XCV150-4BG352I

The XCV150-4BG352I is a Virtex® SRAM-based Field Programmable Gate Array optimized for flexible system logic and interface integration. Its architecture provides a balance of logic capacity, embedded memory, and high-density I/O for systems that require in-system reconfiguration and multi-standard signaling.

Targeted at industrial applications, the device combines 3,888 logic elements with approximately 49,152 bits of on-chip RAM, 260 user I/O pins, and programmable clock management to address communications, system control, and configurable hardware accelerators.

Key Features

• Logic Capacity — 3,888 logic elements (CLBs) and approximately 164,674 system gates for mid-range programmable logic integration.
• Embedded Memory — 49,152 bits of block RAM plus LUT-based configurable RAM modes (16-bit, 32-bit, dual-ported options) for flexible on-chip storage.
• I/O and Interface Flexibility — 260 I/O pins with Multi-standard SelectIO™ support for multiple high-performance interface standards and direct connections to compatible external memory devices.
• Clock and Timing — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control and low-skew distribution.
• Arithmetic and Logic Support — Dedicated carry logic, multiplier support and cascade chains for implementing high-speed arithmetic and wide-input logic functions.
• Configuration and Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for iterative development and field updates.
• System Reliability — IEEE 1149.1 boundary-scan support and an on-die temperature sensor diode for system diagnostics and testability.
• Process and Quality — 0.22 μm, 5-layer-metal CMOS process and 100% factory tested for consistent device quality.
• Package and Mounting — 352-LBGA exposed pad, metal package (352-MBGA 35×35) designed for surface-mount assembly.
• Power and Temperature — Voltage supply range 2.375 V to 2.625 V and rated operating temperature range −40°C to 100°C for industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• PCI and Compact PCI Systems — Implements bus interface logic and system glue for 66-MHz PCI-compliant designs and hot-swappable Compact PCI implementations.
• Communications and Interface Bridging — Handles multi-standard I/O and protocol adaptation between high-performance peripherals and system processors.
• In-System Reconfigurable Logic — Supports iterative firmware and hardware updates through SRAM-based, unlimited reprogramming modes for configurable hardware acceleration and prototyping.
• Memory Interface Control — Fast interfaces to external high-performance RAMs and support for direct connections to compatible memory devices for buffering and packet processing.

Unique Advantages

• Balanced Logic and Memory Integration: Combines 3,888 logic elements with 49,152 bits of embedded RAM to implement complex state machines, buffering and arithmetic blocks on a single device.
• Flexible I/O Standards: Multi-standard SelectIO™ support and 260 I/O pins enable broad interface compatibility without external level-shifting or complex glue logic.
• Advanced Clock Management: Multiple DLLs and hierarchical clock nets deliver fine-grained timing control for synchronous system designs.
• Reprogrammability for Iterative Development: SRAM-based configuration allows unlimited reprogramming and multiple programming modes to accelerate development cycles and updates in the field.
• Industrial Temperature Range: Rated from −40°C to 100°C to meet industrial environment requirements while remaining RoHS compliant.
• Compact, Surface-Mount Package: 352-LBGA exposed-pad metal package provides high I/O density in a compact form factor suitable for modern PCBs.

Why Choose XCV150-4BG352I?

The XCV150-4BG352I is positioned for designs that require mid-range programmable logic with flexible memory and robust I/O support. Its combination of thousands of logic elements, tens of kilobits of embedded RAM, and advanced clock-management resources makes it suitable for system-level glue logic, interface bridging, and reconfigurable hardware functions in industrial-grade applications.

With SRAM-based reprogrammability, a proven Virtex® architecture, and comprehensive on-chip resources, this device supports iterative development and long-term design flexibility within a compact, surface-mount package.

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