AS4C8M16D1-5TINTR

IC DRAM 128MBIT PAR 66TSOP II
Part Description

IC DRAM 128MBIT PAR 66TSOP II

Quantity 50 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size128 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C8M16D1-5TINTR - 128Mbit DDR SDRAM with Industrial Temperature Range

The AS4C8M16D1-5TINTR is a 128-megabit DDR SDRAM memory device from Alliance Memory, Inc., organized as 8M x 16 bits. This parallel interface DRAM operates at 200MHz clock frequency with 7ns access time, making it suitable for applications requiring fast, volatile memory in industrial environments. The device supports a wide temperature range of -40°C to 85°C, ensuring reliable operation in demanding conditions.

Key Features

  • Memory Architecture: 128Mbit capacity organized as 8M x 16, providing efficient word-wide data access for parallel bus systems.
  • DDR SDRAM Technology: Double data rate synchronous operation delivers high bandwidth with 200MHz clock frequency and 7ns access time.
  • Power Supply: Operates on 2.3V to 2.7V supply voltage, supporting low-power system designs.
  • Industrial Temperature Range: Qualified for -40°C to 85°C ambient temperature operation, suitable for harsh environmental conditions.
  • Package: Available in 66-pin TSOP II (10.16mm width) surface-mount package for compact PCB layouts.
  • Write Cycle Performance: 15ns write cycle time enables fast data updates in dynamic memory applications.

Typical Applications

  • Industrial Control Systems: This DDR SDRAM provides reliable data buffering for PLCs, motion controllers, and industrial HMIs where the extended temperature range ensures consistent operation in factory floor environments.
  • Embedded Computing: The parallel interface and compact TSOP II package make this memory well-suited for embedded processors and microcontrollers requiring volatile working memory in space-constrained designs.
  • Test and Measurement Equipment: Fast access times and DDR bandwidth support high-speed data acquisition and signal processing applications where temporary storage of measurement data is required.
  • Communications Infrastructure: Serves as buffer memory in routers, switches, and telecom equipment where industrial temperature tolerance supports deployment in equipment closets and outdoor enclosures.

Unique Advantages

  • Industrial Temperature Qualification: The -40°C to 85°C operating range eliminates the need for environmental controls in harsh deployment scenarios, reducing system cost and complexity.
  • Parallel Interface Compatibility: Direct connection to parallel bus architectures simplifies integration with legacy systems and microcontrollers without requiring specialized memory controllers.
  • Proven DDR SDRAM Technology: Mature technology provides predictable performance and reliability, reducing design risk in long-lifecycle industrial products.
  • Compact Form Factor: The 66-TSOP II package minimizes board space requirements while providing sufficient pin count for the 16-bit data path and control signals.
  • Low Voltage Operation: 2.3V to 2.7V supply voltage compatibility supports modern low-power system designs and reduces power dissipation in thermally-constrained applications.

Why Choose AS4C8M16D1-5TINTR?

The AS4C8M16D1-5TINTR addresses the specific needs of industrial and embedded system designers who require reliable DDR SDRAM with extended temperature qualification. The parallel interface design provides straightforward integration with microcontrollers and processors that support traditional memory bus architectures, while the 200MHz operation and 7ns access time deliver adequate performance for control, buffering, and data processing tasks.

For designs targeting industrial automation, outdoor equipment, or other harsh-environment applications, the -40°C to 85°C temperature range ensures stable operation without additional thermal management. The device's 128Mbit capacity and 8M x 16 organization provide a practical balance of density and bus width for many embedded applications.

Get a Quote

Contact our sales team to discuss availability, pricing, and technical support for the AS4C8M16D1-5TINTR. Our application engineers can assist with integration guidelines, timing considerations, and help you evaluate whether this memory device meets your specific design requirements.

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