XCV200-5FG456C

The XCV200-5FG456C is a Virtex® SRAM-based Field Programmable Gate Array optimized for high-density, reprogrammable logic. It integrates a flexible array of configurable logic blocks and abundant routing resources to support complex, custom digital designs across compute, communications and system-control applications.

Key on-chip resources include 5,292 logic cells (1,176 CLBs), approximately 57,344 bits of embedded RAM, and 284 user I/O pins. The device is supplied in a 456-ball BGA package and is offered in a commercial grade with RoHS compliance.

Key Features

• Logic Capacity — 5,292 logic cells arranged in 1,176 CLBs, providing 236,666 system gates for implementing high-density logic functions.
• Embedded Memory — 57,344 bits of on-chip RAM suitable for lookup tables, small FIFOs and distributed storage within logic paths.
• I/O Flexibility — 284 general-purpose I/O pins with support for multi-standard SelectIO interfaces and high-performance I/O standards.
• Clock Management — Multiple dedicated clock resources including four delay-locked loops (DLLs), four primary low-skew global clocks and 24 secondary local clock nets for advanced clock control and distribution.
• Configuration and Reprogrammability — SRAM-based device architecture enabling in-system reconfiguration and multiple programming modes.
• Package and Mounting — Surface-mount 456-ball BGA (supplier package: 456-FBGA, 23 × 23 mm) for compact board integration.
• Supply and Operating Range — Core supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C.
• Quality and Compliance — 100% factory tested and RoHS compliant; commercial-grade device.

Typical Applications

• PCI and Compact PCI Systems — Implement custom interfacing, bridging and protocol logic using the device’s high-performance I/O and family-level 66-MHz PCI compatibility and hot-swap support.
• Communications and Interface Engines — Use SelectIO multi-standard interfaces and abundant I/O to connect to diverse transceiver and memory interfaces for packet processing or protocol translation.
• Hardware Acceleration and Custom Processing — Deploy custom datapaths and arithmetic functions using dedicated carry and multiplier support together with the device’s logic capacity.
• In-System Prototyping and Reconfigurable Control — Leverage SRAM-based reprogrammability for iterative development, field updates and adaptive system control.

Unique Advantages

• High-density, reprogrammable logic: 5,292 logic cells across 1,176 CLBs and 236,666 system gates enable substantial custom logic integration on a single device.
• Flexible memory hierarchy: 57,344 bits of embedded RAM provide local storage for LUT-based RAM, FIFOs and small buffers without external components.
• Robust clocking resources: Four DLLs and a hierarchical clock network reduce clock skew and simplify multi-clock designs.
• Versatile I/O: 284 I/O pins and multi-standard SelectIO support enable direct interfacing to a wide range of external devices and memory.
• Compact package: 456-BBGA (23 × 23 mm supplier package) offers a high-pin-count, space-efficient option for dense board layouts.
• Commercial readiness: RoHS-compliant and 100% factory tested for production deployment in commercial-temperature systems.

Why Choose XCV200-5FG456C?

The XCV200-5FG456C positions itself as a high-density, reprogrammable logic platform that balances logic capacity, embedded memory and flexible I/O in a compact BGA package. Its SRAM-based architecture and on-chip clock-management features support complex, timing-sensitive designs while enabling in-system updates and iterative development.

This device is suitable for engineers and teams building custom interface logic, protocol engines, hardware-accelerated functions and reconfigurable prototypes who need a commercially graded, RoHS-compliant FPGA with proven family-level support and configuration options.

Request a quote or submit your parts inquiry to evaluate XCV200-5FG456C for your next design or volume requirement.