XCV200-4BG256C

The XCV200-4BG256C is a Virtex SRAM-based Field Programmable Gate Array (FPGA) designed for high-density, reconfigurable digital logic. Its fabric combines 5,292 logic elements with approximately 57,344 bits of embedded memory and dedicated arithmetic resources to support complex control, signal processing and glue-logic functions.

Built on a multi-layer CMOS process and supported by the Virtex architecture, this device targets system designers and OEMs who need flexible, reprogrammable logic with extensive I/O and clocking resources in a 256-ball BGA surface-mount package.

Key Features

• Logic Capacity — 5,292 logic elements and approximately 236,666 system gates provide substantial on-chip logic for medium-complexity designs.
• Embedded Memory — Approximately 57,344 bits of on-chip RAM, with LUTs configurable as 16-bit/32-bit RAMs and configurable synchronous dual-ported 4k-bit RAM blocks for data buffering and state storage.
• Clocking and Timing — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock distribution nets and 24 secondary local clock nets enable advanced clock control and low-skew distribution.
• I/O and Interface Flexibility — 180 user I/O pins and Multi-standard SelectIO™ support with multiple high-performance interface standards for direct connection to a variety of external devices.
• Arithmetic and Logic Support — Dedicated carry logic and multiplier support accelerate high-speed arithmetic and DSP-style operations implemented in the fabric.
• Configuration and Re-programmability — SRAM-based in-system configuration enables unlimited re-programmability with multiple programming modes for field updates.
• Package and Mounting — 256-BBGA package (supplier package: 256-PBGA, 27×27) designed for surface-mount assembly.
• Power and Temperature — Core supply range of 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-performance digital signal processing — Use dedicated multipliers, abundant registers and embedded RAM for filtering, modulation and other DSP tasks.
• Custom interface bridging and protocol conversion — Multi-standard SelectIO and 180 I/O pins simplify implementation of custom interfaces between disparate subsystems.
• In-system prototyping and reconfigurable control — SRAM-based re-programmability lets teams iterate designs in-system and deploy updates without replacing hardware.
• Glue logic and system integration — Rich routing resources and configurable logic blocks consolidate discrete logic and simplify board-level integration.

Unique Advantages

• Substantial on-chip resources: 5,292 logic elements and ~57,344 bits of embedded memory provide a balanced mix of logic and storage for medium-complexity designs.
• Flexible clocking architecture: Multiple DLLs and hierarchical clock nets enable deterministic timing and advanced clock domain management.
• Interface versatility: 180 I/O pins and multi-standard SelectIO support make it easier to connect to a wide range of external memory and peripherals without extensive external glue.
• Re-programmability: SRAM-based configuration allows field updates and iterative development workflows, reducing time-to-market for evolving designs.
• Compact surface-mount package: 256-BBGA (256-PBGA, 27×27) delivers high pin-count in a board-friendly surface-mount form factor to save PCB area.

Why Choose XCV200-4BG256C?

The XCV200-4BG256C delivers a balanced combination of logic density, embedded memory, flexible I/O and advanced clocking within the Virtex FPGA architecture. Its feature set addresses the needs of engineers implementing medium-complexity programmable logic, signal processing blocks, and custom interface logic where re-programmability and on-chip integration reduce system BOM and simplify board design.

Backed by the Virtex design ecosystem and supported configuration options, this device is suited for teams that require scalable, reconfigurable hardware building blocks and reliable, factory-tested components for commercial-temperature electronics.

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