XCV100-5FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA

Quantity 462 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-5FG256C – Virtex® FPGA, 256-FBGA (17×17), 176 I/O

The XCV100-5FG256C is an SRAM-based Virtex® Field Programmable Gate Array delivering a balance of programmable logic, embedded memory, and I/O capacity for commercial electronic systems. The device integrates approximately 2,700 logic elements and about 40,960 bits of on-chip RAM, combined with 176 I/O pins in a 256-FBGA (17×17) package.

Designed for system-level integration, the device is suited to applications that require multi-standard I/O, in-system reprogrammability, and flexible clock management while operating within a 2.375 V to 2.625 V supply range and a 0 °C to 85 °C commercial temperature band.

Key Features

  • Logic Capacity  Approximately 2,700 logic elements (equivalent logic cells) and 108,904 system gates provide substantial programmable logic for mid-range designs.
  • Embedded Memory  About 40,960 bits of on-chip RAM support lookup-table RAM and block RAM configurations for embedded data storage and buffering.
  • I/O and Interface  176 user I/O pins and multi-standard SelectIO™ interface capability (family-level feature) enable diverse external device connections and memory interfaces.
  • Clock Management  Built-in clock-management circuitry including dedicated delay-locked loops (DLLs) and multiple global/local clock distribution nets (family-level feature) for advanced clock control.
  • Configuration and Re-programmability  SRAM-based in-system configuration enables unlimited re-programmability and multiple programming modes for iterative development and field updates.
  • Package and Mounting  256-ball FBGA (17×17) surface-mount package for compact board-level integration.
  • Power and Operating Range  Specified supply voltage from 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C.
  • Manufacturing and Compliance  RoHS-compliant and 100% factory tested as part of the Virtex family production flow (family-level specification).

Typical Applications

  • PCI and Compact PCI systems  Family-level support for 66-MHz PCI compliance and hot-swappable Compact PCI operation make this FPGA suitable for mid-speed expansion cards and backplane appliances.
  • Prototyping and System Integration  Re-programmability and flexible I/O support iterative hardware/software co-development and integration of custom logic blocks.
  • Memory Interface and Buffering  On-chip RAM and fast interfaces to external high-performance RAMs (family-level capability) enable buffering and data-path implementations.
  • General Digital Processing  Dedicated arithmetic resources and abundant registers support custom datapaths, control logic, and glue-logic functions in commercial electronics.

Unique Advantages

  • Balanced mid-range capacity  Combines ~2,700 logic elements and ~40.96 kbits of embedded RAM to support complex logic and moderate memory needs without over-provisioning.
  • Rich I/O resource  176 I/O pins in a 256-FBGA allow broad peripheral and memory interfacing while maintaining a compact board footprint.
  • Re-programmable architecture  SRAM-based configuration enables iterative development, updates in the field, and multiple configuration modes for flexible deployment.
  • Integrated clock control  On-chip DLLs and structured clock distribution (family-level features) simplify clocking strategies for multi-domain designs.
  • Proven manufacturing flow  Produced on a mature 0.22 μm, 5-layer-metal process and shipped 100% factory tested, providing predictable supply-chain and quality characteristics (family-level information).

Why Choose XCV100-5FG256C?

The XCV100-5FG256C positions itself as a practical, re-programmable FPGA for commercial designs requiring a mid-range mix of logic, embedded memory, and I/O in a compact 256-FBGA package. Its combination of approximately 2,700 logic elements, roughly 40,960 bits of on-chip RAM, and 176 I/O make it well suited to system integration, prototyping, and PCI/Compact PCI system roles.

Backed by Virtex family development support and a proven manufacturing baseline, this device offers design flexibility and the ability to iterate in-system without hardware respins—helpful for teams focused on reducing time-to-market while retaining the option to evolve system logic post-deployment.

Request a quote or submit an inquiry to receive pricing and availability information for the XCV100-5FG256C and to discuss your design requirements.

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