XCV150-6BG352C

The XCV150-6BG352C is an SRAM-based Virtex® FPGA offering high-density, reprogrammable logic in a 352-LBGA exposed pad metal package. The device integrates 3,888 logic elements, 49,152 bits of on-chip RAM, and 260 user I/Os to support complex, reconfigurable digital designs.

Designed for high-performance, high-capacity programmable logic applications, this device provides clock management, multi-standard I/O support and flexible memory options to accelerate system integration and shorten design time.

Key Features

• Core capacity — 3,888 logic elements and approximately 164,674 system gates provide a balance of density and routing resources for medium-complexity designs.
• On-chip memory — 49,152 total RAM bits with LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM options and dedicated 4k-bit RAM blocks for flexible data buffering and state storage.
• I/O and interface support — 260 user I/Os with Multi-standard SelectIO™ interfaces supporting multiple high-performance interface standards; device-level support for 66-MHz PCI compliance and hot-swap for Compact PCI.
• Clock management — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets enable advanced clock control and distribution.
• Architecture for arithmetic and wide functions — Dedicated carry logic, multiplier support and cascade chains facilitate high-speed arithmetic and wide-input logic implementations.
• Configuration and re-programmability — SRAM-based in-system configuration with unlimited re-programmability and four programming modes for flexible deployment and iterative development.
• Package and power — Surface-mount 352-LBGA exposed pad metal package (352-MBGA, 35×35); rated supply voltage 2.375 V to 2.625 V and commercial operating temperature range 0 °C to 85 °C.
• Manufacturing and test — 0.22 μm 5-layer metal CMOS process and 100% factory tested for production consistency; RoHS compliant.
• System and design support — Supported by FPGA Foundation™ and Alliance development systems for design implementation and toolchain integration.

Typical Applications

• PCI-based systems — Integration into 66-MHz PCI designs where a reprogrammable logic device provides protocol bridging, custom logic or peripheral control.
• Compact PCI modules — Hot-swappable Compact PCI modules that require field reprogrammability and high I/O density.
• Custom data-path and signal processing — Implement arithmetic engines, custom datapaths and buffering using dedicated carry/multiplier logic and on-chip RAM.
• Prototyping and reconfigurable logic — Replace mask-programmed gate arrays for iterative design cycles and in-system updates using SRAM-based configuration.

Unique Advantages

• High-density programmable logic: 3,888 logic elements and ~164,674 gates enable medium-complexity designs without external glue logic.
• Flexible embedded memory: 49,152 bits of on-chip RAM with configurable LUT-based RAM and dual-ported blocks simplifies data buffering and control state implementation.
• Extensive I/O and protocol support: 260 user I/Os with SelectIO™ capabilities support diverse interface standards and direct connections to external memory devices.
• Robust clock control: Four DLLs and multiple clock nets provide low-skew distribution and advanced timing management for synchronous systems.
• Field re-programmability: SRAM-based configuration with multiple programming modes enables in-system updates and design iteration without device replacement.
• Production-ready package: Surface-mount 352-LBGA exposed pad metal package with RoHS compliance and full factory test coverage eases assembly and qualification for commercial products.

Why Choose XCV150-6BG352C?

The XCV150-6BG352C positions itself as a versatile, mid-density Virtex® FPGA tailored for designs that need a balance of logic capacity, on-chip memory and I/O density in a compact surface-mount package. Its SRAM-based architecture and multiple configuration modes support iterative development and in-field updates, while built-in clock management and dedicated arithmetic resources help implement high-performance data paths.

This device is well suited for engineering teams building PCI or Compact PCI modules, prototype systems replacing mask-programmed logic, and other commercial applications where reconfigurable logic, predictable supply voltage range (2.375 V–2.625 V) and a commercial temperature rating (0 °C–85 °C) are required. The combination of manufacturing test coverage and available development support aims to reduce integration risk and speed time-to-market.

Request a quote or submit an inquiry for pricing and availability of the XCV150-6BG352C to move your design toward production-ready programmable logic.