F59L4G81XB-25BCIAG2X

4Gb NAND Flash Auto.
Part Description

SLC NAND Flash, 4Gbit, (512M x 8), 3.3V, x8, 25ns, 67-ball BGA, Automotive

Quantity 1,574 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-67Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size4 GbitAccess Time20 nsGradeAutomotive
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C – 105°CWrite Cycle Time Word Page200 µsPackaging67-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.00.71

Overview of F59L4G81XB-25BCIAG2X – SLC NAND Flash, 4Gbit, (512M x 8), 3.3V, x8, 25ns, 67-ball BGA, Automotive

The ESMT F59L4G81XB-25BCIAG2X is a 4.295 Gbit single-level cell (SLC) NAND Flash device organized as 512M × 8 with a parallel x8 interface. It implements the ONFI 1.0 command set and provides a standard asynchronous NAND interface with control signals such as CE#, CLE, ALE, WE#, RE#, R/B# and WP# for straightforward integration.

Designed for automotive and industrial applications, this device delivers wide operating voltage (2.7–3.6V), extended temperature range (−40°C to 105°C) and AEC-Q100 qualification, combining endurance, data retention and package options suited for robust embedded storage needs.

Key Features

  • Memory & Organization 4.295 Gbit capacity organized as 512M × 8 with a page size of 4,352 bytes (4,096 + 256) and a block size of 64 pages; single plane architecture.
  • Technology Single-level cell (SLC) NAND Flash technology for non‑volatile storage.
  • Interface & Timing Parallel x8 asynchronous interface compliant with ONFI 1.0; access time 20 ns and RC/WC timing of 25 ns for command/address cycles.
  • Program / Read / Erase Performance Typical program page time ~200 µs (240 µs with on‑die ECC enabled); read page time up to 115 µs with on‑die ECC enabled and 25 µs with ECC disabled; typical erase block time ~2 ms.
  • Endurance & Data Retention Endurance rated to 100,000 program/erase cycles; data retention compliant with JESD47G and uncycled data retention specified as 10 years at 70°C.
  • Reliability & Error Management 8-bit internal ECC available (disabled by default and configurable via SET FEATURE); features include permanent block locking (blocks 47:0), OTP mode, read unique ID and internal data move operations.
  • Power & Temperature Supply voltage range 2.7–3.6V and operating temperature range −40°C to 105°C, suitable for harsh environments.
  • Package & Mounting 67-ball BGA (BGA-67) surface-mount package option for compact board-level integration.
  • Automotive Qualification & Compliance AEC-Q100 qualification and RoHS compliance for automotive and environmentally conscious designs.

Typical Applications

  • Automotive Embedded Storage Non-volatile program and data storage for automotive systems where AEC-Q100 qualification and extended temperature range are required.
  • Industrial Control & Data Logging Reliable SLC storage for industrial controllers, factory automation and long-term data logging with high endurance and long retention.
  • Embedded Systems Firmware and application storage for embedded platforms requiring a parallel NAND interface and compact BGA mounting.

Unique Advantages

  • Automotive-Grade Endurance: AEC‑Q100 qualification combined with 100,000 program/erase cycles supports demanding automotive and industrial lifecycle requirements.
  • Configurable On‑Die ECC: 8-bit internal ECC is available and can be toggled via SET FEATURE, allowing designers to balance error protection and performance.
  • Flexible Interface & Standard Command Set: ONFI 1.0 compliance and a standard asynchronous x8 interface simplify integration and enable density migration without board redesign.
  • Wide Voltage and Temperature Range: 2.7–3.6V supply and −40°C to 105°C operating range support robust operation across harsh environments.
  • Compact, Surface‑Mount Package: 67-ball BGA packaging provides a small footprint for space-constrained PCB layouts while maintaining reliable soldered mounting.
  • Long-Term Data Retention: JESD47G-compliant retention and 10-year uncycled retention at 70°C provide assurance for long-lived storage applications.

Why Choose F59L4G81XB-25BCIAG2X?

The ESMT F59L4G81XB-25BCIAG2X is positioned for designs that require automotive-qualified SLC NAND with proven endurance, configurable error management and a compact BGA footprint. Its combination of ONFI-compliant parallel interface, wide voltage range and extended temperature rating make it suitable for embedded storage in automotive and industrial systems.

Selecting this device supports long-term reliability and maintainable integration thanks to standard NAND command compatibility, on‑die ECC options and AEC‑Q100 qualification from the manufacturer.

Request a quote or submit an order inquiry to get pricing and availability for the F59L4G81XB-25BCIAG2X. Our team will respond with lead-time and supply options tailored to your project requirements.

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