XCV100-5PQ240I

IC FPGA 166 I/O 240QFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 166 40960 2700 240-BFQFP

Quantity 85 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O166Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-5PQ240I – Virtex® Field Programmable Gate Array (FPGA) IC 166 40960 2700 240-BFQFP

The XCV100-5PQ240I is an SRAM-based Virtex FPGA providing a balance of logic density, on-chip memory, and flexible I/O for mid-range programmable designs. Its architecture supports hierarchical memory, dedicated arithmetic resources, and multi-standard I/O, making it suitable for embedded systems, communications interfaces, and board-level digital processing tasks.

Key attributes include approximately 108,904 system gates, 2,700 logic elements, about 40,960 bits of on-chip RAM, and 166 user I/O in a 240-BFQFP package, with industrial temperature grading and RoHS compliance.

Key Features

  • Core logic density — Approximately 108,904 system gates and 2,700 logic elements provide mid-range programmable capacity for complex logic functions and state machines.
  • Embedded memory — 40,960 bits of total on-chip RAM with a hierarchical memory structure; LUTs can be configured as RAM or shift registers to support varied memory-use cases.
  • I/O and interface flexibility — 166 user I/O pins and multi-standard SelectIO support enable direct connection to multiple interface standards and external memory devices.
  • Clock-management resources — Built-in clock-management circuitry including four delay-locked loops (DLLs), multiple global and local clock distribution nets for advanced clock control.
  • Dedicated arithmetic and routing — Built-in carry logic, multiplier support, cascade chains, and abundant registers for high-speed arithmetic and wide-input functions.
  • Configuration and re-programmability — SRAM-based in-system configuration with multiple programming modes and unlimited re-programmability for iterative development and field updates.
  • Package and supply — Surface-mount 240-BFQFP (supplier: 240-PQFP 32×32) with supply voltage range 2.375 V to 2.625 V.
  • Industrial grade and reliability — Specified operating temperature range −40 °C to 100 °C and 100% factory tested; RoHS compliant.
  • Process and manufacturing — Implemented in a 0.22 μm, 5-layer metal process supporting high routing efficiency and device performance.

Typical Applications

  • PCI and Compact PCI systems — Meets 66-MHz PCI compliance and supports hot-swappable Compact PCI use in board-level designs requiring reconfigurable logic.
  • High-speed digital processing — Up to 200 MHz system performance capability suits timing-critical signal processing and protocol handling tasks.
  • Memory interface bridging — Fast interfaces to external high-performance RAMs enable role as a protocol bridge, controller, or buffer manager.
  • Custom I/O and protocol conversion — Multi-standard SelectIO and abundant user I/O allow implementation of custom interface logic and peripheral glue logic.

Unique Advantages

  • High logic capacity: 2,700 logic elements and ~108,904 system gates support complex combinational and sequential designs without external ASICs.
  • Flexible embedded memory: 40,960 bits of on-chip RAM and LUT-configurable memory modes reduce external memory dependency for many designs.
  • Versatile I/O integration: 166 user I/O and multi-standard SelectIO support enable direct interfacing to a wide range of peripherals and memories.
  • Robust clocking: Four DLLs and a multi-tier clock distribution network simplify clock domain management and help achieve stable timing.
  • Field re-programmability: SRAM-based configuration allows unlimited reprogramming for rapid prototyping and in-field updates.
  • Industrial readiness: Specified for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.

Why Choose XCV100-5PQ240I?

The XCV100-5PQ240I offers a balanced combination of logic density, embedded memory, and I/O flexibility in a surface-mount 240-BFQFP package. Its SRAM-based architecture and comprehensive clock-management and arithmetic resources make it well suited to mid-range embedded and communications designs that require in-system reconfigurability and reliable operation across an industrial temperature range.

Designers and procurement teams will find the device appropriate for board-level implementations that demand configurable logic, direct memory interfacing, and a predictable vendor datasheet-backed feature set for lifecycle and integration planning.

Request a quote or submit an inquiry to purchase the XCV100-5PQ240I and discuss availability and lead times for your design needs.

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