XCV150-5BG352I

IC FPGA 260 I/O 352MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 260 49152 3888 352-LBGA Exposed Pad, Metal

Quantity 1,058 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O260Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-5BG352I – Virtex® Field Programmable Gate Array, 260 I/O, 3,888 Logic Elements

The XCV150-5BG352I is a Virtex® FPGA device offering a high-performance, flexible programmable-logic solution in a 352-LBGA exposed-pad metal package. Built around a regular FPGA architecture, it delivers 3,888 logic elements, 49,152 bits of embedded RAM, and 260 user I/O pins for complex system designs.

This device targets industrial applications that require reprogrammable logic, dense on-chip resources, and deterministic operating conditions, with a supply voltage range of 2.375 V to 2.625 V and an operating temperature range from -40 °C to 100 °C.

Key Features

  • Programmable Logic Capacity  Provides 3,888 logic elements (CLB-based architecture) and approximately 0.049 Mbits of embedded memory to implement custom digital functions and state machines.
  • I/O and Interface Support  260 user I/O pins enable wide external connectivity; series-level SelectIO™ multi-standard interfaces support a broad range of signaling standards for flexible system interfacing.
  • Clock Management  Built-in clock-management resources including four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets for advanced timing control and low-skew distribution.
  • Arithmetic and Logic Primitives  Dedicated carry logic and multiplier support plus cascade chains for wide-input functions accelerate arithmetic and DSP-oriented operations.
  • Memory Flexibility  LUTs configurable as distributed RAM (including dual-ported and shift-register modes) and dedicated synchronous block RAMs for hierarchical memory architectures and fast external RAM interfacing.
  • Configuration and Reprogrammability  SRAM-based in-system configuration provides unlimited reprogramming and multiple configuration modes for flexible deployment and iterative development.
  • Package and Thermal  352-LBGA exposed-pad metal package (352-MBGA, 35×35) optimized for surface-mount assembly and thermal conduction in industrial environments.
  • Supply and Temperature  Operates from 2.375 V to 2.625 V and rated for industrial temperature operation from -40 °C to 100 °C.
  • Manufacturing  Device is 100% factory tested and built on a 0.22 μm, 5-layer metal CMOS process (series-level detail).

Typical Applications

  • Industrial Control  Implement motor-control logic, deterministic sequencing, and fieldbus interfacing using the device’s I/O count and reprogrammable logic.
  • Data Acquisition and Preprocessing  Use embedded RAM and configurable logic to perform front-end data conditioning, buffering, and protocol conversion before passing data to host systems.
  • Custom Digital Interfaces  Leverage SelectIO multi-standard interfaces and abundant I/Os to create tailored bridges between disparate peripherals and system buses.
  • Prototyping and In-System Upgrades  SRAM-based in-system configuration enables iterative hardware development and field updates without board redesign.

Unique Advantages

  • Balanced Logic and Memory:  3,888 logic elements combined with 49,152 bits of on-chip RAM deliver a balance of compute and storage for mid-range FPGA designs.
  • Deterministic Clocking:  Four DLLs and a hierarchical clock network reduce clock skew and simplify timing across complex designs.
  • Flexible I/O Count:  260 user I/Os allow extensive external connectivity, minimizing the need for external glue logic.
  • Industrial Rating:  Specified operation from -40 °C to 100 °C supports deployment in industrial temperature environments.
  • Proven Process and Testing:  Manufactured on a 0.22 μm, 5-layer metal CMOS process and 100% factory tested for reliable production deployment.
  • Reprogrammability:  SRAM-based configuration enables design iteration and field updates without hardware changes.

Why Choose XCV150-5BG352I?

The XCV150-5BG352I combines a proven Virtex FPGA architecture with practical on-chip resources—3,888 logic elements, 49,152 bits of embedded RAM, and 260 I/Os—in a robust 352-LBGA exposed-pad package. Its clock-management features and arithmetic primitives support designs that need predictable timing and efficient arithmetic implementation, while the industrial temperature rating and factory testing make it suitable for demanding embedded environments.

This device is well suited to engineers developing mid-range programmable logic solutions who need field reprogrammability, flexible I/O, and a balance of memory and logic density. The combination of configurable resources and supported configuration modes supports scalable development and in-field updates.

If you’d like pricing, availability, or a formal quote for the XCV150-5BG352I, submit an inquiry or request a quote and our team will respond with current information.

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