AS4C16M16SA-6BAN

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 193 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeAutomotive
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word Page12 nsPackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.0024

Overview of AS4C16M16SA-6BAN – 256 Mbit SDRAM, 54-TFBGA

The AS4C16M16SA-6BAN is a 256 Mbit volatile DRAM device implemented in SDRAM architecture with a parallel memory interface. It is organized as 16M × 16 and supplied in a 54-TFBGA (8×8) package for compact board-level integration.

Designed for applications requiring high-speed parallel memory, the device provides a 166 MHz clock frequency, 5 ns access time and a write cycle time (word page) of 12 ns. It is qualified to AEC-Q100 and specified over an operating temperature range of −40°C to 105°C.

Key Features

  • Memory Type & Architecture SDRAM, volatile memory organized as 16M × 16 for 256 Mbit capacity.
  • Performance 166 MHz clock frequency with a 5 ns access time and 12 ns write cycle time (word page) for parallel memory operations.
  • Interface Parallel memory interface suitable for designs requiring parallel DRAM connectivity.
  • Power Rated supply voltage 3.0 V to 3.6 V to match common system voltage domains.
  • Package 54-TFBGA (8×8) package for compact surface-mount deployment.
  • Temperature Range Specified for operation from −40°C to 105°C (TA).
  • Qualification AEC-Q100 qualified; listed with Automotive grade.

Typical Applications

  • Automotive modules AEC-Q100 qualification and the −40°C to 105°C range make this DRAM suitable for automotive electronic modules requiring SDRAM storage.
  • Embedded memory expansion Provides 256 Mbit of parallel SDRAM capacity for embedded controllers and systems that need fast read/write buffer memory.
  • High-temperature environments Specified operating temperature enables deployment in systems exposed to extended temperature ranges.

Unique Advantages

  • Automotive-grade qualification: AEC-Q100 qualification and an Automotive grade designation support use in automotive system designs.
  • High-speed operation: 166 MHz clock frequency and 5 ns access time enable responsive parallel memory performance.
  • Compact BGA footprint: 54-TFBGA (8×8) package minimizes PCB area while supporting surface-mount assembly.
  • Wide operating voltage: 3.0 V to 3.6 V supply range aligns with common system power rails.
  • Robust temperature range: −40°C to 105°C rating supports deployment across demanding thermal environments.
  • Clear memory organization: 16M × 16 organization provides deterministic capacity and data-width characteristics for system designers.

Why Choose AS4C16M16SA-6BAN?

The AS4C16M16SA-6BAN combines a 256 Mbit SDRAM architecture with fast access and write timings in a compact 54-TFBGA package, making it suitable for designs that require reliable parallel DRAM performance. Its AEC-Q100 qualification, automotive grade listing and wide temperature range support use in demanding automotive and industrial environments.

Engineers specifying this device benefit from a clear memory organization (16M × 16), a 3.0 V–3.6 V supply window and verified timing characteristics (166 MHz clock, 5 ns access, 12 ns write cycle) to integrate predictable SDRAM capacity into system-level designs.

Request a quote or contact sales to discuss pricing, lead times and technical details for the AS4C16M16SA-6BAN.

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