XCV200-4BG352C

IC FPGA 260 I/O 352MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal

Quantity 553 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates236666ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XCV200-4BG352C – Virtex® FPGA, 5,292 logic elements, 260 I/O, 352‑LBGA

The XCV200-4BG352C is a commercial-grade Virtex® Field Programmable Gate Array (FPGA) featuring 5,292 logic elements, approximately 57,344 bits of on-chip RAM, and up to 260 user I/O. Built on the Virtex architecture, this SRAM-based device targets high-performance, reprogrammable digital designs for commercial embedded systems, instrumentation, and prototype development.

Designed for flexible clocking, multi-standard I/O, and a hierarchical memory architecture, the XCV200-4BG352C delivers integration and configurability for applications that require substantial I/O density and on-chip memory in a surface-mount 352-LBGA exposed-pad package.

Key Features

  • Core Density — 5,292 logic elements and a device gate count of 236,666 system gates provide a solid capacity for moderate-complexity logic and control implementations.
  • Embedded Memory — Approximately 57,344 bits of block RAM and configurable LUT-based RAM support local data storage and fast on-chip buffering.
  • I/O — Up to 260 user I/O pins with multi-standard SelectIO™ interface capability for flexible external connectivity and memory interfacing.
  • Clock and Timing — Built-in clock-management with four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and additional local clock nets for precise clock distribution and control.
  • Arithmetic and Logic Support — Dedicated carry logic, multiplier support, and cascade chain features for implementing high-speed arithmetic and wide-input functions.
  • Configuration and Reprogrammability — SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability for iterative development and field updates.
  • Process and Quality — Fabricated on a 0.22 μm, five-layer metal CMOS process and 100% factory tested to support consistent manufacturing quality.
  • Package and Mounting — Surface-mount 352-LBGA exposed pad, metal package (supplier device package: 352-MBGA, 35×35) suitable for compact PCB layouts.
  • Electrical and Environmental — Voltage supply range from 2.375 V to 2.625 V; commercial operating temperature range from 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Embedded Control and Prototyping — Use for control logic, state machines, and rapid prototyping where reprogrammability and on-chip memory ease design iteration.
  • High‑Density I/O Interfaces — Ideal for systems requiring many parallel or mixed-standard interfaces up to 260 I/O pins, including memory and peripheral interfacing.
  • Digital Signal Processing Support — Leverage dedicated arithmetic resources and on-chip RAM for moderate DSP tasks and data buffering.
  • PCI/Compact PCI Integration — Supports 66‑MHz PCI-compliant operation and hot‑swappable Compact PCI configurations for commercial computing and I/O expansion.

Unique Advantages

  • Reprogrammable Flexibility: SRAM-based configuration allows unlimited re-programmability and multiple programming modes to support development and field updates.
  • Balanced Integration: Combines logic density, on-chip RAM, and extensive I/O in a single 352-LBGA package to reduce board-level component count.
  • Clocking Precision: Four dedicated DLLs and low-skew clock distribution enable reliable multi-clock designs and simplified timing management.
  • Design Tool Ecosystem: Supported by the FPGA Foundation™ and Alliance development systems referenced in the product documentation to aid design flow and deployment.
  • Proven Manufacturing Process: 0.22 μm five-layer-metal CMOS process and 100% factory testing provide consistent device quality for commercial applications.
  • RoHS Compliant: Environmentally compliant for markets that require lead-free assembly practices.

Why Choose XCV200-4BG352C?

The XCV200-4BG352C brings a practical combination of logic capacity, on-chip memory, flexible I/O, and robust clock-management features in a compact 352-LBGA package. Its commercial-grade operating range, reprogrammable SRAM architecture, and support for multi-standard interfaces make it well suited for engineers developing embedded systems, instrumentation, and prototype platforms that require mid-range FPGA resources.

Backed by the Virtex family architecture and documented tool support, this device offers a scalable platform for designs that may later migrate to other Virtex devices within the product family while maintaining a consistent development flow.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the XCV200-4BG352C.

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