XCV150-4BG256C

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA

Quantity 35 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-4BG256C – Virtex® Field Programmable Gate Array (FPGA) IC 180 49152 3888 256-BBGA

The XCV150-4BG256C is a Virtex® SRAM-based Field Programmable Gate Array (FPGA) from AMD, delivered in a 256-ball BGA package. It provides a balance of high logic capacity, embedded RAM, and flexible I/O for applications that require reprogrammable, high-density programmable logic.

Designed for commercial-grade systems, this device targets designs that need multi-standard I/O support, on-chip memory, and advanced clock management while operating within a 2.375 V to 2.625 V supply range and a 0 °C to 85 °C temperature window.

Key Features

  • Logic Capacity — 3,888 logic elements (configured CLB array) and approximately 164,674 system gates provide substantial programmable logic resources.
  • Embedded Memory — 49,152 total on-chip RAM bits for implementing FIFOs, buffers, and distributed memory structures.
  • I/O Density — 180 user I/O pins to support a variety of external interfaces and connections.
  • Clock and Timing — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global/ local clock distribution nets for refined clock control.
  • Flexible Logic Primitives — Configurable LUTs (including options for RAM and shift-register modes), dedicated carry logic and multiplier support for arithmetic and wide-function implementations.
  • Configurable Memory Blocks — Support for configurable synchronous dual-ported 4k-bit RAMs and fast interfaces to external high-performance RAMs as documented for the Virtex family.
  • Packaging and Mounting — Surface-mount SMB in a 256-BBGA (256-PBGA, 27 × 27 mm) package for compact PCB integration.
  • Power and Environmental — Operating voltage range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
  • In-System Configuration — SRAM-based architecture supports unlimited re-programmability with multiple programming modes for in-system updates.
  • Market-Proven Process — Fabricated on a 0.22 µm 5-layer-metal CMOS process and 100% factory tested as part of the Virtex family specifications.

Typical Applications

  • PCI and Expansion Cards — Use in PCI-compliant designs and expansion cards where 66-MHz PCI compatibility and programmable logic are required for custom I/O and protocol handling.
  • Compact PCI Modules — Suitable for Compact PCI modules that benefit from hot‑swappable programmable logic and reconfigurable system functions.
  • Memory Interface and Buffering — Implement high-performance external RAM interfaces, FIFOs, and custom memory controllers using the device’s embedded RAM and configurable LUT RAM modes.
  • Custom Logic and Prototyping — Ideal for in-system reprogrammable prototypes and custom digital logic implementations that require moderate logic density and flexible I/O.

Unique Advantages

  • Substantial On-Chip Logic: 3,888 logic elements enable complex logic functions without immediate dependence on external ASICs or glue logic.
  • Flexible Embedded Memory: 49,152 bits of on-chip RAM and LUT-configurable RAM modes reduce the need for external buffering and simplify memory architectures.
  • Advanced Clock Control: Four dedicated DLLs and hierarchical clock distribution support precise timing and multiple clock domains within a design.
  • Robust I/O Count: 180 I/O pins allow broad interfacing to peripherals, external memories, and system buses while supporting multi-standard I/O schemes described for the Virtex family.
  • Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream commercial electronics applications.
  • Reprogrammable Architecture: SRAM-based in-system configuration enables iterative development and firmware-style updates without hardware replacement.

Why Choose XCV150-4BG256C?

The XCV150-4BG256C delivers a combination of logic capacity, embedded memory, and flexible I/O in a compact 256-BBGA package, making it well suited for commercial systems that require reprogrammable, high-density logic. Its Virtex-family architecture provides advanced clock-management features and configurable memory primitives that help implement complex timing and buffering needs on-chip.

This device is appropriate for engineers and teams building PCI/Compact PCI modules, memory-intensive interfaces, and reconfigurable prototypes who need a commercially rated FPGA with a proven process and full in-system programmability backed by the Virtex family specifications.

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