XCV100-4BG256I

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA

Quantity 116 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-4BG256I – Virtex Field Programmable Gate Array, 180 I/O, 40,960-bit RAM, 2,700 logic elements, 256-BBGA

The XCV100-4BG256I is an SRAM-based Virtex FPGA providing mid-range programmable logic capacity with 2,700 logic elements and 108,904 system gates. Built for industrial applications, the device combines flexible I/O, on-chip memory, and advanced clock management to support performance-focused embedded and system designs.

This device is optimized for designs that require a balance of logic density, I/O bandwidth (180 I/O pins), and reprogrammability, while operating across an industrial temperature range and a narrow core supply window.

Key Features

  • Logic Capacity — 2,700 logic elements (20×30 CLB array) and 108,904 system gates enable medium-complexity programmable logic implementations.
  • Embedded Memory — 40,960 bits of on-chip RAM (approximately 40.96 kbits) for data buffering, state storage, and small on-chip caches.
  • I/O and Interface Flexibility — 180 I/O pins with multi-standard SelectIO support and fast interfaces to external high-performance RAMs for diverse system connectivity.
  • Clocking and Timing — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control and distribution.
  • Arithmetic and Logic Support — Dedicated carry logic, multiplier support, and cascade chains for high-speed arithmetic and wide-input functions.
  • Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and four programming modes (SelectMAP™, serial, JTAG modes noted in family datasheet).
  • Package and Mounting — 256-BBGA package case; supplier device package listed as 256-PBGA (27×27). Surface mount mounting type.
  • Electrical and Environmental — Core supply range 2.375 V to 2.625 V; operating temperature range −40 °C to 100 °C; RoHS compliant.
  • Manufacturing and Quality — 0.22 μm five-layer-metal CMOS process and 100% factory tested as specified for the Virtex family.

Typical Applications

  • PCI and Bus Interfaces — Implement 66-MHz PCI-compliant logic and Compact PCI hot-swappable modules where bus compatibility and reconfigurability are required.
  • High-speed System Logic — Use for mid-range embedded systems and custom logic where up to 200 MHz system performance and advanced clocking are needed.
  • Memory and Data Path Control — Implement interfaces to external high-performance RAM and on-chip buffering using the device’s embedded RAM and fast I/O.
  • Industrial Control and Automation — Deploy in industrial environments taking advantage of the device’s industrial temperature grade and broad I/O capability for control, monitoring, and signal processing tasks.

Unique Advantages

  • Balanced Logic and I/O — 2,700 logic elements paired with 180 I/O pins provide a practical balance for designs requiring moderate logic density with substantial external connectivity.
  • Robust Clock Management — Multiple DLLs and layered clock networks reduce clock skew and simplify timing closure for complex synchronous designs.
  • On-chip Memory for Local Storage — ~40.96 kbits of embedded RAM supports local buffering and state machines without immediate reliance on external memory.
  • Reprogrammable and In-System Configurable — SRAM-based architecture allows unlimited reprogramming and flexible configuration modes to accelerate development and in-field updates.
  • Industrial Operating Range — Specified for −40 °C to 100 °C operation, making it suitable for industrial-grade deployments that require extended temperature tolerance.
  • Proven Manufacturing Process — 0.22 μm five-layer-metal process and complete factory testing provide a consistent, production-ready FPGA option.

Why Choose XCV100-4BG256I?

The XCV100-4BG256I positions itself as a mid-range Virtex FPGA that delivers a practical mix of logic capacity, I/O count, and on-chip memory for industrial designs. Its advanced clocking resources, dedicated arithmetic support, and multi-standard I/O make it well suited for systems that require reliable, reprogrammable logic with strong timing control.

Designers and procurement teams will find value in the device’s industrial temperature rating, narrow core-voltage window for controlled power delivery, and the Virtex family’s established development support and factory-tested manufacturing pedigree—helping to reduce integration risk and simplify long-term maintenance.

Request a quote or submit an RFQ to receive pricing and lead-time information for the XCV100-4BG256I.

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