XCV1600E-6FG900I

The XCV1600E-6FG900I is a Virtex®-E field programmable gate array (FPGA) offered in a 900-ball BGA package for surface-mount assembly. It provides a high-density, configurable logic fabric with extensive I/O and embedded memory tailored for industrial-grade applications that require large gate counts, broad interfacing options, and operation across an extended temperature range.

Built on the Virtex‑E family architecture, this device targets designs that need high I/O bandwidth, significant on-chip RAM, and flexible clocking and interface support as summarized in the Virtex‑E product specification.

Key Features

• Core Capacity — 34,992 logic elements and approximately 2,188,742 system gates provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) to support buffering, packet processing, and local data storage without external memory for many tasks.
• I/O and Interface Density — 700 user I/O pins enable wide parallel interfaces and high-bandwidth connections to peripherals and external memory devices.
• Family-Level Interface Support — Virtex‑E family features include SelectI/O+ technology and support for differential standards such as LVDS, BLVDS, and LVPECL, and PCI-compliant 3.3 V, 32/64-bit 33/66-MHz signaling as described in the product specification.
• Clock and Timing — Family features include multiple on-chip DLLs and digital clock management capabilities for flexible clock multiplication, division, and DDR-friendly timing.
• Package and Mounting — Supplied in a 900‑BBGA package (supplier package: 900‑FBGA, 31×31) optimized for surface-mount assembly to save PCB area.
• Power — Core supply operating range of 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V core family specifications.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS‑compliant.

Typical Applications

• High‑Performance Interface Bridging — Use the device to implement wide parallel and differential interfaces where up to 700 I/O pins and family-level support for LVDS/LVPECL/BLVDS are required.
• Memory Subsystem Controllers — On-chip RAM combined with the logic density supports controllers and front-end buffering for external memories and high-throughput data paths.
• Communications and Networking — Large logic capacity and extensive I/O make the device suitable for packet processing, protocol bridging, and custom PHY interfacing in industrial communications equipment.
• Industrial Control and Automation — Industrial-grade temperature range and high I/O count allow integration into control systems requiring robust operation across extended temperatures.
• Prototyping and System Integration — The programmable fabric and family-level tool support allow integration of complex functions for system-level validation and iterative development.

Unique Advantages

• High integration density: 34,992 logic elements and ~0.59 Mbits of embedded memory reduce the need for external glue logic and local RAM, simplifying board design.
• Extensive I/O resources: 700 I/O pins enable multiple high-bandwidth interfaces and parallel data paths without multiplexing compromises.
• Industrial readiness: Specified for −40 °C to 100 °C operation and supplied in a compact 900‑BBGA package suitable for industrial applications.
• Flexible clocking and interface options: Virtex‑E family clock-management features and SelectI/O+ support enable DDR and differential signaling use cases described in the product specification.
• Low-voltage core operation: 1.71–1.89 V core supply aligns with the Virtex‑E 1.8 V family, supporting lower power density designs where required.
• Standards and compliance: RoHS compliance and family-level PCI interface support provide environmental compliance and legacy interface options.

Why Choose XCV1600E-6FG900I?

The XCV1600E-6FG900I combines substantial programmable logic capacity, significant on-chip RAM, and a high I/O pin count in a compact 900‑BBGA package — a configuration well suited for industrial and high‑performance embedded systems that require dense logic, flexible interfacing, and extended temperature operation. Its placement in the Virtex‑E family provides access to documented family features such as advanced I/O standards support, clock management, and in-system reconfigurability.

For teams building systems that demand configurable performance, robust I/O, and industrial temperature tolerance, this device offers a balanced platform for integrating complex control, interfacing, and data-processing functions with long-term availability and factory-tested reliability as described in the product specification.

Request a quote or submit an RFQ for pricing and availability of the XCV1600E-6FG900I.