaces.
  • Commercial-grade reliability: Operates across a 0 °C to 85 °C range with RoHS compliance and 100% factory testing for predictable procurement and deployment.
  • Supplier development support: Device family features are supported by vendor development systems and libraries to accelerate design implementation.

Why Choose XCV200-4PQ240C?

The XCV200-4PQ240C offers a compact, reconfigurable platform that balances logic density, embedded RAM, and I/O capacity for commercial embedded and system-interface applications. Its SRAM-based architecture and on-chip clock-management features make it well suited to designs that require in-field updates, custom interfacing, and moderate signal-processing capabilities.

Engineers and procurement teams will find this device appropriate for projects that need a programmable logic solution in a 240-BFQFP surface-mount package, with clear electrical and thermal limits for commercial deployments and vendor-backed development resources to support integration and scaling.

Request a quote or contact our sales team to submit a purchase inquiry or obtain pricing and availability for the XCV200-4PQ240C.

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