XCV1600E-6BG560C

The XCV1600E-6BG560C is a commercial‑grade Virtex®-E field programmable gate array (FPGA) supplied in a 560‑ball LBGA package with exposed pad. It integrates 34,992 logic elements, roughly 0.59 Mbits of embedded RAM, and 404 user I/O to deliver configurable digital logic and high‑bandwidth interfacing for system designs.

Designed for reprogrammable, in‑system configurations, this device targets applications requiring dense logic, flexible I/O standards, and integrated clock management while operating from a 1.71 V to 1.89 V core supply and a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  Approximately 34,992 logic elements and 2,188,742 equivalent gates provide substantial logic resources for medium‑to‑high density designs.
• Embedded Memory  Approximately 589,824 bits (≈0.59 Mbits) of on‑chip RAM for distributed and block memory needs.
• I/O Density & Flexibility  404 I/O pins support a broad set of signaling needs and high aggregate bandwidth for peripheral and interface connectivity.
• Power and Supply  Specified core voltage range of 1.71 V to 1.89 V for the internal FPGA fabric.
• Clock Management  Includes high‑performance digital clock circuitry and PLL/DLL style resources for clock multiplication, division, and duty‑cycle control (as described for the Virtex‑E family).
• Memory Interface Support  Architectural support for high‑performance external memory interfaces as detailed in the Virtex‑E family specification.
• Package  560‑LBGA exposed pad, metal package; supplier device package listed as 560‑MBGA with a 42.5 × 42.5 mm footprint.
• Grade & Environment  Commercial grade device rated for 0 °C to 85 °C and compliant with RoHS.

Typical Applications

• PCI and Bus Interfaces  Suitable for designs requiring PCI‑class interfacing and bus control where reconfigurable logic and multiple I/O standards are needed.
• High‑Speed Memory Controllers  Used to implement controllers and interfaces for fast external memories consistent with the Virtex‑E family’s memory interface support.
• Serial and Differential I/O Systems  Applied where dense I/O and support for differential signaling and high aggregate bandwidth are required.

Unique Advantages

• Substantial Logic Resources:  34,992 logic elements enable implementation of complex logic, DSP blocks, and wide control structures without external ASICs.
• Integrated Memory:  Approximately 0.59 Mbits of embedded RAM reduces the need for external memory for many data buffering and state storage tasks.
• High I/O Count:  404 I/O pins allow flexible partitioning of interfaces and large parallel buses for system integration.
• Commercial Temperature Suitability:  Rated 0 °C to 85 °C for a wide range of commercial electronic products.
• RoHS Compliant:  Designed to meet environmental compliance requirements for modern manufacturing.
• Robust Packaging:  560‑LBGA with exposed pad and defined 42.5 × 42.5 mm supplier footprint supports reliable thermal and mechanical integration.

Why Choose XCV1600E-6BG560C?

The XCV1600E-6BG560C delivers a balanced combination of logic density, embedded memory, and high I/O count in a commercial‑grade Virtex‑E FPGA package. Its specified core voltage range and packaged footprint provide predictable electrical and mechanical integration for board‑level designs.

This device is well suited to engineers building reprogrammable systems that require substantial on‑chip logic and memory, flexible high‑bandwidth I/O, and established family‑level features for clocking and memory interfacing. The result is a scalable, reconfigurable building block for mid‑ to high‑complexity digital designs.

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