JSR364G168NHR-I

The JSR364G168NHR-I from Jeju Semiconductor is a 4 Gbit DDR3 SDRAM organized as x16 in a surface-mount 96-FBGA package (7.5 × 13.0 mm). It is specified for 1.5 V operation and rated for industrial temperature operation from −40 °C to +95 °C.

This device targets applications requiring board-level DRAM capacity with DDR3 signaling and industry-grade operating range. Key attributes include a 933 MHz clock capability and an access time of 13.91 ns, delivered in a compact 96-ball FBGA form factor with RoHS-compliant materials.

Key Features

• Memory Capacity and Organization 4 Gbit density organized as x16, providing board-level DRAM capacity in a single package.
• DDR3 SDRAM Technology DDR3 SDRAM architecture with DDR3 interface signaling suitable for standard DDR3 system implementations.
• Performance Rated clock frequency of 933 MHz with an access time of 13.91 ns for responsive memory access.
• Power Designed for 1.5 V VDD/VDDQ operation as specified in the product data.
• Package & Mounting Surface-mount 96-FBGA (96-ball BGA, 7.5 × 13.0 mm) for compact board integration and high-density layouts.
• Industrial Temperature Range Specified to operate from −40 °C to +95 °C for use in demanding environmental conditions.
• Compliance RoHS compliant; lead-free and halogen-free package options are indicated in the series documentation.

Typical Applications

• Industrial Embedded Systems Provides 4 Gbit DDR3 memory capacity with an industrial temperature rating (−40 °C to +95 °C), suitable for embedded controllers and automation equipment requiring wide-temperature operation.
• Board-Level Memory Expansion Compact 96-FBGA package enables high-density memory integration on space-constrained PCBs for system memory expansion.
• Ruggedized Control Modules Industrial-grade specification and surface-mount package make the device appropriate for control and instrumentation modules operating in challenging environments.

Unique Advantages

• Industrial Temperature Qualification Rated for −40 °C to +95 °C operation, enabling use in extended-temperature environments without additional thermal qualification.
• Balanced Performance 933 MHz clock rate combined with a 13.91 ns access time offers a balance of throughput and latency for DDR3 system designs.
• Standard DDR3 Interface DDR3 SDRAM signaling and timing characteristics simplify integration into existing DDR3 memory controllers and layouts.
• Compact FBGA Package 96-ball FBGA (7.5 × 13.0 mm) delivers high density in a small footprint, aiding miniaturized board designs.
• Regulatory Compliance RoHS-compliant materials support environmental and manufacturing requirements.
• Manufacturer Support Backed by Jeju Semiconductor documentation for the 4Gb DDR3(L) SDRAM family, including package and timing information.

Why Choose JSR364G168NHR-I?

The JSR364G168NHR-I positions itself as a reliable, industrial-grade DDR3 memory component that combines 4 Gbit capacity with DDR3 signaling, a 96-FBGA package, and a wide operating temperature range. Its 1.5 V supply and defined timing characteristics provide a straightforward option for designers who need board-level DRAM density with predictable electrical and thermal behavior.

This device is well suited for engineers designing industrial embedded systems, rugged control modules, and compact boards requiring reliable DDR3 memory. Comprehensive series documentation and datasheet support make it practical for integration, qualification, and long-term deployment in temperature-challenging environments.

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