XCV200-4BG352C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 260 57344 5292 352-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 553 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 352-MBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-LBGA Exposed Pad, Metal | Number of I/O | 260 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 236666 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XCV200-4BG352C – Virtex® FPGA, 5,292 logic elements, 260 I/O, 352‑LBGA
The XCV200-4BG352C is a commercial-grade Virtex® Field Programmable Gate Array (FPGA) featuring 5,292 logic elements, approximately 57,344 bits of on-chip RAM, and up to 260 user I/O. Built on the Virtex architecture, this SRAM-based device targets high-performance, reprogrammable digital designs for commercial embedded systems, instrumentation, and prototype development.
Designed for flexible clocking, multi-standard I/O, and a hierarchical memory architecture, the XCV200-4BG352C delivers integration and configurability for applications that require substantial I/O density and on-chip memory in a surface-mount 352-LBGA exposed-pad package.
Key Features
- Core Density — 5,292 logic elements and a device gate count of 236,666 system gates provide a solid capacity for moderate-complexity logic and control implementations.
- Embedded Memory — Approximately 57,344 bits of block RAM and configurable LUT-based RAM support local data storage and fast on-chip buffering.
- I/O — Up to 260 user I/O pins with multi-standard SelectIO™ interface capability for flexible external connectivity and memory interfacing.
- Clock and Timing — Built-in clock-management with four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and additional local clock nets for precise clock distribution and control.
- Arithmetic and Logic Support — Dedicated carry logic, multiplier support, and cascade chain features for implementing high-speed arithmetic and wide-input functions.
- Configuration and Reprogrammability — SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability for iterative development and field updates.
- Process and Quality — Fabricated on a 0.22 μm, five-layer metal CMOS process and 100% factory tested to support consistent manufacturing quality.
- Package and Mounting — Surface-mount 352-LBGA exposed pad, metal package (supplier device package: 352-MBGA, 35×35) suitable for compact PCB layouts.
- Electrical and Environmental — Voltage supply range from 2.375 V to 2.625 V; commercial operating temperature range from 0 °C to 85 °C. RoHS compliant.
Typical Applications
- Embedded Control and Prototyping — Use for control logic, state machines, and rapid prototyping where reprogrammability and on-chip memory ease design iteration.
- High‑Density I/O Interfaces — Ideal for systems requiring many parallel or mixed-standard interfaces up to 260 I/O pins, including memory and peripheral interfacing.
- Digital Signal Processing Support — Leverage dedicated arithmetic resources and on-chip RAM for moderate DSP tasks and data buffering.
- PCI/Compact PCI Integration — Supports 66‑MHz PCI-compliant operation and hot‑swappable Compact PCI configurations for commercial computing and I/O expansion.
Unique Advantages
- Reprogrammable Flexibility: SRAM-based configuration allows unlimited re-programmability and multiple programming modes to support development and field updates.
- Balanced Integration: Combines logic density, on-chip RAM, and extensive I/O in a single 352-LBGA package to reduce board-level component count.
- Clocking Precision: Four dedicated DLLs and low-skew clock distribution enable reliable multi-clock designs and simplified timing management.
- Design Tool Ecosystem: Supported by the FPGA Foundation™ and Alliance development systems referenced in the product documentation to aid design flow and deployment.
- Proven Manufacturing Process: 0.22 μm five-layer-metal CMOS process and 100% factory testing provide consistent device quality for commercial applications.
- RoHS Compliant: Environmentally compliant for markets that require lead-free assembly practices.
Why Choose XCV200-4BG352C?
The XCV200-4BG352C brings a practical combination of logic capacity, on-chip memory, flexible I/O, and robust clock-management features in a compact 352-LBGA package. Its commercial-grade operating range, reprogrammable SRAM architecture, and support for multi-standard interfaces make it well suited for engineers developing embedded systems, instrumentation, and prototype platforms that require mid-range FPGA resources.
Backed by the Virtex family architecture and documented tool support, this device offers a scalable platform for designs that may later migrate to other Virtex devices within the product family while maintaining a consistent development flow.
Request a quote or submit an inquiry to receive pricing, availability, and support information for the XCV200-4BG352C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








