XCV200-4FG456I

IC FPGA 284 I/O 456FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 284 57344 5292 456-BBGA

Quantity 1,490 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case456-BBGANumber of I/O284Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-4FG456I – Virtex® FPGA, 5,292 logic elements, 456‑BBGA

The XCV200-4FG456I is an industrial-grade Virtex® SRAM-based Field Programmable Gate Array (FPGA) optimized for high-performance, high-capacity programmable logic applications. Built on the Virtex architecture, it combines a flexible logic fabric with abundant on-chip memory and comprehensive clock-management resources to address demanding interface, arithmetic and system-integration tasks.

This device targets applications requiring dense logic and substantial I/O — offering 5,292 logic elements, 284 user I/Os and 57,344 bits of embedded RAM — while supporting in-system reprogramming and multiple configuration modes for rapid development and deployment.

Key Features

  • Logic Capacity  Provides 5,292 logic elements and approximately 236,666 system gates for complex combinational and sequential designs.
  • Embedded Memory  57,344 bits of on-chip RAM (approximately 0.057 Mbits) for LUT-RAM, block RAM and small dual-ported storage needs.
  • I/O Density  284 user I/Os to support wide parallel buses, multiple interfaces and high-pin-count system connections.
  • Clock Management  Integrated clock-management circuitry with multiple dedicated delay-locked loops (DLLs) and global/local clock distribution resources for low-skew, multi-domain clocking.
  • High-Speed Arithmetic Support  Dedicated carry logic and multiplier support to accelerate arithmetic and DSP-oriented functions.
  • Flexible Configuration  SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes to support iterative development and field updates.
  • Package and Mounting  456‑FBGA (23 × 23) package, surface-mount mounting for compact, board-level integration.
  • Power and Temperature  Operation from 2.375 V to 2.625 V supply and an industrial operating temperature range of −40 °C to 100 °C.
  • System Integration  Features such as IEEE 1149.1 boundary-scan support and an on-die temperature sensor diode for system diagnostics and manufacturing testability.

Typical Applications

  • PCI and CompactPCI Modules  Suitable for PCI-compliant designs and CompactPCI modules where hot-swap and reliable bus interfacing are required.
  • Interface Bridging and Protocol Conversion  High I/O count and multi-standard I/O support enable protocol bridging, interface aggregation and custom peripheral controls.
  • Compute-Intensive Logic  Dedicated arithmetic resources and abundant logic elements make the device well-suited for high-speed arithmetic, custom accelerators and data-path functions.

Unique Advantages

  • High integration density: Combines thousands of logic elements with on-chip RAM and many I/Os to reduce external component count and simplify board-level design.
  • Deterministic clocking: Multiple DLLs and hierarchical clock distribution provide low-skew clock domains for reliable multi-clock designs.
  • Field reprogrammability: SRAM-based configuration enables in-system updates and iterative design changes without hardware swaps.
  • Industrial reliability: Specified for −40 °C to 100 °C operation and supplied in a rugged surface-mount FBGA package suitable for industrial environments.
  • Design ecosystem support: Family-level architecture and documented features facilitate reuse of design flows and IP across related Virtex devices.

Why Choose XCV200-4FG456I?

The XCV200-4FG456I brings Virtex family architecture into industrial applications that demand a balance of logic capacity, I/O density and on-chip memory. Its combination of 5,292 logic elements, 284 I/Os, integrated clock-management and SRAM-based reprogrammability makes it a strong candidate for systems requiring iterative development, complex interfacing and mid-range compute capability.

For engineers and procurement teams seeking a robust FPGA with proven Virtex family features—such as dedicated arithmetic support, boundary-scan testability and multiple configuration options—this device delivers the performance and integration needed to shorten development cycles and consolidate system functionality.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XCV200-4FG456I.

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