F59L4G81KSA-25TIG2N

4Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 4Gbit, Industrial

Quantity 904 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size4 GbitAccess Time20 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page400 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59L4G81KSA-25TIG2N – SLC NAND Flash, 4Gbit, Industrial

The F59L4G81KSA-25TIG2N is a 4 Gbit (512M × 8) Single-Level Cell (SLC) NAND flash memory device organized as two stacked 2Gb dies. It provides parallel NAND operation in a 48-pin TSOPI package with a 3.3 V supply range (2.7 V to 3.6 V) and is specified for industrial operation from −40 °C to 85 °C.

Designed for high-reliability non-volatile storage, the device targets embedded storage use cases such as solid-state file storage, voice and image data memory, and boot/firmware storage where endurance, data retention and JEDEC qualification matter.

Key Features

  • Core & Memory Type 4 Gbit SLC NAND flash, implemented as two stacked 2Gb dies for multi-die operations and flexible memory management.
  • Organization & Capacity 512M × 8 organization with a page size of (2K + 128) bytes and a data register matching that page size for 2176-byte transfers.
  • Performance & Timing 25 ns speed grade (device ordering), read cycle 25 ns (datasheet), and a listed access time of 20 ns; typical page program time 400 µs (typ.), block erase typical 3 ms.
  • Endurance & Retention SLC endurance rated to 50K program/erase cycles and uncycled data retention specified as 10 years at 55 °C, with an ECC requirement of 8-bit per 512-byte sector.
  • Interface & Operations Parallel NAND interface with command/address/data multiplexed on the DQ port, supporting cache program/read, copy-back, two-plane and EDO modes, plus automatic program/erase handling.
  • Power & Protection VCC range 2.7 V to 3.6 V; includes hardware data protection features such as program/erase lockout during power transitions and write-protect support.
  • Package & Temperature Surface-mount TSOPI-48 package (12 mm × 20 mm body, 0.5 mm pitch) and industrial temperature grade from −40 °C to 85 °C with JEDEC qualification.

Typical Applications

  • Embedded Storage — High-reliability non-volatile storage for embedded systems requiring SLC endurance and long data retention.
  • Consumer Imaging & Voice Recording — Image file memory for still cameras and voice recording applications that benefit from the device's page/program architecture and cache operations.
  • Boot & Firmware Storage — Supports boot-from-NAND and automatic memory download for firmware storage and system boot sequences.
  • Industrial Data Logging — Temperature-rated and JEDEC-qualified storage suitable for industrial logging and data capture where robustness is required.

Unique Advantages

  • SLC Endurance: 50K program/erase cycles provide a durable storage medium for write-intensive embedded applications.
  • Long Data Retention: Uncycled retention of 10 years at 55 °C supports long-term archival and product lifecycles.
  • Wide Supply Range: 2.7 V to 3.6 V operation eases integration across 3.3 V system domains and transient conditions.
  • Industrial Temperature Grade: Specified −40 °C to 85 °C for reliable operation in demanding environments.
  • Robust Feature Set: Hardware data protection, automatic program/erase control, cache/program/read, two-plane and copy-back operations simplify controller design and improve throughput.
  • JEDEC Qualification: Industry-standard qualification helps streamline validation and deployment in production designs.

Why Choose F59L4G81KSA-25TIG2N?

The F59L4G81KSA-25TIG2N positions itself as a dependable SLC NAND solution for designs that require sustained endurance, long data retention and industrial temperature capability. Its stacked-die architecture, matched page/data registers and comprehensive NAND command feature set enable efficient data transfer and in-system management for embedded storage, firmware and imaging applications.

This device is well suited to engineers and procurement teams building industrial and embedded products that need JEDEC-qualified, SLC NAND storage with clear endurance and retention specifications, flexible parallel interfacing, and a compact TSOPI-48 package for surface-mount assembly.

Request a quote or submit an inquiry to receive pricing, availability and technical support for the F59L4G81KSA-25TIG2N. Our team can provide ordering details, lead-time information and application guidance to help you integrate this industrial SLC NAND device into your designs.

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