XCV150-4FG256I

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 49152 3888 256-BGA

Quantity 370 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates164674ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XCV150-4FG256I – Virtex® Field Programmable Gate Array (FPGA), 176 I/O, 3,888 logic elements, 256‑BGA

The XCV150-4FG256I is an industrial-grade Virtex® FPGA in a 256‑BGA package, offering a balanced combination of programmable logic, embedded memory, and flexible I/O for embedded and industrial designs. It is an SRAM-based, reprogrammable device that suits applications requiring in-system configuration, multi-standard I/O, and robust operating ranges.

Key architecture elements include thousands of logic elements, on-chip RAM, multiple clock management resources and multi-standard SelectIO interfaces—making the device appropriate for communications, industrial control, and high-performance embedded systems.

Key Features

  • Logic Resources — 3,888 logic elements organized into 864 CLBs, providing gate-equivalent density suitable for medium-complexity FPGA designs.
  • Embedded Memory — 49,152 total RAM bits of on-chip memory for data buffering, small lookup tables, and fast local storage.
  • I/O and Interfaces — 176 user I/O pins with multi-standard SelectIO support for a wide range of interface signaling options and direct connectivity to high-performance memory devices as described in the Virtex family documentation.
  • Clock Management — Built-in clock-management circuitry includes multiple dedicated delay-locked loops (DLLs) and hierarchical global/local clock nets to support advanced clock control and low-skew distribution.
  • Configuration and Reprogramming — SRAM-based in-system configuration supports unlimited re-programmability and multiple programming modes for flexible deployment and field updates.
  • Dedicated Arithmetic Resources — Architecture includes dedicated carry logic and multiplier support for efficient implementation of arithmetic and DSP functions.
  • Package and Mounting — 256‑FBGA (17×17) package, surface-mount, designed for compact board-level integration.
  • Power and Temperature — Operates from a core supply range of 2.375 V to 2.625 V and specified for an industrial temperature range of −40 °C to 100 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Automation — Implement real-time control logic, sensor interfacing, and deterministic I/O aggregation within industrial temperature ranges.
  • Communications Equipment — Use the multi-standard I/O and on-chip memory for protocol bridging, packet buffering, and custom interface logic in telecom or networking gear.
  • PCI-based Systems — Suitable for designs that integrate with PCI or Compact PCI environments where hot‑swap and PCI‑compliant interfaces are required by system architecture.
  • Embedded Processing — Accelerate custom data paths and offload compute tasks using dedicated arithmetic resources and configurable memory structures.

Unique Advantages

  • Reprogrammable Hardware: SRAM-based configuration enables unlimited in-system updates and flexible prototyping or production changes without mask revisions.
  • Balanced Resource Mix: Combination of 3,888 logic elements and 49,152 bits of embedded RAM supports medium-density logic with on-chip storage to reduce external memory dependence.
  • Advanced Clocking: Multiple DLLs and hierarchical clock nets simplify clock-domain management for timing-sensitive designs.
  • Robust Environmental Range: Industrial-grade specification and an operating temperature range of −40 °C to 100 °C for deployment in challenging environments.
  • Compact, Surface-Mount Package: 256‑FBGA (17×17) package enables high I/O count in a compact footprint for space-constrained boards.
  • Vendor Ecosystem: Supported by the Virtex family feature set for established design flows and configuration modes to streamline development and deployment.

Why Choose XCV150-4FG256I?

The XCV150-4FG256I positions itself as a versatile mid-range Virtex FPGA that combines a practical logic capacity with embedded memory and extensive I/O in a compact 256‑BGA package. Its industrial temperature rating and RoHS compliance make it suitable for production systems that require dependable operation across a wide temperature span.

This device is well matched to engineers designing communications modules, industrial controllers, and embedded platforms that need reprogrammable logic, on-chip memory, robust clocking, and multi-standard I/O support while maintaining a compact board footprint.

Request a quote or submit an RFQ to check availability and lead time for the XCV150-4FG256I and evaluate how this Virtex FPGA fits your next design.

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