XCV100-5BG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA |
|---|---|
| Quantity | 1,601 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 108904 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of XCV100-5BG256I – Virtex FPGA, 256-BBGA, Industrial
The XCV100-5BG256I is an AMD Virtex® SRAM-based Field Programmable Gate Array (FPGA) in a 256-BBGA package designed for industrial applications. The device combines a flexible logic architecture with on-chip memory and extensive I/O capability to support high-performance, reprogrammable digital designs.
Targeted use cases include interface bridging, high-speed data processing and in-system configurable logic for systems requiring re-programmability, deterministic I/O, and extended temperature range. The device balances logic density, embedded memory, and system I/O to simplify complex digital system designs.
Key Features
- Logic Capacity Approximately 2,700 logic elements (20×30 CLB array) and 108,904 system gates to implement mid-density programmable logic and custom datapaths.
- Embedded Memory Approximately 40,960 bits of on-chip RAM for lookup tables and small buffering needs.
- I/O 180 available I/O pins to support a wide range of peripheral and bus connections.
- Clock and Timing Built-in clock-management features in the Virtex family including multiple delay-locked loops (DLLs) and hierarchical global/local clock nets to support advanced clocking schemes.
- Performance and Interfaces Family-level capabilities include system performance up to 200 MHz and 66-MHz PCI compliance; supports multi-standard I/O interfaces as part of the Virtex architecture.
- Package and Mounting 256-BBGA package (supplier device package: 256-PBGA, 27×27) designed for surface-mount applications.
- Power Supply Supply voltage range: 2.375 V to 2.625 V.
- Temperature Range & Grade Industrial grade with specified operating temperature from −40 °C to 100 °C.
- Process & Test SRAM-based in-system configuration with unlimited re-programmability; 0.22 μm 5-layer metal process and 100% factory tested (Virtex family specification).
- Standards & Compliance RoHS compliant.
Typical Applications
- PCI and Expansion Cards Implement custom logic and interface control on PCI-compliant expansion cards (66‑MHz PCI capability highlighted in family features).
- CompactPCI Systems Supports hot‑swappable CompactPCI designs where in-system reconfiguration and reliable I/O are required.
- High‑Performance Data Processing Mid-density programmable datapaths and on-chip RAM enable protocol handling, packet processing, and custom signal processing blocks.
- In‑System Reconfigurable Designs SRAM-based configuration allows iterative prototyping, field updates, and design flexibility for embedded systems.
Unique Advantages
- Re-programmable Flexibility: SRAM-based in-system configuration enables unlimited re-programmability for rapid iteration and field updates.
- Balanced Resource Set: A combination of ~2,700 logic elements, ~40,960 bits of embedded RAM, and 180 I/O pins supports diverse mid-density designs without unnecessary complexity.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in industrial environments that require extended operating ranges.
- Proven FPGA Family Features: Leverages Virtex family architecture such as dedicated clock-management, hierarchical routing, and arithmetic support to simplify complex implementations.
- Compact Package: 256-BBGA (27×27) surface-mount package enables high I/O density in space-constrained boards.
- Compliance and Test Assurance: RoHS compliance and 100% factory testing (per family specification) help meet regulatory and quality requirements.
Why Choose XCV100-5BG256I?
The XCV100-5BG256I offers a practical balance of programmable logic, embedded memory, and I/O in an industrial-grade Virtex FPGA package. It is well suited for designers needing mid-density reconfigurable logic with deterministic I/O and established family-level clocking and routing capabilities.
This device benefits customers seeking a scalable FPGA platform with in-system re-programmability, a consolidated resource set for interface and datapath tasks, and manufacturer-backed development support available for the Virtex family.
Request a quote or submit a pricing inquiry to receive availability and volume pricing for the XCV100-5BG256I. Our team can provide lead-time details and help determine fit for your design requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








