XCV200-5BG352I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 905 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 352-MBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-LBGA Exposed Pad, Metal | Number of I/O | 260 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-5BG352I – Virtex® Field Programmable Gate Array, 352-LBGA Exposed Pad
The XCV200-5BG352I is a Virtex® SRAM-based Field Programmable Gate Array (FPGA) in a 352-LBGA exposed pad metal package, designed for industrial-grade embedded and system-level digital logic applications. It delivers a high-density, reprogrammable logic fabric with substantial on-chip resources for custom digital processing, interface bridging, and system prototyping.
Built on the Virtex family architecture, the device emphasizes configurable logic density, multi-standard I/O capability, and on-chip memory and clock-management features—enabling flexible implementation of complex logic functions within an industrial temperature range.
Key Features
- Logic Capacity: Provides 5,292 logic elements and approximately 236,666 system gates to implement complex digital designs.
- Embedded Memory: Approximately 0.057 Mbits of embedded RAM (57,344 bits) for LUT-configurable RAM and block RAM structures.
- I/O Density & Interface Support: 260 user I/Os and multi-standard SelectIO™ interfaces supporting 16 high-performance interface standards; series-level support includes 66-MHz PCI compliance and CompactPCI hot-swap capability.
- Clock Management: Four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, plus 24 secondary local clock nets for advanced clock control and low-jitter distribution.
- Arithmetic & DSP Support: Dedicated carry logic, dedicated multiplier support, and cascade chains for efficient implementation of wide arithmetic and DSP functions.
- Configuration & Reprogrammability: SRAM-based in-system configuration with unlimited re-programmability and four programming modes for flexible deployment and iterative development.
- Process & Quality: Manufactured on a 0.22 µm, 5-layer metal process and 100% factory tested to ensure consistent production quality.
- Package & Mounting: Surface-mount 352-LBGA exposed pad metal package (supplier package 352-MBGA 35×35) for compact board-level integration.
- Industrial Temperature & Power: Industrial operating temperature range of −40 °C to 100 °C and recommended supply voltage range of 2.375 V to 2.625 V for core operation.
- System Reliability: Includes IEEE 1149.1 boundary-scan logic and an on-die temperature sensor diode to aid testing and system monitoring.
Typical Applications
- PCI and CompactPCI Systems: Implement high-performance interface logic and custom bridging with support for 66-MHz PCI and CompactPCI hot-swap capability.
- Digital Signal Processing & Arithmetic Engines: Use dedicated multipliers, carry logic, and abundant registers to implement DSP blocks, filters, and arithmetic accelerators.
- System Prototyping and Custom Logic: Leverage SRAM-based in-system reprogrammability to iterate hardware designs, replace mask-programmed arrays, or validate system-level logic prior to production.
- High-Density Embedded Control: Deploy compact, industrial-temperature FPGA solutions where a mix of I/O density, on-chip memory, and reconfigurability is required.
Unique Advantages
- High integration density: 5,292 logic elements and 236,666 gates reduce the need for external glue logic and lower system BOM complexity.
- Flexible memory architecture: 57,344 bits of embedded RAM support LUT-configurable RAM, dual-ported RAMs, and shift-register implementations for diverse data-storage needs.
- Multi-standard I/O readiness: SelectIO multi-standard interfaces and 260 I/Os simplify connectivity to a wide range of peripherals and memory devices.
- Robust clocking resources: Multiple DLLs and hierarchical clock nets enable precise, low-skew clock distribution for synchronous, high-speed designs.
- Industrial reliability: Specified for −40 °C to 100 °C operation and 100% factory tested for consistent behavior in demanding environments.
- Reprogrammable development path: SRAM-based configuration with multiple programming modes supports iterative development and in-system updates.
Why Choose XCV200-5BG352I?
The XCV200-5BG352I combines a balance of logic capacity, embedded memory, and extensive I/O in a compact 352-LBGA package tailored for industrial environments. Its Virtex family architecture provides configurable resources and clock-management features that help implement complex digital functions while enabling iterative development through SRAM-based reprogrammability.
Engineers and system designers seeking a high-density, reprogrammable FPGA for PCI/CompactPCI systems, DSP acceleration, or custom embedded control will find the XCV200-5BG352I offers a proven architecture, series-level performance capabilities, and production-grade manufacturing quality.
Request a quote or submit an inquiry to receive pricing and availability information for the XCV200-5BG352I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








