XCV150-6FG456C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 260 49152 3888 456-BBGA |
|---|---|
| Quantity | 61 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 260 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 864 | Number of Logic Elements/Cells | 3888 | ||
| Number of Gates | 164674 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of XCV150-6FG456C – Virtex® FPGA, 456-BBGA
The XCV150-6FG456C is an SRAM-based Virtex® Field Programmable Gate Array (FPGA) offered in a 456-BBGA package for surface-mount applications. It combines a programmable fabric with embedded memory and comprehensive clock-management resources to address high-performance digital designs and system integration tasks.
Targeted at commercial applications, this device provides a balanced architecture for logic, I/O, and on-chip RAM, enabling designers to implement custom processing, protocol bridging, and I/O-intensive functions within a single programmable device.
Key Features
- Logic Capacity — 3,888 logic elements enabling mid-density programmable logic implementations; architecture density corresponds to approximately 164,674 system gates.
- Embedded Memory — Approximately 49 kbits of on-chip RAM (49,152 total RAM bits) with support for LUT-configured RAM modes and configurable synchronous dual-ported 4k-bit RAMs.
- I/O Resources — 260 user I/O pins with multi-standard SelectIO™ support for a wide range of high-performance interface standards.
- Clock and Timing — Built-in clock-management with four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets to support advanced clock control.
- Arithmetic & DSP Support — Dedicated carry logic and multiplier support to accelerate high-speed arithmetic and DSP functions.
- Configuration & Test — SRAM-based in-system configuration with unlimited re-programmability and four programming modes; includes IEEE 1149.1 boundary-scan logic and JTAG support.
- System Interfaces & Compatibility — System performance up to 200 MHz, 66-MHz PCI compliance, and hot-swappable capability for CompactPCI systems (as specified for the Virtex family).
- Physical & Process — Surface-mount 456-BBGA package (supplier package 456-FBGA, 23 × 23 mm); designed in a 0.22 μm 5-layer-metal CMOS process and 100% factory tested.
- Operating Conditions — Commercial grade device with a supply voltage range of 2.375 V to 2.625 V and operating temperature range of 0 °C to 85 °C.
Typical Applications
- PCI & CompactPCI Systems — Implement PCI-compliant glue logic, protocol bridging, and hot-swap control leveraging the device’s 66-MHz PCI compliance and hot-swappable support.
- High‑Performance Data Processing — Use dedicated multipliers and carry logic to accelerate arithmetic and DSP pipelines for mid-density processing tasks operating up to the device’s specified system performance.
- Custom Interface and I/O Aggregation — Consolidate multiple interface standards and high-pin I/O requirements into a single FPGA, taking advantage of the 260 available I/O pins and SelectIO capabilities.
- Embedded Prototyping & Glue Logic — Rapidly prototype system logic and integrate glue logic between ASICs, memory, and peripheral components using the re-programmable SRAM configuration modes.
Unique Advantages
- Balanced Mid‑Density Integration: Delivers a practical mix of logic (3,888 logic elements), on-chip RAM (≈49 kbits), and I/O (260 pins) for consolidated system designs without unnecessary overhead.
- Robust Clock Management: Four DLLs and hierarchical clock nets provide designers with precise clock control for synchronized multi-clock designs.
- Flexible Memory Modes: LUTs can be configured as various RAM types and shift registers, enabling tailored embedded memory usage for application-specific needs.
- Field Re‑programmability: SRAM-based configuration offers unlimited re-programmability and multiple programming modes for iterative development and in-system updates.
- Commercial‑Grade Reliability: 100% factory tested and specified for commercial temperature operation (0 °C to 85 °C) with a defined supply voltage window for predictable system behavior.
Why Choose XCV150-6FG456C?
The XCV150-6FG456C provides a well-rounded Virtex FPGA option for engineers seeking mid-density programmable logic with integrated memory, extensive I/O, and advanced clocking features. Its combination of logic capacity, embedded RAM, dedicated arithmetic resources, and re-programmability makes it suitable for bridging, protocol implementation, and medium-complexity data processing tasks in commercial products.
Designed and specified within the Virtex family framework, the device offers designers a predictable platform with documented clock-management, configuration modes, and interface support—helping reduce design iterations and support scalable development workflows.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time details for the XCV150-6FG456C. Our team can provide the technical and procurement information you need to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








