JSR364G168NHR

The JSR364G168NHR from Jeju Semiconductor is a 4 Gbit DDR3 SDRAM device organized as 256M × 16. Built for commercial-grade embedded memory applications, this DDR3 SDRAM delivers a compact, surface-mount solution in a 96‑FBGA (7.5 × 13.0 mm) package. It targets systems that require high-density volatile memory with standard DDR3 signaling and a 1.5 V supply.

Typical use cases include system memory for consumer and industrial-class designs where compact package, RoHS compliance, and predictable timing performance (13.91 ns access time) are required.

Key Features

• Memory Core 4 Gbit capacity organized as 256M × 16, volatile DDR3 SDRAM suitable for high-density memory arrays.
• Performance Specified clock frequency of 933 MHz and an access time of 13.91 ns for timing-sensitive applications.
• Interface & Architecture Standard DDR3 SDRAM interface with x16 memory organization and internal features consistent with DDR3 architecture.
• Power 1.5 V supply voltage (VDD) typical for DDR3 operation.
• Package & Mounting 96‑FBGA surface-mount package (96‑BGA, 7.5 × 13.0 mm) for compact board-level integration.
• Temperature & Grade Commercial grade with operating temperature range 0 °C to 85 °C.
• Regulatory RoHS‑compliant, lead-free and halogen-free package construction.

Typical Applications

• Embedded Systems Provides high-density volatile memory for embedded controllers and single-board computers requiring DDR3 interfaces.
• Consumer Electronics Ideal for compact consumer devices that need a 4 Gbit DDR3 memory in a small FBGA footprint.
• Networking & Communications Suitable for memory buffering and packet processing in networking modules that support DDR3 SDRAM.

Unique Advantages

• High-density 4 Gbit capacity Enables more memory per device, reducing the number of components and simplifying board layout.
• Compact FBGA package 96‑ball FBGA (7.5 × 13.0 mm) delivers a small footprint for space-constrained designs while retaining robust ball-grid connectivity.
• Standard DDR3 signaling Compatibility with DDR3 interfaces simplifies system integration with existing DDR3 controllers and platforms.
• Commercial temperature rating 0 °C to 85 °C operational range suits mainstream applications and simplifies qualification for consumer and commercial products.
• RoHS‑compliant manufacture Lead-free and halogen-free construction supports regulatory and environmental requirements.

Why Choose JSR364G168NHR?

JSR364G168NHR combines 4 Gbit DDR3 density with a compact 96‑FBGA footprint and standard x16 organization, making it a practical memory choice for designers who need predictable DDR3 timing and small-board integration. Its 1.5 V operation and documented access time (13.91 ns) provide clear engineering parameters for system timing and power budgeting.

This device is well suited for commercial embedded, consumer, and networking designs that require high-density volatile memory in a RoHS‑compliant package. Its combination of capacity, package size, and DDR3 interface support helps streamline BOM and layout decisions while fitting established DDR3 ecosystems.

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