XCV1600E-7BG560I

IC FPGA 404 I/O 560MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 404 589824 34992 560-LBGA Exposed Pad, Metal

Quantity 1,168 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7776Number of Logic Elements/Cells34992
Number of Gates2188742ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XCV1600E-7BG560I – Virtex®-E FPGA, 560-LBGA

The XCV1600E-7BG560I is a Virtex®-E 1.8 V Field Programmable Gate Array (FPGA) in a 560-ball metal LBGA with exposed pad, supplied in a 42.5 × 42.5 mm package. It delivers a substantial programmable fabric—34,992 logic elements—with approximately 0.59 Mbits of embedded memory and up to 404 I/O pins, making it suited for demanding industrial and high-performance embedded designs.

Designed for flexible, high-bandwidth interfaces and system integration, this device supports a broad set of I/O standards and clock-management features while operating over a 1.71–1.89 V core supply range and an industrial temperature window of −40 °C to 100 °C. RoHS-compliant and surface-mount packaged, it is intended for applications requiring reprogrammability and dense FPGA resources.

Key Features

  • Programmable Logic  Approximately 34,992 logic elements providing extensive logic capacity for complex digital functions and custom acceleration.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM with SelectRAM+ memory hierarchy and up to 832 Kb of synchronous block RAM capability described at the family level.
  • I/O Density and Standards  404 I/O pins with SelectI/O+ technology supporting multiple high-performance interface standards and differential signalling (LVDS, BLVDS, LVPECL) noted for the Virtex‑E family.
  • Clock and Timing  Built-in clock management with up to eight fully digital DLLs for clock multiply/divide and DDR-friendly 50% duty-cycle synthesis as specified for the family.
  • Performance  Family-level internal performance cited to 130 MHz (four LUT levels) and support for source-synchronous architectures and high-speed differential clocks.
  • Package & Mounting  560-LBGA exposed pad, metal package (560-MBGA, 42.5 × 42.5 mm), surface-mount for board-level integration and thermal conduction.
  • Power & Operating Range  Core supply range 1.71 V to 1.89 V and industrial operating temperature from −40 °C to 100 °C.
  • Compliance  RoHS-compliant and 100% factory tested as indicated for the Virtex‑E family.

Typical Applications

  • PCI-based Systems  PCI-compliant interface support for 3.3 V, 32/64-bit, 33/66-MHz system designs where programmable logic is used for bridging, protocol handling, or custom accelerators.
  • High-Speed Memory Interfaces  Designed to support high-performance external memory interfaces such as ZBT SRAM and DDR SDRAM via the family’s SelectRAM+ architecture and memory bandwidth features.
  • Signal Processing and Custom Logic  Dense logic and dedicated arithmetic resources enable prototypes and production designs for DSP functions, packet processing, and algorithm acceleration.
  • Industrial Control and Automation  Industrial-grade temperature rating and dense I/O make this device suitable for control systems, high-speed sensor interfacing, and reconfigurable industrial logic.

Unique Advantages

  • High Logic Density:  34,992 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing board-level component count.
  • Flexible, High-Bandwidth I/O:  Support for a wide set of I/O standards and differential signalling enables robust connectivity to high-speed peripherals and interfaces.
  • Advanced On-Chip Memory:  SelectRAM+ hierarchy and substantial block RAM capacity help optimize memory-intensive designs and on-chip buffering.
  • Comprehensive Clock Management:  Multiple DLLs and synthesized duty-cycle control streamline clocking for DDR and high-frequency system domains.
  • Industrial Operating Range:  Rated for −40 °C to 100 °C operation, appropriate for demanding environmental conditions common in industrial applications.
  • Proven, Factory-Tested Family:  Part of the Virtex‑E family with documented family-level features and 100% factory testing for production reliability.

Why Choose XCV1600E-7BG560I?

The XCV1600E-7BG560I combines large programmable logic resources, significant on-chip memory, and extensive I/O capability in a thermally robust metal LBGA package. Its family-level features—clock management, high-speed differential I/O support, and SelectRAM+ memory architecture—make it a solid choice for engineers building high-performance embedded systems, memory interface controllers, and industrial control solutions that require reprogrammability and integration.

This device suits teams needing scalable FPGA capacity with industrial temperature support and proven family-level capabilities. Its balance of logic density, memory, and I/O flexibility provides long-term value for designs that evolve through iterative development or require in-field reconfiguration.

Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for the XCV1600E-7BG560I.

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