AS4C16M16S-7TCNTR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 6 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C16M16S-7TCNTR - 256Mbit Parallel SDRAM

The AS4C16M16S-7TCNTR is a 256Mbit synchronous dynamic random access memory (SDRAM) organized as 16M x 16 bits. This parallel interface DRAM operates with a clock frequency up to 143MHz and offers a fast 5.4ns access time. Designed for applications requiring substantial volatile memory with straightforward parallel interfacing, this SDRAM provides reliable data storage and retrieval for embedded systems, computing platforms, and data buffering applications.

Operating from a 3V to 3.6V supply and specified for commercial temperature range (0°C to 70°C), this device delivers proven SDRAM architecture in a compact 54-TSOP II package suitable for space-constrained designs.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 16M x 16 bits provides efficient word-wide data access with straightforward addressing schemes.
  • Performance Specifications - 143MHz clock frequency and 5.4ns access time enable responsive read/write operations for time-sensitive applications.
  • Parallel Interface - Conventional parallel SDRAM interface simplifies integration with processors and controllers that support standard DRAM protocols.
  • Power Supply - 3V to 3.6V operating voltage aligns with common embedded system power rails and reduces power conversion complexity.
  • Package Format - 54-pin TSOP II package with 10.16mm width offers a balance between pin count and board footprint.
  • Operating Temperature - 0°C to 70°C commercial temperature range suits standard indoor and controlled environment applications.

Typical Applications

  • Embedded Computing Systems - This SDRAM serves as main memory or data cache in embedded processors and microcontroller-based systems where parallel memory interfaces are standard, providing cost-effective volatile storage for program execution and data manipulation.
  • Data Buffering and Storage - In networking equipment and communication devices, this memory acts as a temporary buffer for packet processing and data staging, where the 256Mbit capacity accommodates substantial data queues while the parallel interface enables rapid data transfers.
  • Consumer Electronics - Set-top boxes, digital displays, and multimedia devices utilize this SDRAM for frame buffers and application memory, benefiting from the wide 16-bit data path for efficient video and graphics data handling.
  • Legacy System Maintenance - As an obsolete component, this part serves replacement and repair needs for existing deployed systems, allowing continued operation of proven designs without requiring costly redesigns.

Unique Advantages

  • Standard SDRAM Architecture: Proven technology with widespread controller support simplifies design integration and reduces development risk compared to newer memory technologies requiring specialized interfaces.
  • Word-Wide Organization: 16-bit data width matches common processor bus architectures, minimizing glue logic and enabling efficient data transfers without byte-packing overhead.
  • Mature Technology Node: As an established SDRAM design, engineers benefit from extensive application notes, reference designs, and troubleshooting resources accumulated over years of industry deployment.
  • Compact TSOP Packaging: Surface-mount format occupies less board space than through-hole alternatives while maintaining reliable solder joint formation for manufacturing.
  • Single Supply Operation: 3V to 3.6V operation eliminates the need for multiple voltage rails, simplifying power supply design and reducing component count.

Why Choose AS4C16M16S-7TCNTR?

This SDRAM represents a straightforward memory solution for designs requiring parallel interface volatile storage with commercial-grade specifications. While designated as obsolete in its lifecycle status, the AS4C16M16S-7TCNTR continues to serve critical roles in maintaining and repairing existing systems that depend on this specific memory configuration.

For legacy system support, replacement inventory, and applications where proven parallel SDRAM technology meets requirements, this component offers the memory capacity and performance characteristics that have made conventional SDRAM a reliable choice across countless embedded designs.

Request a Quote

For pricing, availability, and technical support for the AS4C16M16S-7TCNTR, contact our sales team. We can assist with sourcing requirements, provide technical documentation, and help identify suitable alternatives for new designs seeking current-production memory solutions.

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