XCV200-5BG256I

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 57344 5292 256-BBGA

Quantity 45 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-5BG256I – Virtex® Field Programmable Gate Array IC, 256‑BBGA

The XCV200-5BG256I is an industrial‑grade Virtex® SRAM‑based Field Programmable Gate Array (FPGA) supplied in a 256‑ball BGA package. It combines programmable logic, embedded memory, multi‑standard I/O and on‑chip clock management to support high‑performance, reprogrammable digital designs.

This device targets applications that require dense, reconfigurable logic with robust I/O and temperature capability, offering measurable capacity and system features for prototyping and production designs where industrial temperature range and RoHS compliance are required.

Key Features

  • Logic Capacity — 5,292 logic elements (logic cells) and 236,666 system gates provide substantial programmable logic for mid‑range designs.
  • Embedded Memory — Approximately 57 kbits (57,344 bits) of on‑chip RAM with hierarchical memory options (LUTs configurable as RAM, configurable 4k‑bit dual‑ported RAMs) for flexible data buffering and state storage.
  • I/O — 180 user I/O pins with Multi‑standard SelectIO™ support and 16 high‑performance interface standards for direct interfacing to a variety of external devices and memory.
  • Clocking and Timing — Four dedicated delay‑locked loops (DLLs), four primary low‑skew global clock nets and 24 secondary local clock nets for advanced clock distribution and control.
  • Configuration and Reprogrammability — SRAM‑based in‑system configuration with unlimited re‑programmability and four programming modes (Select‑MAP™, serial, JTAG, etc.).
  • Process and Testing — Implemented in a 0.22 μm, 5‑layer metal CMOS process and 100% factory tested.
  • Package and Mounting — 256‑BBGA package (supplier device package: 256‑PBGA, 27×27) optimized for surface‑mount assembly.
  • Power and Temperature — Recommended voltage supply 2.375 V to 2.625 V and industrial operating temperature range from −40 °C to 100 °C.
  • Standards and Features — System performance up to 200 MHz, 66‑MHz PCI compliance and hot‑swappable capability for Compact PCI environments as documented for the Virtex family.
  • Environmental — RoHS compliant.

Typical Applications

  • High‑performance digital processing — Use the device’s 5,292 logic elements and embedded RAM for mid‑range signal processing, protocol handling and custom compute kernels.
  • PCI and CompactPCI systems — 66‑MHz PCI compliance and hot‑swap capability make it suitable for I/O‑intensive boards and modular compute subsystems.
  • Memory interface and bridging — Multi‑standard SelectIO™ and fast external RAM interfaces enable memory controller, bridge and interface conversion implementations.
  • In‑system reconfigurable designs — SRAM based configuration and unlimited reprogramming support iterative development, field updates and prototyping workflows.

Unique Advantages

  • Balanced logic and memory density: 5,292 logic elements and 57,344 bits of embedded RAM provide a strong balance of compute and storage for mid‑range FPGA designs.
  • Advanced clock control: Four DLLs and a hierarchical clock network enable precise timing and multi‑domain clocking strategies.
  • Flexible I/O connectivity: 180 I/O pins with SelectIO™ support simplify integration with diverse peripherals and external memory devices.
  • Industrial temperature rating: Specified for −40 °C to 100 °C, supporting deployment in demanding thermal environments.
  • SRAM‑based reconfiguration: In‑system programming modes and unlimited reprogramming streamline development cycles and field upgrades.
  • Proven process and test pedigree: 0.22 μm, 5‑layer metal process and 100% factory testing contribute to predictable behavior and manufacturability.

Why Choose XCV200-5BG256I?

The XCV200-5BG256I positions itself as a versatile mid‑range Virtex FPGA that combines measurable logic capacity, embedded memory and extensive I/O in a compact 256‑BBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for deployments that require reprogrammable logic with environmental robustness.

Engineers and procurement teams will find this device suitable for designs that need reliable in‑system reconfiguration, advanced clocking, and multi‑standard interfacing while leveraging the Virtex family’s development ecosystem and factory‑tested silicon characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for the XCV200-5BG256I and to discuss how it fits your next design.

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