JSR364G168NHR-A

The JSR364G168NHR-A is a 4 Gbit DDR3 SDRAM device organized as 256M × 16, designed for board‑level integration where industry-standard DDR3 memory is required. It implements DDR3 SDRAM architecture with x16 organization, a 1.5 V supply and comes in a compact 96‑ball FBGA (7.5 × 13.0 mm) surface‑mount package.

Targeted for commercial‑temperature systems (0 °C to 85 °C), the device supports high data‑rate operation (DDR3‑2133 timing with CL14) and provides programmable read/write latencies and on‑die termination features for system tuning and signal integrity management.

Key Features

• Memory Capacity & Organization 4 Gbit total capacity, organized as 256M × 16 with 8 internal banks to support standard DDR3 addressing and page sizes.
• Technology & Interface DDR3 SDRAM technology with differential bidirectional data strobe and differential clock inputs (CK, CKB) for standard DDR3 system interfacing.
• Performance & Timing Supports DDR3‑2133 speed grade (‑A) with timing 14‑14‑14 (CL = 14) and documented timing values such as 13.09 ns access metrics; clock frequency listed at 1.066 GHz.
• Voltage & Power Standard DDR3 supply voltage: 1.5 V. On‑die termination (ODT) and output driver calibration are supported for improved signal integrity.
• Programmability & DRAM Features Programmable CAS (READ) latency (CL), programmable posted CAS additive latency (AL), programmable CAS (WRITE) latency (CWL), fixed burst length options (BL8/BC4), and write leveling.
• Package & Mounting 96‑FBGA, surface‑mount package (96‑BGA, 7.5 × 13.0 mm) for compact PCB integration.
• Commercial Temperature Range Rated for 0 °C to 85 °C operation (commercial grade).
• Standards & Compliance Lead‑free and halogen‑free FBGA packaging; RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Provides 4 Gbit of DDR3 x16 memory for embedded designs operating within commercial temperature ranges.
• High‑Bandwidth DDR3 Designs — Supports DDR3‑2133 timing (CL14) for systems requiring higher data‑rate DDR3 operation.
• Board‑Level Memory Subsystems — 96‑ball FBGA package and surface‑mount mounting facilitate compact board integration and module implementations.

Unique Advantages

• High‑density DDR3 capacity: 4 Gbit in a single x16 device simplifies BOM and enables larger memory footprints without adding multiple components.
• DDR3‑2133 timing support (‑A grade): Documented timing for 2133 MT/s (14‑14‑14) provides headroom for higher throughput DDR3 designs.
• Standard 1.5 V supply: Compatibility with typical DDR3 power rails simplifies power distribution in legacy and standard DDR3 systems.
• Compact FBGA package: 96‑ball (7.5 × 13.0 mm) FBGA minimizes PCB area while supporting surface‑mount assembly.
• System tuning features: Programmable CL/AL/CWL, ODT and write leveling allow designers to optimize timing and signal integrity for target platforms.
• RoHS‑compliant, lead‑free packaging: Meets environmental requirements for lead‑free, halogen‑free board designs.

Why Choose JSR364G168NHR-A?

The JSR364G168NHR-A offers a combination of high density, DDR3‑standard timing and a compact FBGA footprint for commercial‑temperature systems requiring 4 Gbit of x16 DDR3 memory. With documented DDR3‑2133 timing (CL14), programmable latency features and on‑die termination support, it provides the timing flexibility and signal integrity controls necessary for higher‑speed DDR3 implementations.

This device is well suited to designs that demand a single‑chip 4 Gbit DDR3 solution in a small form factor, enabling straightforward board‑level integration while maintaining compliance with RoHS and common DDR3 electrical interfaces.

Request a quote or submit a procurement inquiry to begin integrating the JSR364G168NHR-A into your design and evaluate fit for your memory subsystem requirements.