XCV100-4BG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA |
|---|---|
| Quantity | 116 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 108904 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of XCV100-4BG256I – Virtex Field Programmable Gate Array, 180 I/O, 40,960-bit RAM, 2,700 logic elements, 256-BBGA
The XCV100-4BG256I is an SRAM-based Virtex FPGA providing mid-range programmable logic capacity with 2,700 logic elements and 108,904 system gates. Built for industrial applications, the device combines flexible I/O, on-chip memory, and advanced clock management to support performance-focused embedded and system designs.
This device is optimized for designs that require a balance of logic density, I/O bandwidth (180 I/O pins), and reprogrammability, while operating across an industrial temperature range and a narrow core supply window.
Key Features
- Logic Capacity — 2,700 logic elements (20×30 CLB array) and 108,904 system gates enable medium-complexity programmable logic implementations.
- Embedded Memory — 40,960 bits of on-chip RAM (approximately 40.96 kbits) for data buffering, state storage, and small on-chip caches.
- I/O and Interface Flexibility — 180 I/O pins with multi-standard SelectIO support and fast interfaces to external high-performance RAMs for diverse system connectivity.
- Clocking and Timing — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced clock control and distribution.
- Arithmetic and Logic Support — Dedicated carry logic, multiplier support, and cascade chains for high-speed arithmetic and wide-input functions.
- Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and four programming modes (SelectMAP™, serial, JTAG modes noted in family datasheet).
- Package and Mounting — 256-BBGA package case; supplier device package listed as 256-PBGA (27×27). Surface mount mounting type.
- Electrical and Environmental — Core supply range 2.375 V to 2.625 V; operating temperature range −40 °C to 100 °C; RoHS compliant.
- Manufacturing and Quality — 0.22 μm five-layer-metal CMOS process and 100% factory tested as specified for the Virtex family.
Typical Applications
- PCI and Bus Interfaces — Implement 66-MHz PCI-compliant logic and Compact PCI hot-swappable modules where bus compatibility and reconfigurability are required.
- High-speed System Logic — Use for mid-range embedded systems and custom logic where up to 200 MHz system performance and advanced clocking are needed.
- Memory and Data Path Control — Implement interfaces to external high-performance RAM and on-chip buffering using the device’s embedded RAM and fast I/O.
- Industrial Control and Automation — Deploy in industrial environments taking advantage of the device’s industrial temperature grade and broad I/O capability for control, monitoring, and signal processing tasks.
Unique Advantages
- Balanced Logic and I/O — 2,700 logic elements paired with 180 I/O pins provide a practical balance for designs requiring moderate logic density with substantial external connectivity.
- Robust Clock Management — Multiple DLLs and layered clock networks reduce clock skew and simplify timing closure for complex synchronous designs.
- On-chip Memory for Local Storage — ~40.96 kbits of embedded RAM supports local buffering and state machines without immediate reliance on external memory.
- Reprogrammable and In-System Configurable — SRAM-based architecture allows unlimited reprogramming and flexible configuration modes to accelerate development and in-field updates.
- Industrial Operating Range — Specified for −40 °C to 100 °C operation, making it suitable for industrial-grade deployments that require extended temperature tolerance.
- Proven Manufacturing Process — 0.22 μm five-layer-metal process and complete factory testing provide a consistent, production-ready FPGA option.
Why Choose XCV100-4BG256I?
The XCV100-4BG256I positions itself as a mid-range Virtex FPGA that delivers a practical mix of logic capacity, I/O count, and on-chip memory for industrial designs. Its advanced clocking resources, dedicated arithmetic support, and multi-standard I/O make it well suited for systems that require reliable, reprogrammable logic with strong timing control.
Designers and procurement teams will find value in the device’s industrial temperature rating, narrow core-voltage window for controlled power delivery, and the Virtex family’s established development support and factory-tested manufacturing pedigree—helping to reduce integration risk and simplify long-term maintenance.
Request a quote or submit an RFQ to receive pricing and lead-time information for the XCV100-4BG256I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








