JSR364G168NHR-LI

The JSR364G168NHR-LI is a 4 Gbit DDR3L SDRAM organized as 256M × 16 and designed for surface-mount board implementations. It implements DDR3L architecture at a nominal VDD/VDDQ of 1.35V, offering low-voltage DDR3 operation with features required for memory subsystems.

Targeted for industrial-temperature systems, the device supports extended operating conditions and standard DDR3 timing options for use in designs that require a compact 96‑ball FBGA package and a wide operating temperature range.

Key Features

• Memory Core 4 Gbit DDR3L SDRAM organized as 256M × 16 (x16). Volatile RAM with standard DDR3 architecture and 8 internal banks.
• Performance & Timing Specified clock frequency: 933 MHz (DDR interface). Key timing points in the product family include support for DDR3‑1600, DDR3‑1866 and DDR3‑2133 rates with programmable CAS, additive latency and CWL (example: CL = 13 at DDR3‑1866).
• Low‑Voltage Operation VDD = VDDQ = 1.35V (operating range 1.283–1.45V) with backward compatibility to 1.5V operation where applicable.
• Signal & I/O Features Differential bidirectional data strobe, differential clock inputs (CK/CK#), nominal and dynamic on‑die termination (ODT) for data, strobe and mask signals, and fixed BL8/BC4 burst options.
• System Reliability & Self‑Management Self‑refresh modes including automatic self refresh (ASR) and self refresh temperature (SRT), write leveling, output driver calibration and programmable on‑die termination settings.
• Package & Mounting 96‑FBGA surface‑mount package (96‑ball, 7.5 × 13.0 mm) for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to +95 °C for use in extended-temperature systems.
• Compliance RoHS compliant; lead‑free and halogen‑free FBGA options indicated in device family documentation.

Typical Applications

• Industrial Systems — Memory for controllers and equipment that require extended operating temperatures and robust DRAM features.
• Board‑Level Surface‑Mount Designs — Compact 96‑FBGA package suited for space‑constrained PCB implementations.
• Low‑Voltage DDR3L Memory Subsystems — Systems designed for 1.35V DDR3L operation or backward compatibility with 1.5V DDR3.

Unique Advantages

• Extended Temperature Rating: Supports −40 °C to +95 °C operation, enabling deployment in industrial‑grade environments.
• Low‑Voltage DDR3L: 1.35V nominal supply reduces power compared with standard 1.5V DDR3 while maintaining DDR3 feature set and compatibility options.
• Compact FBGA Package: 96‑ball FBGA (7.5 × 13.0 mm) provides a high‑density memory option for space‑sensitive board designs.
• Flexible Timing Options: Family timing supports DDR3‑1600/1866/2133 profiles with programmable CAS, AL and CWL for design tuning.
• On‑Die Termination & Calibration: Nominal and dynamic ODT plus output driver calibration and write‑leveling simplify signal integrity tuning on modern DDR buses.
• RoHS Compliant: Lead‑free and halogen‑free packaging options align with common environmental requirements.

Why Choose JSR364G168NHR-LI?

JSR364G168NHR-LI provides a practical, industrial‑grade DDR3L memory option with a 4 Gbit density in a 256M × 16 organization. Its 1.35V nominal supply, programmable timing, and on‑die termination features make it suitable for designs that require standard DDR3 functionality with low‑voltage operation and extended temperature capability.

This device is appropriate for engineers specifying compact, surface‑mount DRAMs for industrial systems and other applications that need verified DDR3L features and configurable timing behavior. The FBGA package and RoHS compliance support modern manufacturing and board‑level integration processes.

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