XCV150-4FG456I

The XCV150-4FG456I is a Virtex® SRAM-based Field Programmable Gate Array delivering high-density programmable logic with 3,888 logic cells and approximately 49,152 bits of embedded RAM. It combines a regular CLB array, abundant I/O, and hierarchical on-chip memory to serve designers who require reprogrammable, high-capacity logic integration.

Built with a 0.22 µm five-layer-metal process and factory-tested, this industrial-grade device supports system voltages from 2.375 V to 2.625 V and an operating range of −40 °C to 100 °C, making it suitable for a wide range of industrial and embedded applications.

Key Features

• Logic Density — 3,888 logic cells (CLB array) and approximately 164,674 system gates provide substantial on-chip logic capacity for complex designs.
• Embedded Memory — Approximately 49,152 bits of on-chip RAM with configurable LUT RAM, dual-ported RAM options, and SelectRAM+ support for flexible on-chip storage.
• I/O and Interface Support — Up to 260 user I/O pins and multi-standard SelectIO™ interfaces for high-performance external device connectivity.
• Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced timing control.
• Arithmetic and Logic Support — Dedicated carry logic, multiplier support and cascade chains to accelerate arithmetic and wide-input functions.
• Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (SelectMAP™, slave serial, master serial, JTAG).
• Performance & Standards — System performance up to 200 MHz and 66-MHz PCI compliance; hot-swappable support for Compact PCI highlighted in product specification.
• Process and Test — 0.22 µm CMOS process with five metal layers and 100% factory tested parts.
• Package & Mounting — 456-ball BBGA package (supplier device package: 456-FBGA, 23 × 23) intended for surface-mount assembly.
• Industrial Grade and Environmental — Industrial-grade device rated for −40 °C to 100 °C operating temperature; RoHS compliant.

Typical Applications

• PCI and CompactPCI Systems — Use in PCI-compliant designs and hot-swappable CompactPCI assemblies where 66‑MHz PCI compatibility and reprogrammability are required.
• High-Density Logic Integration — Implement complex custom logic, state machines and data-path acceleration using 3,888 logic cells and dedicated arithmetic resources.
• Embedded System Prototyping — SRAM-based in-system configuration enables iterative firmware/hardware development and unlimited re-programmability for prototyping and field updates.
• Multi-Standard I/O Interfacing — Multi-standard SelectIO™ supports direct interfacing to a variety of external memory and peripheral standards for flexible system integration.

Unique Advantages

• Substantial On-Chip Resources: Combines 3,888 logic cells and approximately 49 kbits of embedded RAM to consolidate logic and memory on a single device, reducing external components.
• Advanced Clocking: Four DLLs and multiple global/local clock nets enable precise clock control for timing-critical designs.
• Flexible Configuration: SRAM-based architecture with multiple programming modes and unlimited re-programmability supports iterative development and in-field updates.
• Industry-Proven Process: Manufactured in a 0.22 µm, five-layer-metal CMOS process and 100% factory tested for predictable integration and supply-chain readiness.
• Robust Environmental Range: Industrial operating temperature and RoHS compliance support deployment in demanding embedded environments.
• Compact, Surface-Mount Package: 456-BBGA (23 × 23) packaging provides a high-pin-count, space-efficient footprint for dense board-level integration.

Why Choose XCV150-4FG456I?

The XCV150-4FG456I delivers a balanced combination of logic density, embedded memory, and configurable I/O within a factory-tested Virtex® FPGA architecture. Its dedicated clock-management resources, arithmetic support, and SRAM-based re-programmability make it well suited to designers building high-capacity, reconfigurable systems in industrial and embedded markets.

Engineers selecting this device gain the flexibility of on-chip RAM and multi-standard I/O along with industrial temperature range and a compact 456-ball FBGA package—facilitating scalable designs that benefit from in-system updates and a mature FPGA feature set.

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