XCV200-5BG352I

IC FPGA 260 I/O 352MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal

Quantity 905 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-5BG352I – Virtex® Field Programmable Gate Array, 352-LBGA Exposed Pad

The XCV200-5BG352I is a Virtex® SRAM-based Field Programmable Gate Array (FPGA) in a 352-LBGA exposed pad metal package, designed for industrial-grade embedded and system-level digital logic applications. It delivers a high-density, reprogrammable logic fabric with substantial on-chip resources for custom digital processing, interface bridging, and system prototyping.

Built on the Virtex family architecture, the device emphasizes configurable logic density, multi-standard I/O capability, and on-chip memory and clock-management features—enabling flexible implementation of complex logic functions within an industrial temperature range.

Key Features

  • Logic Capacity: Provides 5,292 logic elements and approximately 236,666 system gates to implement complex digital designs.
  • Embedded Memory: Approximately 0.057 Mbits of embedded RAM (57,344 bits) for LUT-configurable RAM and block RAM structures.
  • I/O Density & Interface Support: 260 user I/Os and multi-standard SelectIO™ interfaces supporting 16 high-performance interface standards; series-level support includes 66-MHz PCI compliance and CompactPCI hot-swap capability.
  • Clock Management: Four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, plus 24 secondary local clock nets for advanced clock control and low-jitter distribution.
  • Arithmetic & DSP Support: Dedicated carry logic, dedicated multiplier support, and cascade chains for efficient implementation of wide arithmetic and DSP functions.
  • Configuration & Reprogrammability: SRAM-based in-system configuration with unlimited re-programmability and four programming modes for flexible deployment and iterative development.
  • Process & Quality: Manufactured on a 0.22 µm, 5-layer metal process and 100% factory tested to ensure consistent production quality.
  • Package & Mounting: Surface-mount 352-LBGA exposed pad metal package (supplier package 352-MBGA 35×35) for compact board-level integration.
  • Industrial Temperature & Power: Industrial operating temperature range of −40 °C to 100 °C and recommended supply voltage range of 2.375 V to 2.625 V for core operation.
  • System Reliability: Includes IEEE 1149.1 boundary-scan logic and an on-die temperature sensor diode to aid testing and system monitoring.

Typical Applications

  • PCI and CompactPCI Systems: Implement high-performance interface logic and custom bridging with support for 66-MHz PCI and CompactPCI hot-swap capability.
  • Digital Signal Processing & Arithmetic Engines: Use dedicated multipliers, carry logic, and abundant registers to implement DSP blocks, filters, and arithmetic accelerators.
  • System Prototyping and Custom Logic: Leverage SRAM-based in-system reprogrammability to iterate hardware designs, replace mask-programmed arrays, or validate system-level logic prior to production.
  • High-Density Embedded Control: Deploy compact, industrial-temperature FPGA solutions where a mix of I/O density, on-chip memory, and reconfigurability is required.

Unique Advantages

  • High integration density: 5,292 logic elements and 236,666 gates reduce the need for external glue logic and lower system BOM complexity.
  • Flexible memory architecture: 57,344 bits of embedded RAM support LUT-configurable RAM, dual-ported RAMs, and shift-register implementations for diverse data-storage needs.
  • Multi-standard I/O readiness: SelectIO multi-standard interfaces and 260 I/Os simplify connectivity to a wide range of peripherals and memory devices.
  • Robust clocking resources: Multiple DLLs and hierarchical clock nets enable precise, low-skew clock distribution for synchronous, high-speed designs.
  • Industrial reliability: Specified for −40 °C to 100 °C operation and 100% factory tested for consistent behavior in demanding environments.
  • Reprogrammable development path: SRAM-based configuration with multiple programming modes supports iterative development and in-system updates.

Why Choose XCV200-5BG352I?

The XCV200-5BG352I combines a balance of logic capacity, embedded memory, and extensive I/O in a compact 352-LBGA package tailored for industrial environments. Its Virtex family architecture provides configurable resources and clock-management features that help implement complex digital functions while enabling iterative development through SRAM-based reprogrammability.

Engineers and system designers seeking a high-density, reprogrammable FPGA for PCI/CompactPCI systems, DSP acceleration, or custom embedded control will find the XCV200-5BG352I offers a proven architecture, series-level performance capabilities, and production-grade manufacturing quality.

Request a quote or submit an inquiry to receive pricing and availability information for the XCV200-5BG352I.

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