XCV200-5FG256I

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 57344 5292 256-BGA

Quantity 175 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-5FG256I – Virtex® Field Programmable Gate Array (FPGA) IC 176 57344 5292 256-BGA

The XCV200-5FG256I is an industrial-grade Virtex® FPGA in a 256-ball BGA package, offering a balance of programmable logic capacity and embedded memory for system-level integration. Built on the Virtex architecture, this SRAM-based device provides in-system re-programmability and a rich set of on-chip resources suitable for high-performance interface, memory and clock-management functions.

This device targets designs that require deterministic operating range and industrial temperature support, with a 2.375 V to 2.625 V supply range and an operating temperature of −40 °C to 100 °C.

Key Features

  • Logic Capacity — 5,292 logic elements providing substantial programmable logic for custom digital functions; reported system gate equivalent of 236,666.
  • Embedded Memory — 57,344 bits of on-chip RAM (approximately 0.057 Mbits) for LUT-based and block RAM implementations.
  • I/O and Package — 176 I/O pins in a 256-BGA package footprint; supplied package variant 256-FBGA (17×17); surface-mount mounting type.
  • Industrial Grade and Temperature Range — Industrial grade device rated for −40 °C to 100 °C operation and RoHS compliant.
  • Clock and Timing Resources — Built-in clock-management circuitry including multiple dedicated delay-locked loops (DLLs) and multi-level global/local clock distribution (as documented for the Virtex family).
  • Flexible Memory Modes — Configurable LUTs that support multiple RAM modes and dedicated 4k-bit synchronous dual-ported RAM blocks (family-level capability documented in the Virtex series).
  • High-Speed Interface Support — Multi-standard SelectIO™ interfaces and support for common high-performance interface standards (family-level features documented in the Virtex series).
  • SRAM-Based, In-System Configuration — Re-programmable configuration with multiple programming modes (SelectMAP™, slave serial, JTAG, and master serial documented for the Virtex series).
  • Process Technology — Implemented on a 0.22 μm, 5-layer-metal CMOS process (family-level detail from the Virtex specification).

Typical Applications

  • PCI and Compact PCI Systems — Suitable for designs requiring 66-MHz PCI compliance and hot-swappable Compact PCI support as described for the Virtex family.
  • High-performance Interfaces — Use for protocol bridging and interface aggregation where multi-standard SelectIO support and abundant I/O are needed.
  • Memory-Intensive Logic — Ideal for designs that leverage on-chip block RAM and LUT-based RAM configurations for buffering and small data stores.
  • Clock-Managed Systems — Applications that require precise clock distribution and programmable delay management using on-chip DLLs and global/local clock nets.

Unique Advantages

  • Re-programmability: SRAM-based configuration enables unlimited re-programmability and in-system updates to iterate designs without hardware changes.
  • Integrated Memory Options: On-chip RAM plus LUT-configurable RAM modes reduce external memory dependency for small to mid-size data buffering.
  • Industrial Reliability: Industrial-grade temperature rating (−40 °C to 100 °C) and surface-mount packaging support deployment in demanding environments.
  • Comprehensive Clock Control: Dedicated DLLs and multiple clock distribution nets support complex timing domains and low-skew clocking strategies.
  • Proven Process and Testing: Documented 0.22 μm, 5-layer-metal process and 100% factory testing noted at the family level help ensure consistent device quality.

Why Choose XCV200-5FG256I?

The XCV200-5FG256I combines mid-range FPGA capacity—5,292 logic elements and 57,344 bits of embedded RAM—with Virtex family clocking and I/O capabilities, delivering a flexible programmable solution for industrial applications. Its operating voltage window and −40 °C to 100 °C rating make it well suited for systems that require stable operation across a wide temperature range.

This device is appropriate for engineering teams seeking a re-programmable logic element with on-chip memory and advanced clock management documented in the Virtex specification, enabling rapid iteration and integration in systems with moderate logic and memory requirements.

Request a quote or submit a pricing inquiry to check availability and lead times for the XCV200-5FG256I.

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