XCV200-4FG456C

The XCV200-4FG456C is a Virtex-series SRAM-based Field Programmable Gate Array (FPGA) offering a balance of performance and capacity for system-level logic integration. The device provides a dense array of configurable logic blocks and embedded RAM, extensive I/O, and on-chip clock management, suited for applications that require reprogrammable high-speed logic and flexible interfacing.

Key technical attributes include a CLB-based architecture with 1176 configurable logic blocks (approximately 5,292 logic elements), 57,344 total RAM bits, 284 I/O pins, and a supply voltage range of 2.375 V to 2.625 V. The device is supplied in a 456-FBGA (23 × 23) surface-mount package and rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core logic 1176 configurable logic blocks (CLBs) comprising approximately 5,292 logic elements and a device gate count of 236,666, enabling medium-density programmable logic implementations.
• Embedded memory 57,344 total RAM bits provide on-chip block RAM for data buffering, state machines, and small LUT-based memories.
• I/O capability 284 dedicated I/O pins support broad system connectivity and flexible external interfacing.
• Clock management On-chip clock-management circuitry (including dedicated delay-locked loops and multiple global/local clock nets as described in the family datasheet) supports advanced clock control and low-skew distribution for synchronous designs.
• Multi-standard SelectIO Architecture supports multiple high-performance interface standards and direct connections to ZBTRAM devices as detailed in the family specification.
• Configuration and re-programmability SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes enables iterative development and field updates.
• Package and mounting 456-ball FBGA (23 × 23) surface-mount package provides a compact, solderable footprint for board-level integration.
• Power and temperature Operating supply range of 2.375 V to 2.625 V and commercial temperature grade (0 °C to 85 °C) for standard embedded and system-level applications.
• RoHS compliance Device is RoHS compliant for lead-free assembly processes.

Typical Applications

• System-level digital logic Implement glue logic, custom datapaths, and state machines where reprogrammability and mid-range gate count are required.
• PCI and Compact PCI systems Support for bus interfaces and family-documented PCI compliance and hot-swap capability make the device suitable for legacy PCI-based boards and Compact PCI modules.
• Memory interfacing and buffering On-chip RAM and SelectIO support enable tight interfaces to external memory and buffering for data stream management.

Unique Advantages

• Configurable density and routing A CLB-rich architecture with abundant routing resources lets designers trade off speed and density to match application needs.
• Built-in clock control Dedicated DLLs and multiple clock distribution nets reduce clock skew and simplify synchronous design across the fabric.
• Flexible I/O and interface support Broad I/O count and multi-standard SelectIO capabilities ease integration with diverse peripheral and memory devices.
• Re-programmable SRAM configuration Unlimited in-system re-programmability enables iterative development, field upgrades, and design flexibility without hardware changes.
• Compact surface-mount package 456-FBGA packaging provides a high-pin-count solution in a compact footprint for dense board designs.

Why Choose XCV200-4FG456C?

The XCV200-4FG456C delivers a practical balance of logic capacity, embedded memory, and I/O for designers needing a reprogrammable mid-density FPGA. Its CLB-based architecture, on-chip clock management, and SelectIO interface support make it suitable for system logic, legacy bus implementations, and memory-interfacing roles where flexibility and iterative development matter.

Designed for commercial-temperature applications and supplied in a 456-FBGA package, this Virtex FPGA offers established design tooling and configuration modes for teams building or maintaining complex digital systems that require field reprogramming and compact board-level integration.

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