XCV1600E-8BG560C

The XCV1600E-8BG560C is a Virtex®-E series FPGA offered in a 560-ball LBGA package with exposed metal pad. It provides a high-density, reprogrammable logic platform with 34,992 logic elements, approximately 0.59 Mbits of embedded memory, and 404 user I/Os for complex digital designs.

Designed for commercial applications, this surface-mount FPGA delivers a balance of integration, I/O capacity and on-chip memory while operating from a 1.71 V to 1.89 V core supply and across a 0 °C to 85 °C ambient range.

Key Features

• Core logic  34,992 logic elements and 2,188,742 equivalent gates provide substantial programmable logic density for complex functions and system integration.
• Embedded memory  Approximately 0.59 Mbits of on-chip RAM suitable for buffering, FIFOs and small on-chip data stores.
• I/O capacity and standards (family)  404 user I/Os; the Virtex‑E family datasheet documents SelectI/O+ support for a wide range of interface standards and differential signaling (LVDS, BLVDS, LVPECL).
• Performance (family)  Virtex‑E family performance characteristics in the datasheet include up to 130 MHz internal performance (four LUT levels) and support for high-speed clocking and DDR techniques.
• Package & mounting  560-LBGA exposed pad, metal construction (supplier package: 560-MBGA, 42.5 × 42.5 mm) optimized for surface-mount assembly.
• Power & temperature  Core supply range 1.71 V to 1.89 V; commercial operating temperature of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-speed I/O systems  Use the device’s large I/O count and Virtex‑E family differential signaling support for board- or system-level high-bandwidth interfaces.
• Memory interface logic  Implement DDR/ZBT interface controllers and custom memory controllers leveraging the family’s SelectRAM+ architecture and on-chip RAM.
• PCI and bus bridging  Leverage documented PCI-compliant support in the Virtex‑E datasheet for 3.3 V, 32/64-bit 33/66-MHz applications.
• Data capture and preprocessing  High I/O count and on-chip RAM enable front-end data aggregation, buffering and preprocessing for downstream processors or storage.

Unique Advantages

• High logic density: 34,992 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial I/O resources: 404 I/Os support large parallel interfaces and flexible partitioning of signals across I/O banks.
• Embedded memory for state and buffering: Approximately 0.59 Mbits of on-chip RAM reduces the need for small external memory devices for control and buffering tasks.
• Compact, manufacturable package: 560-LBGA with exposed pad and a 42.5 × 42.5 mm footprint supports standard surface-mount assembly processes.
• Compliance-ready: RoHS compliance supports modern environmental and manufacturing requirements.
• Family-level performance and interfaces: As documented in the Virtex‑E datasheet, the family provides clock management, differential signaling and memory interface features that simplify high-performance system design.

Why Choose XCV1600E-8BG560C?

The XCV1600E-8BG560C provides a robust programmable logic solution for commercial designs that require high logic density, extensive I/O and on-chip memory in a single surface-mount package. Its core voltage range, package type and operating temperature are suitable for a wide range of board-level applications where integration and reprogrammability reduce overall system complexity.

As a member of the Virtex‑E family (as described in the provided datasheet), this device benefits from documented architectural features for high-speed I/O, memory interfacing and clock management—making it a practical choice for engineers building PCI-based systems, high-bandwidth interfaces, and compact FPGA-based controllers.

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