XCV1600E-7FG1156C

The XCV1600E-7FG1156C is a Virtex®-E family Field Programmable Gate Array (FPGA) in a 1156-BBGA package from AMD. It combines a large logic fabric, substantial on-chip RAM, and a high I/O count to address complex digital designs requiring flexible interfacing and reprogrammability.

As part of the Virtex‑E 1.8 V family, the device targets high-performance, low-power system designs with support for multiple high-speed I/O standards and integrated clock-management features.

Key Features

• Logic Capacity — 34,992 logic elements (cells) providing wide resource availability for dense logic integration and complex function implementation.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 total bits) to support buffering, FIFOs, and embedded data storage.
• I/O Count & Interface Flexibility — 724 I/O pins supporting a wide range of interface requirements; the Virtex‑E family includes support for multiple high-performance differential and single-ended standards such as LVDS, BLVDS, LVPECL and PCI 3.3 V signaling.
• Gate Count & Performance — 2,188,742 gates with family-level internal performance characteristics suitable for high-speed logic (family datasheet lists internal performance on the order of 130 MHz under four LUT levels).
• Clock Management — Family-level clock features include eight fully digital DLLs and DDR-friendly clocking options to support high-speed, low-jitter clock domains.
• Configuration & Process — SRAM-based, in-system reprogrammable device implemented in a 0.18 μm process technology (family specification), enabling design iteration and field updates.
• Package & Mounting — 1156-BBGA package (supplier package: 1156-FBGA, 35 × 35 mm); surface-mount mounting for board-level integration.
• Power & Temperature — VCCINT supply range 1.71 V to 1.89 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑speed memory interfaces — Implement DDR and ZBT memory controllers and custom memory bridges using on-chip RAM and high-performance I/O.
• PCI and bus-based systems — PCI-compliant signaling options and abundant logic resources make the device suitable for PCI 3.3 V 32/64-bit designs operating at 33/66 MHz.
• Multi‑standard serial and differential signaling — Support for LVDS, BLVDS, and LVPECL enables high-density differential I/O applications such as data acquisition backplanes and SERDES-less interfaces.
• Complex logic consolidation — Large logic cell count and significant on-chip memory allow consolidation of multiple SOC functions into a single FPGA for subsystem integration and BOM reduction.

Unique Advantages

• High I/O density: 724 I/Os enable direct interfacing to many peripherals and parallel buses without additional multiplexing hardware.
• Substantial embedded memory: Approximately 0.59 Mbits of on-chip RAM reduces external memory dependency for buffering and packet handling.
• Flexible signaling standards: Family-level support for a broad set of differential and single-ended I/O standards simplifies mixed-signal system design.
• Integrated clock management: Multiple DLLs and DDR-friendly clocking options facilitate synchronized, high-frequency system designs.
• SRAM-based reprogrammability: In-system configurability supports iterative development and field updates, shortening development cycles.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant to meet typical commercial design requirements.

Why Choose XCV1600E-7FG1156C?

The XCV1600E-7FG1156C positions itself as a versatile, high‑capacity Virtex‑E FPGA option for designs that require large logic resources, significant on-chip memory, and extensive I/O support in a 1156-BBGA surface-mount package. Its 1.8 V core supply, family-level clock-management features, and SRAM-based reprogrammability make it well suited for developers building high-performance interfaces, memory controllers, and consolidated digital subsystems.

This device is targeted at commercial-grade applications where integration density, flexible interfacing, and field configurability deliver long-term design value and reduce external component count.

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