XCV200-4FG456I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 284 57344 5292 456-BBGA |
|---|---|
| Quantity | 1,490 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 284 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-4FG456I – Virtex® FPGA, 5,292 logic elements, 456‑BBGA
The XCV200-4FG456I is an industrial-grade Virtex® SRAM-based Field Programmable Gate Array (FPGA) optimized for high-performance, high-capacity programmable logic applications. Built on the Virtex architecture, it combines a flexible logic fabric with abundant on-chip memory and comprehensive clock-management resources to address demanding interface, arithmetic and system-integration tasks.
This device targets applications requiring dense logic and substantial I/O — offering 5,292 logic elements, 284 user I/Os and 57,344 bits of embedded RAM — while supporting in-system reprogramming and multiple configuration modes for rapid development and deployment.
Key Features
- Logic Capacity Provides 5,292 logic elements and approximately 236,666 system gates for complex combinational and sequential designs.
- Embedded Memory 57,344 bits of on-chip RAM (approximately 0.057 Mbits) for LUT-RAM, block RAM and small dual-ported storage needs.
- I/O Density 284 user I/Os to support wide parallel buses, multiple interfaces and high-pin-count system connections.
- Clock Management Integrated clock-management circuitry with multiple dedicated delay-locked loops (DLLs) and global/local clock distribution resources for low-skew, multi-domain clocking.
- High-Speed Arithmetic Support Dedicated carry logic and multiplier support to accelerate arithmetic and DSP-oriented functions.
- Flexible Configuration SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes to support iterative development and field updates.
- Package and Mounting 456‑FBGA (23 × 23) package, surface-mount mounting for compact, board-level integration.
- Power and Temperature Operation from 2.375 V to 2.625 V supply and an industrial operating temperature range of −40 °C to 100 °C.
- System Integration Features such as IEEE 1149.1 boundary-scan support and an on-die temperature sensor diode for system diagnostics and manufacturing testability.
Typical Applications
- PCI and CompactPCI Modules Suitable for PCI-compliant designs and CompactPCI modules where hot-swap and reliable bus interfacing are required.
- Interface Bridging and Protocol Conversion High I/O count and multi-standard I/O support enable protocol bridging, interface aggregation and custom peripheral controls.
- Compute-Intensive Logic Dedicated arithmetic resources and abundant logic elements make the device well-suited for high-speed arithmetic, custom accelerators and data-path functions.
Unique Advantages
- High integration density: Combines thousands of logic elements with on-chip RAM and many I/Os to reduce external component count and simplify board-level design.
- Deterministic clocking: Multiple DLLs and hierarchical clock distribution provide low-skew clock domains for reliable multi-clock designs.
- Field reprogrammability: SRAM-based configuration enables in-system updates and iterative design changes without hardware swaps.
- Industrial reliability: Specified for −40 °C to 100 °C operation and supplied in a rugged surface-mount FBGA package suitable for industrial environments.
- Design ecosystem support: Family-level architecture and documented features facilitate reuse of design flows and IP across related Virtex devices.
Why Choose XCV200-4FG456I?
The XCV200-4FG456I brings Virtex family architecture into industrial applications that demand a balance of logic capacity, I/O density and on-chip memory. Its combination of 5,292 logic elements, 284 I/Os, integrated clock-management and SRAM-based reprogrammability makes it a strong candidate for systems requiring iterative development, complex interfacing and mid-range compute capability.
For engineers and procurement teams seeking a robust FPGA with proven Virtex family features—such as dedicated arithmetic support, boundary-scan testability and multiple configuration options—this device delivers the performance and integration needed to shorten development cycles and consolidate system functionality.
Request a quote or submit a procurement inquiry to receive pricing and availability information for the XCV200-4FG456I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








