JSR364G168NHR-AI

The JSR364G168NHR-AI is a 4 Gbit DDR3 SDRAM device in a x16 memory organization designed for surface-mount applications. It implements DDR3 SDRAM architecture with a 96‑FBGA (7.5 × 13.0 mm) package and is specified for industrial temperature operation.

This device targets designs that require compact, high‑density volatile memory with industry-grade temperature tolerance and standard DDR3 signaling. Key attributes include a 1.5 V supply, a 1.066 GHz clock specification, and an access time of 13.09 ns.

Key Features

• Memory Core  4 Gbit density in a 256M × 16 organization for higher per‑device data width and addressability.
• DDR3 Interface & Architecture  DDR3 SDRAM interface with 8n‑bit prefetch architecture and differential clock inputs (CK/CKB) as defined by the series specification.
• Performance Timings  Series timing grades support DDR3‑2133 (CL14), DDR3‑1866 (CL13) and DDR3‑1600 (CL11); this part lists an access time of 13.09 ns and a clock frequency of 1.066 GHz in the product specification.
• Power  Standard DDR3 supply voltage of 1.5 V as specified for this part.
• Package & Mounting  96‑ball FBGA surface‑mount package (96‑BGA, 7.5 × 13.0 mm) for compact board footprint and high pin density.
• Industrial Temperature Range  Specified operating temperature from −40 °C to +95 °C for use in industrial environments.
• Reliability Features  Series-level features include internal bank architecture, on‑die termination options, self‑refresh modes and write‑leveling support as documented in the datasheet.
• Environmental Compliance  RoHS compliant construction (lead‑free, halogen‑free material set as noted for the series).

Typical Applications

• Industrial Control Systems  Provides high‑density volatile memory that maintains operation across −40 °C to +95 °C for industrial controllers and automation equipment.
• Embedded Systems  Compact 96‑FBGA package and x16 organization suit embedded platforms requiring a small footprint and substantial working memory.
• Ruggedized Electronics  Industrial temperature specification and surface‑mount FBGA packaging support compact designs deployed in demanding environments.

Unique Advantages

• High density in a compact package: 4 Gbit capacity in a 96‑ball FBGA (7.5 × 13.0 mm) reduces board area while increasing memory per device.
• Industrial temperature rating: −40 °C to +95 °C operating range supports long‑life deployment in harsh and variable environments.
• Standard DDR3 signaling and voltage: 1.5 V supply and DDR3 SDRAM interface enable integration with common DDR3 memory controllers.
• Fast access characteristics: Documented access time of 13.09 ns and supported high speed grades in the series provide low latency memory access for time‑sensitive tasks.
• Series feature set: On‑die termination, self‑refresh, write‑leveling and programmable CAS and write latencies (as described in the series datasheet) help simplify system timing and signal integrity design.
• Regulatory compliance: RoHS‑compliant, lead‑free and halogen‑free package options aligned with the series documentation.

Why Choose JSR364G168NHR-AI?

JSR364G168NHR-AI positions itself as a high‑density DDR3 memory building block for engineers designing compact, industrial‑grade systems. With a 4 Gbit capacity, x16 organization and a 96‑FBGA footprint, it balances capacity and board space while operating from a standard 1.5 V supply.

Its industrial temperature rating, documented access time and series‑level DDR3 feature set make it well suited for applications that require reliable volatile memory across a wide temperature range. Technical documentation is available from the manufacturer to support integration and validation in production designs.

Request a quote or submit an inquiry to obtain pricing and availability for JSR364G168NHR-AI and to discuss lead times or volume requirements.