XCV100E-8PQ240C

IC FPGA 158 I/O 240QFP
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 158 81920 2700 240-BFQFP

Quantity 451 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O158Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates128236ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV100E-8PQ240C – Virtex®-E FPGA, 2700 logic elements, 240-BFQFP

The XCV100E-8PQ240C is a Virtex®-E Field Programmable Gate Array supplied in a 240-BFQFP surface-mount package. It combines a 1.8 V core architecture with a compact, high-pin-count footprint to address I/O‑intensive and embedded digital designs.

With 2,700 logic elements, 158 user I/Os and 81,920 bits of on-chip RAM, this commercial-grade device is sized for applications requiring flexible reprogrammability, moderate logic density, and a wide range of I/O standards supported by the Virtex‑E family.

Key Features

  • 1.8 V core supply — VCCINT operating range 1.71 V to 1.89 V, consistent with the Virtex‑E 1.8 V architecture for reduced core voltage operation.
  • Logic capacity — Approximately 2,700 logic elements (about 128,236 system gates) to implement custom logic, control, and glue‑logic functions.
  • On-chip memory — Total embedded memory of 81,920 bits for distributed and block RAM requirements.
  • Rich I/O — 158 user I/Os to support parallel and serial interfaces; Virtex‑E family SelectI/O+ technology supports a broad set of high-performance interface standards.
  • Packaging and mounting — 240‑BFQFP (supplier package: 240‑PQFP, 32×32) in a surface-mount form factor for PCB assembly.
  • Commercial temperature grade — Specified for operation from 0 °C to 85 °C, suitable for commercial electronic products.
  • Standards and compliance — RoHS‑compliant device and 100% factory tested as part of the Virtex‑E family manufacturing process.
  • Family-level capabilities — Leverages Virtex‑E architectural features such as advanced clock management (digital DLLs), differential signaling support, and SRAM-based in-system configuration for reprogrammability.

Typical Applications

  • Communications and interface bridging — Implement PCI and other high-speed system interfaces using the device's rich I/O and Virtex‑E family interface support.
  • Memory controllers and buffers — Ideal for interfacing with high-performance external memories and SRAM using on-chip logic and memory resources.
  • Embedded control and prototyping — Reconfigurable logic and in-system programming enable rapid development and iterative firmware/prototype cycles.
  • Digital signal processing acceleration — Use dedicated arithmetic structures and on-chip RAM to implement DSP kernels and custom data-paths.

Unique Advantages

  • Balanced logic and I/O in a compact package: 2,700 logic elements with 158 user I/Os in a 240‑pin BFQFP makes it suitable where board space and moderate density are required.
  • Low-voltage core operation: 1.71–1.89 V VCCINT reduces core power compared to higher-voltage families while maintaining Virtex‑E functionality.
  • Reconfigurable in-system: SRAM-based configuration enables field updates and design iteration without hardware changes.
  • Commercial-grade reliability: Rated for 0–85 °C operation and RoHS compliant for standard commercial deployments.
  • Proven family features: Access to Virtex‑E clock management and interface technologies simplifies integration of high-speed clocks and differential signaling where needed.

Why Choose XCV100E-8PQ240C?

The XCV100E-8PQ240C positions itself as a versatile, commercial-grade FPGA option for designers who need moderate logic capacity, substantial user I/O, and on-chip memory in a 240‑pin surface-mount package. It leverages Virtex‑E family capabilities—such as 1.8 V core operation, advanced clocking, and broad interface support—while providing the reprogrammability and integration benefits of SRAM-based FPGAs.

This part is well suited to customers building embedded controllers, communication interface modules, memory interface logic, and prototype systems that require compact packaging, flexible I/O, and the ability to iterate designs through in-system reprogramming.

Request a quote or submit a product inquiry to receive pricing and availability information for the XCV100E-8PQ240C. Our team will provide a prompt response tailored to your project requirements.

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