XCV200-5FG256C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 176 57344 5292 256-BGA |
|---|---|
| Quantity | 1,434 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-5FG256C – Virtex® Field Programmable Gate Array (FPGA) IC, 176 I/O, 256-BGA
The XCV200-5FG256C is a Virtex® SRAM-based FPGA providing a high-density, reprogrammable logic fabric for commercial electronic designs. It integrates approximately 5,292 logic elements and about 236,666 system gates, coupled with roughly 57,344 bits of embedded RAM and 176 general-purpose I/O pins to support complex custom logic and high‑speed interfaces.
Built on the Virtex family architecture, the device targets commercial applications that require in-system configurability, flexible clock management, and a balance of performance and integration within a 256-BGA (256-FBGA 17×17) surface-mount package.
Key Features
- Programmable Logic Capacity Approximately 5,292 logic elements providing up to 236,666 system gates for implementing complex combinational and sequential logic.
- On-chip Memory About 57,344 bits of embedded RAM with a hierarchical memory architecture; LUTs can be configured as RAM or shift registers and support dual-ported RAM structures.
- I/O and Interface Flexibility 176 user I/O pins and multi-standard SelectIO interfaces (series-level feature) to accommodate a variety of interface standards and external memories.
- Clock Management Built-in clock-management circuitry including multiple delay-locked loops (DLLs) and dedicated global and local clock distribution resources for precise timing control.
- Configuration and Re-programmability SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for development and field updates.
- Package and Mounting Supplied in a 256-BGA (256-FBGA, 17×17) surface-mount package for compact board integration.
- Power and Temperature Core supply operating range 2.375 V to 2.625 V; commercial-grade operating temperature range 0 °C to 85 °C.
- Manufacturing and Compliance Fabricated on a 0.22 μm, 5-layer-metal process and 100% factory tested; RoHS compliant.
Typical Applications
- PCI and Compact PCI systems – Supports 66‑MHz PCI compliance and hot-swappable Compact PCI configurations at the series level, useful for commercial I/O and data-transport applications.
- Prototyping and Algorithm Acceleration – Reprogrammable fabric and abundant logic resources make the device suitable for hardware prototyping and accelerating compute‑intensive algorithms.
- High-speed Interface Bridging – Multi-standard SelectIO interfaces and a high I/O count enable protocol bridging and custom interface implementations with external memories and peripherals.
- Commercial Embedded Systems – Compact 256‑BGA package, commercial temperature grade, and flexible configuration modes suit embedded equipment requiring field updates.
Unique Advantages
- High integration density: Delivers approximately 236,666 system gates and 5,292 logic elements in a single device, reducing board-level component count.
- Flexible memory resources: About 57,344 bits of on-chip RAM and configurable LUT-based memory enable varied data-path and buffering schemes without external RAM.
- Comprehensive clock control: Dedicated DLLs and multiple global/local clock nets simplify clock-tree design for high-performance logic blocks.
- Robust configuration options: SRAM-based in-system configuration with multiple programming modes supports iterative development and field reconfiguration.
- Practical packaging and supply: 256-FBGA (17×17) surface-mount package and a defined supply range (2.375–2.625 V) ease integration into commercial board designs.
- Regulatory and test readiness: 100% factory-tested device and RoHS compliance support manufacturing and environmental requirements.
Why Choose XCV200-5FG256C?
The XCV200-5FG256C provides a balanced combination of logic capacity, embedded memory, and flexible I/O in a compact 256‑BGA package, making it a practical choice for commercial embedded systems, interface bridging, and prototype-to-production workflows. Its SRAM-based architecture and multiple configuration modes enable rapid iteration and in‑field updates.
Engineers seeking a Virtex-family FPGA solution will benefit from the device’s clock-management features, sizable logic fabric, and development ecosystem support indicated at the series level, offering a scalable path for designs that require reprogrammability and integration in a commercial-temperature environment.
If you would like pricing or availability information, request a quote or submit an inquiry and our team will provide a formal quote and lead-time details.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








