XCV200-5FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 57344 5292 256-BGA

Quantity 1,434 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-5FG256C – Virtex® Field Programmable Gate Array (FPGA) IC, 176 I/O, 256-BGA

The XCV200-5FG256C is a Virtex® SRAM-based FPGA providing a high-density, reprogrammable logic fabric for commercial electronic designs. It integrates approximately 5,292 logic elements and about 236,666 system gates, coupled with roughly 57,344 bits of embedded RAM and 176 general-purpose I/O pins to support complex custom logic and high‑speed interfaces.

Built on the Virtex family architecture, the device targets commercial applications that require in-system configurability, flexible clock management, and a balance of performance and integration within a 256-BGA (256-FBGA 17×17) surface-mount package.

Key Features

  • Programmable Logic Capacity Approximately 5,292 logic elements providing up to 236,666 system gates for implementing complex combinational and sequential logic.
  • On-chip Memory About 57,344 bits of embedded RAM with a hierarchical memory architecture; LUTs can be configured as RAM or shift registers and support dual-ported RAM structures.
  • I/O and Interface Flexibility 176 user I/O pins and multi-standard SelectIO interfaces (series-level feature) to accommodate a variety of interface standards and external memories.
  • Clock Management Built-in clock-management circuitry including multiple delay-locked loops (DLLs) and dedicated global and local clock distribution resources for precise timing control.
  • Configuration and Re-programmability SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for development and field updates.
  • Package and Mounting Supplied in a 256-BGA (256-FBGA, 17×17) surface-mount package for compact board integration.
  • Power and Temperature Core supply operating range 2.375 V to 2.625 V; commercial-grade operating temperature range 0 °C to 85 °C.
  • Manufacturing and Compliance Fabricated on a 0.22 μm, 5-layer-metal process and 100% factory tested; RoHS compliant.

Typical Applications

  • PCI and Compact PCI systems – Supports 66‑MHz PCI compliance and hot-swappable Compact PCI configurations at the series level, useful for commercial I/O and data-transport applications.
  • Prototyping and Algorithm Acceleration – Reprogrammable fabric and abundant logic resources make the device suitable for hardware prototyping and accelerating compute‑intensive algorithms.
  • High-speed Interface Bridging – Multi-standard SelectIO interfaces and a high I/O count enable protocol bridging and custom interface implementations with external memories and peripherals.
  • Commercial Embedded Systems – Compact 256‑BGA package, commercial temperature grade, and flexible configuration modes suit embedded equipment requiring field updates.

Unique Advantages

  • High integration density: Delivers approximately 236,666 system gates and 5,292 logic elements in a single device, reducing board-level component count.
  • Flexible memory resources: About 57,344 bits of on-chip RAM and configurable LUT-based memory enable varied data-path and buffering schemes without external RAM.
  • Comprehensive clock control: Dedicated DLLs and multiple global/local clock nets simplify clock-tree design for high-performance logic blocks.
  • Robust configuration options: SRAM-based in-system configuration with multiple programming modes supports iterative development and field reconfiguration.
  • Practical packaging and supply: 256-FBGA (17×17) surface-mount package and a defined supply range (2.375–2.625 V) ease integration into commercial board designs.
  • Regulatory and test readiness: 100% factory-tested device and RoHS compliance support manufacturing and environmental requirements.

Why Choose XCV200-5FG256C?

The XCV200-5FG256C provides a balanced combination of logic capacity, embedded memory, and flexible I/O in a compact 256‑BGA package, making it a practical choice for commercial embedded systems, interface bridging, and prototype-to-production workflows. Its SRAM-based architecture and multiple configuration modes enable rapid iteration and in‑field updates.

Engineers seeking a Virtex-family FPGA solution will benefit from the device’s clock-management features, sizable logic fabric, and development ecosystem support indicated at the series level, offering a scalable path for designs that require reprogrammability and integration in a commercial-temperature environment.

If you would like pricing or availability information, request a quote or submit an inquiry and our team will provide a formal quote and lead-time details.

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