AS4C16M16SA-6BINTR
| Part Description |
IC DRAM 256MBIT PAR 54TFBGA |
|---|---|
| Quantity | 763 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of AS4C16M16SA-6BINTR - 256Mb Parallel SDRAM
The AS4C16M16SA-6BINTR is a 256-megabit synchronous dynamic random access memory (SDRAM) device from Alliance Memory, Inc. Built on proven SDRAM technology, this memory IC offers a 16M x 16 organization optimized for embedded systems requiring reliable parallel memory access. With a 166MHz clock frequency and -40°C to 85°C industrial temperature range, this component serves applications demanding consistent performance across varying environmental conditions.
Key Features
- Memory Architecture - 256Mb capacity organized as 16M x 16, providing flexible data access for embedded applications requiring word-wide memory interfaces.
- Performance Specifications - 5ns access time with 166MHz clock frequency ensures responsive memory operations. The 12ns write cycle time supports rapid data updates.
- Power and Voltage - Operates on standard 3V to 3.6V supply voltage, compatible with common embedded system power rails.
- Interface - Parallel interface enables straightforward integration with processors and controllers using traditional memory bus architectures.
- Package - 54-pin TFBGA package (8x8mm) delivers high density in a compact footprint suitable for space-constrained designs.
- Temperature Range - Industrial temperature rating of -40°C to 85°C ensures reliable operation in harsh environments beyond consumer electronics specifications.
Typical Applications
- Industrial Control Systems - This SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interfaces where the extended temperature range ensures consistent operation in factory floor environments subject to temperature fluctuations.
- Embedded Computing - The parallel interface and reliable performance make this memory suitable for single-board computers and embedded processors requiring moderate-density volatile storage for real-time operating systems and application code.
- Automotive Infotainment - With its industrial temperature tolerance, this memory serves automotive dashboard displays and infotainment systems where components must withstand vehicle interior temperature extremes.
- Test and Measurement Equipment - The device provides data buffer memory for oscilloscopes, data loggers, and industrial measurement instruments that capture and process time-series data in laboratory and field environments.
- Communication Equipment - Network switches, routers, and telecommunication devices use this SDRAM for packet buffering and routing table storage where predictable latency and temperature resilience are essential.
Unique Advantages
- Proven SDRAM Technology: Mature technology reduces integration risk compared to newer memory architectures, simplifying validation and reducing time-to-market for established designs.
- Extended Temperature Capability: Industrial -40°C to 85°C range eliminates the need for thermal management in many applications, reducing BOM cost and design complexity.
- Compact TFBGA Packaging: The 8x8mm footprint saves board space in dense electronic assemblies while maintaining reliable ball-grid connectivity.
- Standard Voltage Operation: 3.3V compatibility allows direct interface with common microcontrollers and processors without level shifters, simplifying power architecture.
- Active Lifecycle Status: Current production availability ensures long-term supply continuity for products with multi-year lifecycles.
- Alliance Memory Reliability: Sourced from a manufacturer specializing in memory solutions, providing focused expertise and supply chain stability for critical memory components.
Why Choose AS4C16M16SA-6BINTR?
This parallel SDRAM is positioned for engineers developing industrial, automotive, and embedded systems where proven reliability matters more than cutting-edge density. The 256Mb capacity hits a practical sweet spot for embedded applications that need moderate volatile storage without the complexity of larger, higher-speed alternatives. For designs requiring industrial temperature operation with standard parallel memory interfaces, this component delivers field-tested performance with minimal integration effort.
Long-term value comes from supply stability and mature technology—fewer surprises during production ramp and sustained availability for products with extended lifecycles. The combination of industrial temperature rating, compact packaging, and conventional SDRAM architecture makes this device a pragmatic choice for cost-sensitive designs where reliability cannot be compromised.
Get Started
Contact our sales team to discuss your memory requirements and request a quote for the AS4C16M16SA-6BINTR. We can provide technical support, pricing for production volumes, and delivery timelines tailored to your project schedule.
